LED based lamp assembly

• US 9,097,393 B2
• Filed: 08/31/2012
• Issued: 08/04/2015
• Est. Priority Date: 08/31/2012
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Huang, Yaote
• Primary Examiner(s): Lee, Y M
• Application Number:
  US13/601,166
• Publication Number:
  US 20140063809A1
• Time in Patent Office: 1,068 Days
• Field of Search: 362/218, 362/294, 362/373
• US Class Current: 1/1
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 17/164 the parts being subjected to bending, e.g. snap joints
• CPC Class Codes: F21V 19/0035 the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21V 7/0091 using total internal reflection
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

An LED device such as a lamp or light comprises an LED for emitting light and electronics for powering the LED. An enclosure retains at least a portion of the electronics. A heat sink for dissipating heat from the LED assembly is provided where a portion of the heat sink clamps the enclosure to secure the heat sink structure to the enclosure.

Claims

1. An LED device comprising:

an LED for emitting light, and electronics for powering the LED;

an enclosure for retaining at least a portion of the electronics and a flange formed on the enclosure;

a heat sink for dissipating heat from the LED, the heat sink comprising a wall having an end that abuts a first face of the flange and a portion that extends over the flange and is permanently bent to engage a second face of the flange such that the flange is between the end of the wall of the heat sink and the portion of the heat sink to secure the heat sink structure to the enclosure.

2. The LED device of claim 1 wherein a lens is supported on the heat sink to receive the light.

3. The LED device of claim 1 wherein the flange extends outwardly from a wall of the enclosure.

4. The LED device of claim 3 wherein the wall of the enclosure engages the wall of the heat sink.

5. The LED device of claim 3 wherein the portion of the heat sink engages a first surface of the flange, the first surface of the flange extending at an oblique angle relative to the wall of the enclosure.

6. The LED device of claim 5 wherein the wall of the heat sink abuts a second surface of the flange.

7. The LED device of claim 1 wherein the heat sink comprises fins, the portion of the heat sink being formed by a first end of the fins.

8. The LED device of claim 7 wherein the flange is formed on a wall of the enclosure, a first surface of the flange extending at an oblique angle relative to the wall and the fins engaging the surface of the flange.

9. The LED device of claim 7 wherein the fins define a cavity for receiving the LED.

10. The LED device of claim 9 wherein a lens is retained in the cavity by a retaining member that is connected to the fins.

11. A method of making a lamp comprising:

providing an LED for emitting light,

supporting the LED on a heat sink;

providing electronics for powering the LED;

supporting at least a portion of the electronics in an enclosure;

mounting the heat sink on the enclosure; and

permanently deforming a portion of the heat sink after the heat sink is mounted on the enclosure to clamp the enclosure to secure the heat sink to the enclosure.

12. The method of claim 11 wherein the step of deforming comprises bending the portion of the heat sink into engagement with a portion of the enclosure.

13. The method of claim 12 wherein the portion of the enclosure comprises a flange formed on an outer surface of the enclosure, the portion of the heat sink engaging the flange.

14. The method of claim 11 wherein the step of deforming comprises bending a plurality of fins of the heat sink into engagement with the enclosure.

15. The method of claim 11 wherein the step of deforming comprises bending a plurality of fins of the heat sink into engagement with the enclosure in a single operation.

16. The method of claim 11 wherein the step of deforming comprises bending a plurality of fins of the heat sink into engagement with the enclosure using a press jig.

17. The method of claim 11 further comprising securing an electrical connector to the enclosure.

18. An LED device comprising:

an LED for emitting light, and electronics for powering the LED;

an enclosure for retaining at least a portion of the electronics;

a heat sink for dissipating heat from the LED comprising a first portion for engaging the enclosure and a second portion permanently bent to engage a flange formed on the enclosure such that the enclosure is clamped between the first portion and the second portion to secure the heat sink to the enclosure.

19. The LED device of claim 18 wherein the flange extends from a wall of the enclosure.

20. The LED device of claim 18 wherein the first portion of the heat sink abuts the flange.

21. The LED device of claim 18 wherein the second portion of the heat sink comprises fins, the fins clamping the enclosure to secure the heat sink structure to the enclosure.

22. The LED device of claim 21 wherein the fins define a cavity for receiving the LED.