High performance surface mount electrical interconnect

• US 9,093,767 B2
• Filed: 11/29/2011
• Issued: 07/28/2015
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): Harvey, James
• Application Number:
  US13/879,883
• Publication Number:
  US 20130244490A1
• Time in Patent Office: 1,337 Days
• Field of Search: 439/66, 439/73, 439/74
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01R 12/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures printed connections to, or between, printed circuits H05K1/11
• CPC Class Codes: H01R 12/73 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/82 connected with low or zero insertion force
• CPC Class Codes: H01R 13/2457 consisting of at least two resilient arms contacting the same counterpart
• CPC Class Codes: H01R 13/2485 for contacting a ball
• CPC Class Codes: H01R 31/06 Intermediate parts for linking two coupling parts, e.g. adapter with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0397 : Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/048 : Second PCB mounted on first PCB by inserting in window or holes of the first PCB
• CPC Class Codes: H05K 2201/09381 : Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component notches in edge pads H05K2201/09181
• CPC Class Codes: H05K 2201/09545 : Plated through-holes or blind vias without lands
• CPC Class Codes: H05K 2201/09563 : Metal filled via plated through-hole filled with insulating material H05K2201/0959
• CPC Class Codes: H05K 2201/09854 : Hole or via having special cross-section, e.g. elliptical
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10386 : Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/2072 : Anchoring, i.e. one structure gripping into another providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 2201/209 : Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436
• CPC Class Codes: H05K 2203/1476 : Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/0094 : Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/10 : in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/1291 : Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/363 : by soldering
• CPC Class Codes: H05K 3/365 : by abutting, i.e. without alloying process
• CPC Class Codes: H05K 3/4007 : Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 3/425 : characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
• CPC Class Codes: H05K 3/4694 : Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density H05K3/4691 takes precedence
• CPC Class Codes: H05K 7/1076 : co-operating by sliding
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Claims

1. A surface mount electrical interconnect adapted to provide an interface between a first set of solder balls on a BGA device and a PCB, the electrical interconnect comprising:

a socket substrate comprising a first surface, a second surface, and a plurality of openings sized and configured to receive the first set of solder balls on the BGA device;

a plurality of electrically conductive contact tabs bonded to the first surface of the socket substrate so that contact tips on the conductive contact tabs extend into the openings, the contact tips electrically coupling with the BGA device when the first set of solder balls are positioned in the openings, the contact tips engaging the first set of solder balls near upper radii thereof proximate a second interface of the first set of solder balls with the BGA device to mechanically secure the first set of solder balls in the openings;

a dielectric film layer attached to the first surface of the socket substrate, the dielectric film layer comprising tabs that extend into the openings and engage with the upper radii when the first set of solder balls are positioned in the openings;

vias located in the openings that electrically couple the conductive contact tabs to contact pads located proximate the second surface of the socket substrate; and

a second set of solder balls bonded to the contact pads that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

2. The electrical interconnect of claim 1 wherein the dielectric film layer mechanically supports the conductive contact tabs.

3. The electrical interconnect of claim 1 wherein the dielectric film layer biases the first set of solder balls toward the conductive contact tips.

4. The electrical interconnect of claim 1 wherein the tabs on the dielectric film layer centers the first set of solder balls in the openings.

6. The electrical interconnect of claim 1 comprising a plurality of conductive contact tabs electrically and mechanically coupled to the vias and extending into the openings in a spaced configuration.

7. The electrical interconnect of claim 6 wherein the plurality of conductive contact tabs are arranged to simultaneously engage a top portion, a center diameter and a lower portion of the first set of solder balls on the BGA device.

8. The electrical interconnect of claim 6 wherein the conductive contact tabs comprise a planar structure folded to fit in the openings and to form the plurality of conductive contact tabs.

9. The electrical interconnect of claim 1 wherein the conductive contact tabs comprises a pair of opposing spring arms adapted to flex outward during insertion of the first set of solder balls on the BGA device into the openings.

