Electromagnetic interference filter for implanted electronics

• US 9,093,974 B2
• Filed: 08/29/2013
• Issued: 07/28/2015
• Est. Priority Date: 09/05/2012
• Status: Active Grant

• Current Assignee: Kyocera AVX Components Corporation (Kyocera Corporation)
• Original Assignee: AVX Corporation (Kyocera Corporation)
• Inventors: Ritter, Andrew P., Panlener, Richard J., Eldawoudy, Sam, Van Alstine, Kimberly
• Primary Examiner(s): Tra, Quan
• Application Number:
  US14/013,307
• Publication Number:
  US 20140062618A1
• Time in Patent Office: 698 Days
• Field of Search: 361/301.1, 361/302, 333/182, 333/185
• US Class Current: 1/1
• CPC Class Codes: H01B 5/02 Single bars, rods, wires, or strips
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters
• CPC Class Codes: H03H 2001/0042 Wound, ring or feed-through type capacitor
• CPC Class Codes: H03H 2001/0085 Multilayer, e.g. LTCC, HTCC, green sheets
• CPC Class Codes: H03H 7/0138 Electrical filters or coupling circuits
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062

Abstract

An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.

Claims

1. An electromagnetic interference (EMI) filter, comprising:

a plurality of signal electrodes arranged in a respective plurality of arrays, with each signal electrode extending vertically between respective top and bottom surfaces of the filter such that the signal electrodes are flush with such top and bottom surfaces, and configured to be coupled on said top surface of the filter to internal conductors of an implantable medical device and coupled on said bottom surface of the filter to external lead wires implanted within a body in which such medical device is implanted;

a plurality of ground electrodes arranged in parallel and interposed between the signal electrodes, such ground electrodes grounded at least one of internally and externally;

dielectric material disposed between the signal electrodes and ground electrodes to act as insulator material between adjacent electrodes, and to define a filter body having a length along a longitudinal axis thereof, a thickness between the top and bottom surfaces thereof, and a width in the axis perpendicular to such longitudinal axis and the thickness; and

metallization applied to selected regions on the top and bottom surfaces of the filter to connect respective arrays of signal electrodes and provide an interconnection surface for electrically attaching the filter to other components;

wherein said signal electrodes each have a length dimension along the longitudinal axis of the filter which is less than one-half of the length of the filter along the longitudinal axis thereof, and said ground electrodes each have a length dimension along the longitudinal axis of the filter which is more than one-half of the length of the filter along the longitudinal axis thereof, and wherein the filter acts as a shielding element to prevent unwanted electromagnetic interference with the input and output of an associated implanted medical device.

2. An electromagnetic interference filter as in claim 1, further including:

a passivation layer on at least one of a top and bottom surface of the electromagnetic interference filter to prevent arcing between the plurality of signal electrode arrays.

3. An electromagnetic interference filter as claim 1, further including ground terminators applied to selected regions on at least one of the top, bottom and side surfaces of the EMI filter so as to connect pluralities of ground electrodes and provide an interconnection surface for electrically attaching ground to such filter.

4. An electromagnetic interference filter as in claim 3, wherein the ground electrodes are grounded internally by being exposed and connected at least one location on the top and bottom surfaces of the filter.

5. An electromagnetic interference filter as in claim 3, wherein the ground electrodes are grounded externally by being exposed and connected at a location on a side surface of the filter.

6. An electromagnetic interference filter as in claim 3, wherein the ground electrodes are grounded both internally and externally.

7. An electromagnetic interference filter as in claim 1, wherein the filter is substantially monolithic.

8. An electromagnetic interference filter as in claim 1, wherein:

each array includes a plurality of such signal electrodes arranged in parallel in a relatively densely packed configuration such that current conductivity capability is between such filter top surface and such filter bottom surface.

9. An electromagnetic interference filter as in claim 1, wherein the signal electrodes have a preselected configuration and arrangement relative to the ground electrodes so as provide selected conductivity of an electrical signal applied to the signal electrodes or ground electrodes, and to form selected capacitance between the signal and ground electrodes, for shunting unwanted high frequency interference away from the signal electrodes.

