Thermocouple and method of production
First Claim
1. A method for producing a thermocouple having at least two thermolegs, at least one first thermoleg of the at least two thermolegs formed of p-doped semiconductor material and at least one second thermoleg of the at least two thermolegs formed of n-doped semiconductor material are electrically alternatingly conductively interconnected on a hot side and a cold side of the thermocouple, the method comprising the following steps:
- providing a substrate consisting of an electrically and thermally conductive material and having at least one aperture dividing the substrate into substrate regions on the hot side and substrate regions on the cold side of the thermocouple;
fitting the substrate with the at least two thermolegs, wherein each of the at least two thermolegs is placed on a substrate region on the hot side and on a substrate region on the cold side and is electrically and thermally conductively connected to the substrate region on the hot side and to the substrate region on the cold side;
applying an encapsulation such that the encapsulation encases each of the at least two thermolegs and the encapsulation bonds integrally to the substrate region on the hot side and to the substrate region on the cold side of the each of the at least two thermolegs; and
separating parts of the substrate in such a way that a flow of electric current between the substrate regions on the hot side and the substrate regions on the cold side is prevented by the at least one aperture in the substrate.
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Accused Products
Abstract
A method for the low-cost production of sheet-like thermocouples comprises the following steps: —providing an electrically and thermally conductive substrate having at least one clearance, which subdivides the substrate into substrate regions, —fitting thermolegs onto the substrate, wherein each thermoleg is connected to a region of the substrate on a hot side and on a cold side, —applying an encapsulation, so that at least each thermoleg is enclosed and the encapsulation enters into a material bond with the regions of the substrate, —separating parts of the substrate in such a way as to prevent a flow of electric current between the regions of the substrate through the at least one clearance. The invention also relates to a substrate that is suitable for carrying out the method and to a thermocouple that can be produced by the method.
14 Citations
12 Claims
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1. A method for producing a thermocouple having at least two thermolegs, at least one first thermoleg of the at least two thermolegs formed of p-doped semiconductor material and at least one second thermoleg of the at least two thermolegs formed of n-doped semiconductor material are electrically alternatingly conductively interconnected on a hot side and a cold side of the thermocouple, the method comprising the following steps:
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providing a substrate consisting of an electrically and thermally conductive material and having at least one aperture dividing the substrate into substrate regions on the hot side and substrate regions on the cold side of the thermocouple; fitting the substrate with the at least two thermolegs, wherein each of the at least two thermolegs is placed on a substrate region on the hot side and on a substrate region on the cold side and is electrically and thermally conductively connected to the substrate region on the hot side and to the substrate region on the cold side; applying an encapsulation such that the encapsulation encases each of the at least two thermolegs and the encapsulation bonds integrally to the substrate region on the hot side and to the substrate region on the cold side of the each of the at least two thermolegs; and separating parts of the substrate in such a way that a flow of electric current between the substrate regions on the hot side and the substrate regions on the cold side is prevented by the at least one aperture in the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 12)
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7. A thermocouple, comprising:
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at least two thermolegs, at least one first thermoleg of the at least two thermolegs formed of p-doped semiconductor material and at least one second thermoleg of the at least two thermolegs formed of n-doped semiconductor material are electrically alternatingly conductively interconnected on a hot side and a cold side of the thermocouple, wherein a temperature gradient between the hot and the cold side of the thermocouple can be applied or tapped; a plurality of supporting parts on the hot side of the thermocouple and a plurality of supporting parts on the cold side of the thermocouple, each of the supporting parts consisting of an electrically and thermally conductive material and having a planar surface fitted with the thermolegs, the planar surfaces of the supporting parts lie in one plane, the supporting parts are arranged at a distance from one another in such a way that they do not contact one another, and each of the at least two thermolegs is electrically and thermally conductively connected to a respective planar surface of a respective one of the supporting parts on the hot side and to the planar surface of a respective one of the supporting parts on the cold side; and at least one encapsulation encasing each thermoleg and bonded to the supporting part on the hot side and to the supporting part on the cold side of each of the at least two thermolegs. - View Dependent Claims (8, 9, 10, 11)
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Specification