10. The electrical interconnect of claim 1 comprising:

at least one dielectric layer printed on one of the first or second surfaces of the socket substrate, the dielectric layer comprising a plurality recesses; and

a conductive material deposited in at least a portion of the recesses comprising circuit geometry electrically coupling at least two of the conductive contact tabs.

11. The electrical interconnect of claim 1 comprising a force biasing the upper radii of the first solder balls into engagement with the contact tip of the conductive contact tabs.

12. The electrical interconnect of claim 10 wherein dielectric layers comprise at least one additional circuitry plane selected from one of a ground plane, a power plane, an electrical connection to other circuit members, a dielectric layer, or a flexible circuit.

13. The electrical interconnect of claim 1 comprising at least one printed electrical device located on the socket substrate and electrically coupled to at least a one of the conductive contact tabs.

14. The electrical interconnect of claim 13 wherein the electrical device is selected from one of shielding, near device decoupling, capacitors, transistors, resistors, filters, signal or power altering and enhancing devices, memory devices, embedded IC devices, RF antennae, and the like.

15. The electrical interconnect of claim 1 comprising:

at least one dielectric layer printed on one of the first or second surfaces of the socket substrate, the dielectric layer comprising a plurality recesses; and

an optical quality material deposited in recesses.

16. An electrical interconnect assembly comprising:

a housing that retains the electrical interconnect of claim 1;

a BGA device with first set of solder balls located in the openings in the socket substrate and electrically coupled to the contact tips of the conductive contact tabs; and

a PCB soldered to the contact pads located at the second surface of the socket substrate.

5. A method of making a surface mount electrical interconnect adapted to provide an interface between a first set of solder balls on a BGA device and a PCB, the method comprising the steps of:

forming a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the first set of solder balls on the BGA device;

bonding a plurality of electrically conductive contact tabs to the first surface of the socket substrate so that at least one contact tip of the conductive contact tabs extends into the openings, the contact tips electrically coupling with the BGA device when the first set of solder balls are positioned in the openings;

attaching a dielectric film layer to the first surface of the socket substrate, the dielectric film layer comprising tabs that extend into the openings;

inserting the first set of solder balls into the openings so the contact tips and the tabs on the dielectric film layer engage the first set of solder balls near upper radii thereof proximate a second interface of the first set of solder balls with the BGA device to mechanically secure the first set of solder balls in the openings;

forming vias in the openings that electrically couple the conductive contact tabs to contact pads located proximate the second surface of the socket substrate; and

attaching a second set of solder balls to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

17. The method of claim 5 comprising:

printing at least one dielectric layer on one of the first or second surfaces of the socket substrate, the dielectric layer comprising a plurality recesses; and

printing a conductive material in at least a portion of the recesses comprising circuit geometry electrically coupling at least two of the conductive contact tabs.

18. The method of claim 5 comprising mechanically supporting the conductive contact tabs with the dielectric film layer.

19. The method of claim 5 comprising biasing with the dielectric layer the first set of solder balls toward the conductive contact tips.

20. The method of claim 5 comprising centering the first set of solder balls in the openings with the tabs on the dielectric film layer.

21. The method of claim 17 applying a force that biases the upper radii of the first solder balls into engagement with the contact tip of the conductive contact tabs.

22. The method of claim 5 comprising locating a plurality of conductive contact tabs in the openings that are electrically and mechanically coupled to the vias, and that extend into the openings in a spaced configuration.

23. The method of claim 22 comprising arranging the plurality of conductive contact tabs to simultaneously engage a top portion, a center diameter and a lower portion of the first set of solder balls on the BGA device.

24. The method of claim 22 comprising the steps of:

forming the conductive contact tabs as a planar structure; and

folding the conductive contact tabs to fit in the openings to form the plurality of conductive contact tabs.

25. The method of claim 5 comprising the steps of:

forming the conductive contact tabs with a pair of opposing spring arms; and

flexing outward the spring arms during insertion of the first set of solder balls on the BGA device into the openings.