10. An electromagnetic interference filter as in claim 1, wherein the metallization comprises termination surfaces coupled to the signal electrode arrays.

11. An electromagnetic interference filter as in claim 10, wherein the ground termination surfaces comprise one of a plate and connector couplers.

12. An electromagnetic interference filter as in claim 3, wherein the ground terminations comprise one of thin-film metallization and thick-film metallization.

13. An electromagnetic interference filter as in claim 1, wherein:

each ground electrode is arranged in a vertical configuration such that each ground electrode is flush with a top surface and a bottom surface of the filter, and wherein each ground electrode further includes protrusions that are exposed on at least one of the top and bottom surfaces in regions distinct from the signal electrodes; and

the filter further includes a termination surface coupled to the ground electrode protrusions so that the ground electrodes are grounded internally.

14. An electromagnetic interference filter as in claim 13, wherein one end of the ground electrodes is flush with a side surface of the filter, and another termination surface is coupled to the ground electrodes at such side surface so that the ground electrodes are also grounded externally.

15. An electromagnetic interference filter as in claim 2, further including:

a solder ball connection coupled through the passivation layer to couple a conductive element with the filter.

16. An electromagnetic interference filter as in claim 1, wherein said plurality of arrays of signal electrodes each have a surface area less than the width of the filter and having an alternating arrangement.

17. An electromagnetic interference filter as in claim 1, wherein:

said metallization provides an interconnection surface for electrically attaching the filter to other components; and

wherein such interconnection surface includes connection made thereto including at least one of a wire bonding, a ball-grid array coupling, a solder connection, and a castellation coupling.

21. An electromagnetic interference (EMI) filter as in claim 1, further including in combination therewith:

a canister with a bushing for enclosing at least one end of such canister;

a plurality of external connection wires passing through the bushing and coupling with an upper termination area of said EMI filter, and for connection with external circuitry of an associated implantable medical device; and

a plurality of internal connection wires coupling with a bottom termination area of said EMI filter, and for connection with internal circuitry of an associated implantable medical device.

22. An EMI filter as in claim 21, further including bonding material securing the external connections wires in the bushing.

18. Methodology for use of an electromagnetic interference (EMI) filter with an implantable medical device, comprising the steps of:

providing a plurality of signal electrodes for an EMI filter, arranged in a respective plurality of arrays, with each signal electrode extending vertically between respective top and bottom surfaces of the filter such that the signal electrodes are flush with such top and bottom surfaces, and configured to be coupled on the top surface of the filter to internal conductors of an implantable medical device and coupled on the bottom surface of the filter to external lead wires implanted within a body in which such medical device is implanted;

providing a plurality of ground electrodes arranged in parallel and interposed between the signal electrodes, and extending through the filter between the top and bottom surfaces thereof, for grounding connections on such surfaces;

applying metallization to selected regions on the top and bottom surfaces of the filter to connect respective arrays of signal electrodes and provide an interconnection surface for electrically attaching the filter to other components; and

disposing dielectric material between the signal electrodes and ground electrodes to act as insulator material between adjacent electrodes, and so as to collectively form with the electrodes and dielectric material a filter which acts as a shielding element to prevent unwanted electromagnetic interference with the input and output of an associated implanted medical device;

and wherein providing the signal electrodes includes providing each of said signal electrodes with a length dimension along the longitudinal axis of the filter which is less than one-half of the length of the filter along the longitudinal axis thereof, and

wherein providing the ground electrodes includes providing each of said ground electrodes with a length dimension along the longitudinal axis of the filter which is more than one-half of the length of the filter along the longitudinal axis thereof.

19. Methodology as in claim 18, further including:

forming a passivation layer on at least one of a top and bottom surface of the electromagnetic interference filter to prevent arcing between the plurality of signal electrode arrays; and

grounding such ground electrodes internally and externally.

20. Methodology as in claim 18, further including:

applying metallization to selected regions on at least one of the top, bottom and side surfaces of the filter to form an interconnection surface; and

using such interconnection surface to electrically connect selected pluralities of electrodes of the filter to other components, wherein such connections are made using at least one of wire bonding, ball-grid array coupling, soldering, and castellation coupling.