Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same
First Claim
1. A method of forming an electrical interposer including a resilient dielectric body that includes an elastomeric layer, the method comprising:
- forming a plurality of interposer conduits on a surface of a substrate;
forming the elastomeric layer on a carrier surface, wherein the elastomeric layer includes an exposed surface;
pressing the exposed surface of the elastomeric layer and the surface of the substrate into contact with one another;
embedding the plurality of interposer conduits in the elastomeric layer, wherein the embedding includes mechanically contacting at least a portion of each of the plurality of interposer conduits with the carrier surface;
separating the carrier surface from the elastomeric layer; and
separating the surface of the substrate from the elastomeric layer while leaving the plurality of interposer conduits embedded within the elastomeric layer.
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Accused Products
Abstract
Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.
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Citations
23 Claims
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1. A method of forming an electrical interposer including a resilient dielectric body that includes an elastomeric layer, the method comprising:
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forming a plurality of interposer conduits on a surface of a substrate; forming the elastomeric layer on a carrier surface, wherein the elastomeric layer includes an exposed surface; pressing the exposed surface of the elastomeric layer and the surface of the substrate into contact with one another; embedding the plurality of interposer conduits in the elastomeric layer, wherein the embedding includes mechanically contacting at least a portion of each of the plurality of interposer conduits with the carrier surface; separating the carrier surface from the elastomeric layer; and separating the surface of the substrate from the elastomeric layer while leaving the plurality of interposer conduits embedded within the elastomeric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of forming an electrical interposer including a resilient dielectric body that includes an elastomeric layer, the method comprising:
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forming a plurality of interposer conduits on a surface of a substrate; applying the elastomeric layer to the surface of the substrate, wherein the applying includes covering the plurality of interposer conduits with the elastomeric layer, and further wherein the elastomeric layer includes an exposed surface; pressing a carrier surface and the exposed surface into contact with one another, wherein the pressing includes mechanically contacting the carrier surface with at least a portion of each of the plurality of interposer conduits; curing the elastomeric layer; separating the carrier surface from the elastomeric layer; and separating the surface of the substrate from the elastomeric layer while leaving the plurality of interposer conduits embedded within the elastomeric layer. - View Dependent Claims (22, 23)
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Specification