Methods for plasma processing

• US 9,096,933 B2
• Filed: 04/15/2014
• Issued: 08/04/2015
• Est. Priority Date: 07/08/2009
• Status: Active Grant

• Current Assignee: Aixtron AG
• Original Assignee: Aixtron Inc. (Aixtron AG)
• Inventors: Savas, Stephen E., Galewski, Carl, Wiesnoski, Allan B., Mantripragada, Sai, Joh, Sooyun
• Primary Examiner(s): MILLER, JR, JOSEPH ALBERT
• Application Number:
  US14/253,206
• Publication Number:
  US 20140220262A1
• Time in Patent Office: 476 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: C23C 16/24 Deposition of silicon only
• CPC Class Codes: C23C 16/26 Deposition of carbon only
• CPC Class Codes: C23C 16/345 Silicon nitride
• CPC Class Codes: C23C 16/40 Oxides
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/407 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 16/4412 Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
• CPC Class Codes: C23C 16/45504 Laminar flow
• CPC Class Codes: C23C 16/45519 Inert gas curtains
• CPC Class Codes: C23C 16/45591 Fixed means, e.g. wings, baffles
• CPC Class Codes: C23C 16/466 using thermal contact gas
• CPC Class Codes: C23C 16/50 using electric discharges generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34
• CPC Class Codes: C23C 16/503 using dc or ac discharges
• CPC Class Codes: C23C 16/505 using radio frequency discharges
• CPC Class Codes: C23C 16/545 for coating elongated substrates
• CPC Class Codes: H01J 37/32036 AC powered
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/32541 Shape
• CPC Class Codes: H01L 21/67069 : for drying etching

Abstract

Apparatus and method for plasma-based processing well suited for deposition, etching, or treatment of semiconductor, conductor or insulating films. Plasma generating units include one or more elongated electrodes on the processing side of a substrate and a neutral electrode proximate the opposite side of the substrate. Gases may be injected proximate a powered electrode which break down electrically and produce activated species that flow toward the substrate area. This gas then flows into an extended process region between powered electrodes and substrate, providing controlled and continuous reactivity with the substrate at high rates with efficient utilization of reactant feedstock. Gases are exhausted via passages between powered electrodes or electrode and divider.

Claims

1. A method for plasma-based deposition of thin films on a substrate, said method comprising:

providing a chamber, connecting it to a vacuum pump and maintaining a gas pressure in a range of 50 Pascals to 2000 Pascals in said chamber;

positioning a plurality of electrodes within said chamber whose lengths are greater than their width or height, so that a first gap is formed between at least two said electrodes; and

positioning a support for substrates so that said electrodes have a front side facing said support, the lengths extending parallel to a plane defined by said support;

placing a substrate on said support such that a side of said substrate to be coated faces said electrodes, and such that the minimum gap between a said electrode and said supported substrate on said support is less than the electrode width and less than four times the minimum size of said first gap;

maintaining said substrate at a temperature less than 200°

C.;

injecting a first gas into said first gap between opposing faces of said electrodes to flow towards said substrate;

providing AC power to at least one of said electrodes to form a plasma by activating said first gas in the space between said electrodes and forming a plasma between said electrode and substrate providing ion bombardment of said substrate;

injecting a second gas from within at least one of said electrodes into said flowing activated first gas to form a mixed gas; and

wherein said mixed gas flows adjacent said front side of said electrode without recirculation to deposit said thin film on said substrate and then flows to an exhaust.

2. The method of claim 1 wherein said AC power is one of:

RF power and VHF power.

3. The method of claim 1 wherein said electrode length is greater than four times the electrode width or electrode height.

4. The method of claim 1 wherein said minimum gap between at least one of said electrodes and said substrate on said support structure is less than the width or less than the height of the said electrode.

5. The method of claim 1 wherein said inter-electrode gap is between 5 mm and 20 mm.

6. The method of claim 1 wherein the flow of said mixed gas is non-recirculating.

7. The method of claim 1 wherein the flow of said mixed gas is adjacent a second side of at least one electrode to said exhaust.

8. The method of claim 1 wherein the flow of said mixed gas is around at least one of said electrodes to an exhaust.

9. The method of claim 1 wherein a first power density in said inter-electrode gap is higher than a second power density to between said electrode and said substrate;

and

wherein a power ratio between said first power density and said second power density is less than a factor of 10.

10. The method of claim 9 wherein said power ratio is less than a factor of 5.

11. The method of claim 1 wherein said first gas comprises a compound of at least one of nitrogen or oxygen;

and

wherein said second gas contains a silicon compound to form a film with said first gas that contains silicon oxynitride or silicon nitride.

12. The method of claim 1 wherein a dielectric film is deposited on said substrate.

13. The method of claim 1 wherein a transparent, metal-containing, electrically conducting film is deposited on said substrate.

14. A method for plasma-based film deposition of silicon-based materials on a substrate, said method comprising:

providing a chamber, connecting it to a vacuum pump and maintaining a gas pressure of less than 2,000 Pascals in said chamber;

positioning at least one electrode and a support structure for substrates within said chamber;

said electrode having a front side facing said support structure for said substrates;

placing said substrate on said support structure such that the surface of said substrate to be coated faces said front surface of said electrode and forms a volume between said surfaces wherein the minimum gap between said surfaces is less than the electrode width, the widths extending parallel to a plane defined by said support;

maintaining said substrate at a temperature under 200 degrees Celsius;

injecting a first reactant gas containing a non-silicon-based compound that flows toward said substrate adjacent a surface of said electrode other than the front side;

providing AC power to said electrode to form a first plasma activating said first gas adjacent said surface other than front surface, and further, forming a plasma between the front side of said electrode and said substrate providing ion bombardment of said substrate;

injecting a second gas into said flowing activated first gas to form a mixed gas, said second gas comprising a silicon-containing compound, and depositing a silicon-based thin film upon the substrate; and

wherein said mixed gas flows adjacent said front side of said electrode without recirculation flow, and then to an exhaust.

15. The method of claim 14 wherein said AC power is one of radiofrequency (RF) or very high frequency (VHF) power.

16. The method of claim 14 wherein said gap between said first side of said electrode and said substrate is between 5 mm and 20 mm.

17. The method of claim 14 wherein the flow of said mixed gas is around said electrode to an exhaust.

18. The method of claim 14 wherein said first gas is activated by plasma prior to injection into said chamber.

19. The method of claim 14 wherein said first gas comprises a compound of at least one of nitrogen or oxygen;

and

wherein said second gas contains a silicon compound to form a film with said first gas that contains silicon oxynitride or silicon nitride.

20. The method of claim 14 wherein a dielectric film is deposited on said substrate.

21. The method of claim 14 wherein a transparent, metal-containing, electrically conducting film is deposited on said substrate.