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Direct connect single layer touch panel

  • US 9,098,159 B2
  • Filed: 02/03/2014
  • Issued: 08/04/2015
  • Est. Priority Date: 06/19/2009
  • Status: Active Grant
First Claim
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1. An apparatus, comprising:

  • a connecting board including a plurality of pads, the connecting board configured to be electrically coupled to a first substrate at the plurality of pads, the connecting board comprising a second substrate, different from the first substrate; and

    routing formed on the connecting board and coupled to the pads, the routing arranged to electrically connect each of a plurality of discrete sensor elements in a row of the first substrate to one another while providing electrical isolation from sensor elements and traces associated with other rows.

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