Coil inductor for on-chip or on-chip stack

• US 9,105,627 B2
• Filed: 11/04/2011
• Issued: 08/11/2015
• Est. Priority Date: 11/04/2011
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Shapiro, Michael J., Carpenter, Gary D., Drake, Alan J., Gordin, Rachel, Sprogis, Edmund J.
• Primary Examiner(s): Talpalatski, Alexander
• Assistant Examiner(s): Baisa, Joselito
• Application Number:
  US13/289,071
• Publication Number:
  US 20130113448A1
• Time in Patent Office: 1,376 Days
• Field of Search: 336/199, 336/200, 336/205, 336/207, 336/208, 336/223, 257/531, 296/021
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

A coil inductor and buck voltage regulator incorporating the coil inductor are provided which can be fabricated on a microelectronic element such as a semiconductor chip, or on an interconnection element such as a semiconductor, glass or ceramic interposer element. When energized, the coil inductor has magnetic flux extending in a direction parallel to first and second opposed surfaces of the microelectronic or interconnection element, and whose peak magnetic flux is disposed between the first and second surfaces. In one example, the coil inductor can be formed by first conductive lines extending along the first surface of the microelectronic or interconnection element, second conductive lines extending along the second surface of the microelectronic or interconnection element, and a plurality of conductive vias, e.g., through silicon vias, extending in direction of a thickness of the microelectronic or interconnection element. A method of making the coil inductor is also provided.

Claims

1. A method of making an element having a coil inductor thereon, the element being configured for connection within a microelectronic package, the method comprising:

forming a continuous coil inductor on an element including at least one of semiconductor, glass or ceramic material, the element having a first and a second opposed surfaces and a thickness between the first and the second surfaces of less than 1000 microns, the continuous coil inductor including first electrically conductive lines extending along the first surface, second electrically conductive lines extending along the second surface, and a plurality of conductive vias extending in a direction between the first and second surfaces and coupling the first and second electrically conductive lines,

wherein the plurality of conductive vias and the first and second electrically conductive lines are arranged to form a first helical coil intertwined with a second helical coil in a double helix structure,

wherein when energized, the continuous coil inductor has magnetic flux extending in a direction parallel to the first and second surfaces and whose peak magnetic flux is disposed between the first and second surfaces,

wherein an output end of the continuous coil inductor is displaced from an input end of the coil inductor by no more than 10% of a length of a path of the magnetic flux between the input end and the output end of the continuous coil inductor, and

wherein the continuous coil inductor includes a first plurality of turns configured to direct the magnetic flux in a first straight path extending in a first direction, and includes a second plurality of turns configured to direct the magnetic flux in a second straight path parallel to and extending in a second direction opposite the first direction, the first straight path being separated from the second straight path by a distance approximately equal to the displacement between the input end and the output end.

2. The method of claim 1, wherein the electrically conductive structure and first and second electrically conductive lines are arranged to form the continuous coil inductor having a continuous helical structure.

3. The method of claim 1, wherein the continuous coil inductor includes a reversing portion configured to direct the flux between the first and second pluralities of turns.

4. The method of claim 1, wherein at least some of the first electrically conductive lines extend in parallel paths in a direction transverse to each of said first and second directions and at least some of the second electrically conductive lines extend in parallel paths orthogonal to the first direction.

5. The method of claim 1, wherein the first electrically conductive lines are overlie the first surface of the element, the second electrically conductive lines overlie the second surface of the element and the conductive structure includes through vias extending entirely through a thickness of a semiconductor region of the element.

6. The method of claim 1, wherein the conductive structure does not extend through a semiconductor region of the element.

7. A coil inductor comprising:

first electrically conductive lines extending along the first surface of a semiconductor chip comprising a second surface opposite the first surface, the first electrically conductive lines disposed at a first height relative to the second surface;

second electrically conductive lines extending parallel to the second surface, the second electrically conductive lines disposed at a second height relative to the second surface, the second height being below the first height; and

an electrically conductive structure extending in a direction between the first and second surfaces and coupling the first and second conductive lines,

wherein the electrically conductive structure and the first and second electrically conductive lines are arranged to form a first helical coil intertwined with a second helical coil in a double helix structure,

wherein when energized, the coil inductor has magnetic flux extending in a direction parallel to the first and second surfaces and whose peak magnetic flux is disposed between the first and second surfaces,

wherein an output end of the coil inductor is displaced from an input end of the coil inductor by no more than 10% of a length of a path of the magnetic flux between the input end and the output end of the coil inductor,

wherein the coil inductor includes a first plurality of turns configured to direct the magnetic flux in a first straight path extending in a first direction, and includes a second plurality of turns configured to direct the magnetic flux in a second straight path parallel to and extending in a second direction opposite the first direction, the first straight path being separated from the second straight path by a distance approximately equal to the displacement between the input end and the output end.

8. The coil inductor of claim 7, wherein the electrically conductive structure and first and second electrically conductive lines are arranged to form the coil inductor having a continuous helical structure.

9. The coil inductor of claim 7, wherein the coil inductor includes a reversing portion configured to direct the flux between the first and second pluralities of turns.

10. The coil inductor of claim 7, wherein at least some of the first electrically conductive lines extend in parallel paths in a direction transverse to each of said first and second directions and at least some of the second electrically conductive lines extend in parallel paths orthogonal to the first direction.

11. The coil inductor of claim 7, wherein the first electrically conductive lines are overlie the first surface of the semiconductor chip, the second electrically conductive lines overlie the second surface of the semiconductor chip and the conductive structure includes through vias extending entirely through a thickness of a semiconductor region of the semiconductor chip.

12. The coil inductor of claim 7, wherein the conductive structure does not extend through a semiconductor region of the semiconductor chip.