Semiconductor device and method for manufacturing the same
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate having a first major surface and a second major surface facing each other;
a drift layer of a first conductivity type on the first major surface;
a cell region in one upper portion of the drift layer and in the center of the semiconductor device;
a well of a second conductivity type in another upper portion of the drift layer disposed in a peripheral region of the semiconductor device;
a first electrode above the first major surface of the semiconductor substrate, the first electrode is electrically connected to the well;
a second electrode under the second major surface of the semiconductor substrate;
an insulating film on the well; and
a gate electrode and a gate wiring provided on the insulating film,wherein the gate wiring is a silicide created from a portion of a poly-silicon layer used for the gate electrode, andthe gate wiring is electrically connected to the gate electrode in the horizontal direction and does not overlap with the gate electrode.
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Accused Products
Abstract
In a cell region of a first major surface of a semiconductor substrate of a first conductivity type, a first well of a second conductivity type is in an upper surface. A diffusion region of a first conductivity type is in the upper surface in the first well. A first gate insulating film is on the first well, and a first gate electrode on the first gate insulating film. A second well of a second conductivity type is in the upper surface of the first major surface on a peripheral portion of the cell region. A second gate insulating film is on the second well, and a thick field oxide film is on the peripheral side than the second gate insulating film. A second gate electrode is sequentially on the second gate insulating film and the field oxide film and electrically connected to the first gate electrode. A first electrode is connected to the first, second well and the diffusion region. A second electrode is connected on a second major surface of the semiconductor substrate. A gate wiring is on the field oxide film, going around a periphery of the cell region, and electrically connected to the second gate electrode. The gate wiring is a silicide of a constituting substance of the second gate electrode.
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Citations
10 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate having a first major surface and a second major surface facing each other; a drift layer of a first conductivity type on the first major surface; a cell region in one upper portion of the drift layer and in the center of the semiconductor device; a well of a second conductivity type in another upper portion of the drift layer disposed in a peripheral region of the semiconductor device; a first electrode above the first major surface of the semiconductor substrate, the first electrode is electrically connected to the well; a second electrode under the second major surface of the semiconductor substrate; an insulating film on the well; and a gate electrode and a gate wiring provided on the insulating film, wherein the gate wiring is a silicide created from a portion of a poly-silicon layer used for the gate electrode, and the gate wiring is electrically connected to the gate electrode in the horizontal direction and does not overlap with the gate electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a semiconductor device comprising:
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preparing a semiconductor substrate of a first conductivity type having a first major surface and a second major surface facing to each other; forming a first well of a second conductivity type in an upper surface of the first major surface in a cell region of the first major surface and a second well of a second conductivity type in the upper surface of the first major surface on a peripheral portion of the cell region; forming a diffusion region of a first conductivity type in the upper surface of the first major surface in the first well; forming a first gate insulating film on the first well and a second gate insulating film on the second well; forming a field oxide film on the second well on the peripheral side of the second gate insulating film and being thicker than the second gate insulating film; forming a first gate electrode on the first gate insulating film; forming a second gate electrode sequentially on the second gate insulating film and the field oxide film and electrically connected to the first gate electrode; forming an interlayer insulating film on the first major surface so as to cover the first gate electrode and the second gate electrode; etching the interlayer insulating film to form a first contact hole on the first well and the diffusion region and a second contact hole on the second well; etching the interlayer insulating film to expose a part of the second gate electrode; forming a gate wiring going around a periphery of the cell region on the field oxide film by a silicidation of the exposed part of the second gate electrode; forming a first electrode electrically connected to the first well and the diffusion region via the first contact hole and electrically connected to the second well via the second contact hole; forming a second electrode on the second major surface of the semiconductor substrate; and forming a gate pad electrically connected to the gate wiring. - View Dependent Claims (10)
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Specification