Substrate cleaning apparatus and substrate cleaning method

• US 9,099,298 B2
• Filed: 09/14/2012
• Issued: 08/04/2015
• Est. Priority Date: 03/18/2010
• Status: Active Grant

• Current Assignee: Iwatani Corporation, Tokyo Electron Limited
• Original Assignee: Iwatani Corporation, Tokyo Electron Limited
• Inventors: Dobashi, Kazuya, Fuse, Takashi
• Primary Examiner(s): Barr, Michael
• Assistant Examiner(s): Riggleman, Jason
• Application Number:
  US13/617,530
• Publication Number:
  US 20130008470A1
• Time in Patent Office: 1,054 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/0206 during, before or after processing of insulating layers
• CPC Class Codes: H01L 21/31133 by chemical means
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles

Abstract

A substrate cleaning device is capable of removing more diverse contaminants from substrates than ultra-low temperature aerosol ejection, while avoiding technical problems inherent to wet cleaning, such as micro-roughness, watermarks, loss of substrate material and destruction of the device structure. A substrate cleaning device for cleaning wafers to which cleaning target objects have adhered includes a cluster spraying unit which sprays the wafer with one or more types of clusters formed of cleaning preparation molecules agglomerated together, a suction unit which sucks the cleaning target objects separated by spraying the clusters of the cleaning agent molecules; and a unit for moving the wafer and the cluster spraying unit relative to the one another along the surface of the wafer W to which the cleaning target objects have adhered.

Claims

1. A substrate cleaning apparatus for cleaning a substrate to which cleaning target objects have adhered, comprising:

a cluster spraying unit for spraying the substrate with one or more types of clusters formed of cleaning agent molecules agglomerated together;

a suction unit for sucking cleaning target objects separated by spraying the clusters of the cleaning agent molecules;

a unit for relatively moving the substrate and the cluster spraying unit along a surface of the substrate to which the cleaning target objects have adhered;

a suction pump connected to the suction unit;

a container for accommodating the substrate;

a vacuum pump for decreasing a pressure in the container; and

cleaning agent accommodating units which accommodate cleaning agents,

wherein the cluster spraying unit includes supply lines for supplying the cleaning agents from the cleaning agent accommodating units and a plurality of nozzles for spraying the cleaning agents supplied through the supply lines,

wherein each of the cleaning agent accommodating units is connected to one of the nozzles through one of the supply lines in a one to one corresponding manner,

wherein the nozzles are installed side by side,

wherein the suction unit includes a suction line connected to the suction pump and a plurality of suction members connected to the suction pump via the suction line, each of the suction members being provided correspondingly to each of the nozzles, and

wherein the supply lines are separated from the suction line.

2. The substrate cleaning apparatus of claim 1, further comprising:

a unit for ejecting onto the substrate a transfer gas for transferring the cleaning target objects separated by spraying the clusters of the cleaning agent molecules to the outside

of the container or toward the suction members.

3. The substrate cleaning apparatus of claim 1, wherein a spraying opening of each of the nozzles has a line-shaped cross section.

4. The substrate cleaning apparatus of claim 1, further comprising a holding member which holds the nozzles such that spraying directions of the cleaning agents are not perpendicular to the substrate.

5. The substrate cleaning apparatus of claim 1, wherein the cleaning agent molecules are selected from the group consisting of an organic solvent, hydrogen fluoride, hydrochloric acid, ozone, ammonia and hydrogen peroxide, water, isopropyl alcohol, nitrogen, and argon.

6. The substrate cleaning apparatus of claim 1, further comprising a first gas exhaust port disposed in the vicinity of the cluster spraying unit;

and a second gas exhaust port at lower portions of sidewalls of the container, wherein the first gas exhaust and second gas exhaust port are connected to the vacuum pump.

7. The substrate cleaning apparatus of claim 2, further comprising

a first gas exhaust port disposed in the vicinity of the cluster spraying unit;

and

a second gas exhaust port at lower portions of sidewalls of the container, wherein the first gas exhaust port and second gas exhaust port are connected to the vacuum pump.

8. The substrate cleaning apparatus of claim 2, further comprising

a gas exhaust port provided at a sidewall of the container and disposed above a table on which the substrate is to be mounted;

and

wherein the unit for ejecting onto the substrate the transfer gas includes a transfer gas ejection port through which the transfer gas is supplied, and the transfer gas ejection port is disposed opposite to the gas exhaust port with the table therebetween such that the transfer gas flows along a surface of the substrate.

9. The substrate cleaning apparatus of claim 1, wherein each of the cleaning agent accommodating units accommodates a different cleaning agent.