Semiconductor devices and methods of forming thereof

• US 9,102,519 B2
• Filed: 03/14/2013
• Issued: 08/11/2015
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Dehe, Alfons, Ahrens, Carsten, Barzen, Stefan, Friza, Wolfgang
• Primary Examiner(s): HA, NATHAN W
• Application Number:
  US13/804,934
• Publication Number:
  US 20140264651A1
• Time in Patent Office: 880 Days
• Field of Search: 257414-416, 438 52- 53
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81B 3/0027 Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: B81C 1/00182 Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
• CPC Class Codes: B81C 1/00404 Mask characterised by its size, orientation or shape
• CPC Class Codes: B81C 1/00984 Methods for avoiding stiction when the device is in use not provided for in groups B81C1/00968 - B81C1/00976
• CPC Class Codes: B81C 2201/017 Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169
• CPC Class Codes: B81C 2201/115 Roughening a surface

Abstract

In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface. A membrane is formed over the sacrificial layer. A through hole is etched through the workpiece from the second surface to expose a surface of the sacrificial layer. At least a portion of the sacrificial layer is removed from the second surface to form a cavity under the membrane. The cavity is aligned with the membrane.

Claims

1. A method of forming a semiconductor device, the method comprising:

forming a sacrificial layer in and over a first surface of a workpiece having the first surface and an opposite second surface by a local oxidation process, the sacrificial layer extending into the workpiece;

forming a membrane over the sacrificial layer;

forming a through hole through the workpiece from the second surface to expose a surface of the sacrificial layer; and

removing at least a portion of the sacrificial layer from the second surface to form a cavity under the membrane, wherein the removing of at least the portion of the sacrificial layer removes all of the sacrificial layer extending into the workpiece, wherein the cavity is aligned with the membrane.

2. The method of claim 1, wherein an inner sidewall of the membrane faces an outer sidewall of the sacrificial layer.

3. The method of claim 1, further comprising patterning the sacrificial layer.

4. The method of claim 3, wherein forming the patterned sacrificial layer comprises:

exposing a region of the first surface of the workpiece using a hard mask; and

forming an oxide layer by oxidizing the exposed region.

5. The method of claim 3, wherein forming the patterned sacrificial layer comprises:

exposing a plurality of regions of the first surface of the workpiece using a hard mask; and

forming a plurality of oxide regions by oxidizing the exposed plurality of regions.

6. A method of forming a semiconductor device, the method comprising:

forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface,

patterning the sacrificial layer, wherein forming the patterned sacrificial layer comprises;

forming a plurality of trenches in the workpiece from the first surface, the plurality of trenches being separated by a plurality of workpiece regions so that each of the plurality of trenches is separated from an adjacent trench by a workpiece region of the plurality of workpiece regions;

filling the plurality of trenches with a fill material;

overfilling the fill material above the first surface; and

patterning the fill material over the first surface;

forming a membrane over the sacrificial layer;

forming a through hole through the workpiece from the second surface to expose a surface of the sacrificial layer;

removing at least a portion of the sacrificial layer from the second surface to form a cavity under the membrane, wherein the cavity is aligned with the membrane; and

removing the plurality of workpiece regions between the plurality of trenches to form a continuous second cavity under the cavity aligned with the membrane.

7. The method of claim 6, wherein the plurality of trenches comprises a matrix of trenches, each trench in the matrix arranged next to each other.

8. The method of claim 6, wherein the plurality of trenches comprises concentric trenches.

9. The method of claim 6, wherein the plurality of trenches comprises:

a matrix of trenches, each trench in the matrix arranged next to each other; and

a trench arranged around the matrix of trenches.

10. The method of claim 6, wherein etching a through hole through the workpiece comprises:

etching the workpiece from the second surface to expose a surface of the plurality of trenches;

forming a plurality of pillars by etching the fill material in the plurality of trenches from the second surface; and

etching the plurality of pillars from the second surface.

11. The method of claim 6, wherein etching a through hole through the workpiece comprises:

etching the workpiece from the second surface to expose a surface of the plurality of trenches;

removing a material of the workpiece between the plurality of trenches from the second surface; and

etching the fill material in the plurality of trenches from the second surface.

12. A method of forming a semiconductor device, the method comprising:

forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface, wherein forming the sacrificial layer comprises;

forming a first plurality of trenches in the workpiece from the first surface;

filling the first plurality of trenches with a first dielectric layer, the first dielectric layer sealing each of the first plurality of trenches to form a first plurality of buried cavities;

forming a second plurality of trenches in the workpiece from the first surface, wherein each trench of second plurality of trenches is disposed between adjacent trenches of the first plurality of trenches;

filling the second plurality of trenches with a second dielectric layer, the second dielectric layer sealing each of the second plurality of trenches to form a second plurality of buried cavities; and

planarizing a top surface of the second dielectric layer over the first surface of the workpiece;

patterning the sacrificial layer;

forming a membrane over the sacrificial layer;

forming a through hole through the workpiece from the second surface to expose a surface of the sacrificial layer; and

removing at least a portion of the sacrificial layer from the second surface to form a cavity under the membrane, wherein the cavity is aligned with the membrane.

