Light emitting diode emitter substrate with highly reflective metal bonding

• US 9,099,632 B2
• Filed: 05/21/2012
• Issued: 08/04/2015
• Est. Priority Date: 01/13/2011
• Status: Active Grant

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: TSMC Solid State Lighting Ltd. (Ennostar, Inc.)
• Inventors: Chern, Chyi Shyuan, Fu, Wen-Chien, Hsia, Hsing-Kuo, Yu, Chih-Kuang, Chiu, Ching-Hua, Kuo, Hung-Yi
• Primary Examiner(s): SHINGLETON, MICHAEL B
• Application Number:
  US13/476,167
• Publication Number:
  US 20120228650A1
• Time in Patent Office: 1,170 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2933/0033 : relating to semiconductor body packages
• CPC Class Codes: H01L 33/005 : Processes
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 : the elements conducting electric current to or from the semiconductor body

Abstract

A package structure includes: a substrate having a first side and a second side opposite to the first side; a metal layer disposed over at least a portion of the second side of the substrate; a light-reflective layer disposed over the first side of the substrate; and a photonic device bonded to the light-reflective layer from the first side. A segment of the metal layer extends through the substrate from the first side to the second side, and a portion of the substrate is completely enclosed in a cross-sectional view by the metal layer. The package structure is free of a bonding wire over the second side of the substrate.

Claims

1. A package structure, comprising:

a substrate having a first side and a second side opposite to the first side;

a metal layer disposed over at least a portion of the second side of the substrate, wherein a segment of the metal layer extends through the substrate from the first side to the second side, and wherein a portion of the substrate is completely enclosed in a cross-sectional view by the metal layer;

a light-reflective layer disposed over the first side of the substrate; and

a photonic device bonded to the light-reflective layer from the first side;

wherein the package structure is free of a bonding wire over the second side of the substrate.

2. The package structure of claim 1, wherein a portion of the metal layer is disposed on the first side of the substrate, and wherein the light-reflective layer is disposed on the portion of the metal layer.

3. The package structure of claim 1, wherein the photonic device is bonded to the light-reflective layer through a carrier substrate.

4. The package structure of claim 1, further comprising a dielectric layer disposed between the substrate and the metal layer.

5. The package structure of claim 1, wherein the photonic device includes a light-emitting diode die.

6. The package structure of claim 1, wherein:

the substrate contains silicon;

the metal layer contains copper; and

the light-reflective layer contains aluminum or silver.

7. The package structure of claim 1, further comprising:

an electrode disposed over and electrically coupled to the photonic device;

a phosphor layer disposed over the electrode and at least partially over the photonic device; and

a lens disposed over the substrate, wherein the photonic device is encapsulated by the lens.

8. The package structure of claim 1, wherein:

the light-reflective layer includes a plurality of segments separated by a plurality of openings; and

the photonic device is bonded to a first segment of the plurality of segments of the light-reflective layer.

9. The package structure of claim 8, wherein the photonic device is a first photonic device;

and further comprising;

a second photonic device bonded to a second segment of the plurality of segments of the light-reflective layer.

10. The package structure of claim 9, wherein the first photonic and the second photonic device are electrically coupled together by a bonding wire over the first side of the substrate.

11. A light-emitting diode (LED) packaging structure, comprising:

a substrate having a front side and a back side;

a metal layer that circumferentially surrounds in 360 degrees at least a portion of the substrate in a cross-sectional view;

a plurality of bonding pads disposed over the front side of the substrate, the bonding pads each containing a light-reflective material, wherein the metal layer is disposed between the substrate and the bonding pads;

a plurality of LED dies each bonded to a respective one of the bonding pads;

a plurality of electrodes each disposed on a respective one of the LED dies; and

a plurality of bonding wires electrically coupling the LED dies together, wherein for each bonding wire has one distal end is attached to a respective one of the bonding pads, and another opposite distal end is attached to the electrode of an adjacent LED die.

12. The LED packaging structure of claim 11, wherein the packaging structure is free of bonding wires on the back side.

13. The LED packaging structure of claim 11, further comprising a plurality of lenses disposed over the front side of the substrate, wherein each lens covers a respective one of the LED dies.

14. The LED packaging structure of claim 11, further comprising a plurality of conductive through-silicon-via (TSV) features extending through the substrate from the front side to the back side, wherein each of the TSV features is electrically coupled to a respective one of the bonding pads.

15. A light-emitting diode (LED) packaging structure, comprising:

a packaging substrate having a front surface and a back surface;

a metal element that completely surrounds a segment of the packaging substrate, wherein the metal element includes a plurality of conductive through-silicon-via (TSV) features extending through the packaging substrate from the front surface to the back surface;

a first reflective pad and a second reflective pad each located over the front surface of the packaging substrate, wherein the first and second reflective pads are configured to reflect radiation and are physically separated from each other;

a first LED die and a second LED die bonded to the first reflective pad and the second reflective pad, respectively; and

a bonding wire having first and second opposite ends, wherein the first end is bonded to the first reflective pad, and the second end is bonded to the second LED die.

16. The LED packaging structure of claim 15, further comprising:

a first electrode located on the first LED die;

a second electrode located on the second LED die; and

the second end of the bonding wire is bonded to the second electrode.

17. The LED packaging structure of claim 15, further comprising:

a first lens and a second lens located over the first LED die and the second LED die, respectively.

18. The LED packaging structure of claim 15, wherein the first and second LED dies are bonded to the first reflective pad and the second reflective pad through respective carrier substrates.

19. The LED packaging structure of claim 15, wherein:

the TSV features divide the packaging substrate into a plurality of substrate segments; and

each substrate segment is surrounded by a respective dielectric layer.

20. The LED packaging structure of claim 19, wherein the dielectric layer is disposed within the metal element.