13. The method of claim 12, wherein the first plurality of trenches comprises a first matrix of trenches, each trench in the first matrix arranged next to each other, wherein the second plurality of trenches comprises a second matrix of trenches, each trench in the second matrix arranged next to each other.

14. The method of claim 13, wherein the second matrix is staggered relative to the first matrix.

15. The method of claim 12, wherein the first plurality of trenches comprises first concentric trenches, wherein the second plurality of trenches comprises second concentric trenches.

16. The method of claim 12, wherein etching a through hole through the workpiece from the second surface comprises:

etching a first hole through the workpiece, the first hole exposing a bottom surface of the first dielectric layer in the first plurality of trenches and a bottom surface of the second dielectric layer in the second plurality of trenches; and

etching the first dielectric layer in the first plurality of trenches and the second dielectric layer in the second plurality of trenches.

17. A method of forming a semiconductor device, the method comprising:

from a first surface of a workpiece having the first surface and an opposite second surface forming a plurality of trenches comprising a fill material in the workpiece, the plurality of trenches being separated by a plurality of workpiece regions so that each of the plurality of trenches is separated from an adjacent trench by a workpiece region of the plurality of workpiece regions;

forming a first sacrificial layer over the plurality of trenches;

forming a membrane over the first sacrificial layer;

from the second surface removing the fill material from the plurality of trenches to expose a surface of the first sacrificial layer;

removing the plurality of workpiece regions between the plurality of trenches to form a continuous cavity; and

removing at least a portion of the first sacrificial layer.

18. The method of claim 17, further comprising:

forming a second sacrificial layer over the membrane, wherein releasing the membrane comprises removing at least a portion of the second sacrificial layer.

19. The method of claim 17, wherein the plurality of trenches comprises a matrix of trenches, each trench in the matrix arranged next to each other.

20. The method of claim 17, wherein the plurality of trenches comprises concentric trenches.

21. The method of claim 17, wherein the plurality of trenches comprises:

a matrix of trenches, each trench in the matrix arranged next to each other; and

a trench arranged around the matrix of trenches.

22. The method of claim 17, wherein etching a through hole through the workpiece comprises:

anisotropically etching the workpiece from the second surface to expose a surface of the plurality of trenches;

forming a plurality of pillars by etching the fill material in the plurality of trenches from the second surface; and

etching the plurality of pillars from the second surface.

23. The method of claim 17, wherein etching a through hole through the workpiece comprises:

anisotropically etching the workpiece from the second surface to expose a surface of the plurality of trenches;

removing a material of the workpiece between the plurality of trenches from the second surface; and

etching the fill material in the plurality of trenches from the second surface.

24. A method of forming a semiconductor device, the method comprising:

forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface;

patterning the sacrificial layer;

forming a plurality of buried cavities in the workpiece from the first surface, wherein the plurality of buried cavities are aligned with the patterned sacrificial layer, wherein each of the plurality of buried cavities is a void fully enclosed within the workpiece;

forming a membrane over the sacrificial layer;

thinning the workpiece from the second surface; and

after thinning the workpiece, removing at least a portion of the sacrificial layer to form a cavity under the membrane, wherein the cavity is aligned with the membrane.

25. The method of claim 24, wherein forming the plurality of buried cavities in the workpiece from the first surface comprises

forming a plurality of trenches having a high aspect ratio;

covering the plurality of trenches with an overfill layer; and

annealing the workpiece in a hydrogen atmosphere.

26. A method of forming a semiconductor device, the method comprising:

forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface, wherein forming the sacrificial layer comprises;

forming a first plurality of trenches in the workpiece from the first surface;

filling the first plurality of trenches with a first dielectric layer, the first dielectric layer sealing each of the first plurality of trenches to form a first plurality of buried cavities;

forming a second plurality of trenches in the workpiece from the first surface, wherein each trench of second plurality of trenches is disposed between adjacent trenches of the first plurality of trenches;

filling the second plurality of trenches with a second dielectric layer, the second dielectric layer sealing each of the second plurality of trenches to form a second plurality of buried cavities; and

planarizing a top surface of the second dielectric layer over the first surface of the workpiece;

forming a membrane over the sacrificial layer;

thinning the workpiece from the second surface; and

after thinning the workpiece, removing at least a portion of the sacrificial layer to form a cavity under the membrane, wherein the cavity is aligned with the membrane.