Thermo/electrical conductor arrangement for multilayer printed circuit boards

• US 9,107,296 B2
• Filed: 06/01/2011
• Issued: 08/11/2015
• Est. Priority Date: 06/01/2011
• Status: Expired due to Fees

• Current Assignee: Telefonaktiebolaget LM Ericsson
• Original Assignee: Telefonaktiebolaget LM Ericsson
• Inventors: Perez-Uria, Igor, Ferm, Per
• Primary Examiner(s): NGUYEN, TUYEN T
• Application Number:
  US14/122,661
• Publication Number:
  US 20140085034A1
• Time in Patent Office: 1,532 Days
• Field of Search: 336 55- 62, 336/200, 336/232, 361760-766
• US Class Current: 1/1
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0207 using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/10295 Metallic connector elements partly mounted in a hole of the PCB
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Abstract

The present invention relates to a thermo/electrical conductor arrangement for multilayer printed circuit boards (PCBs). Using vias for the transport of heat from the interior of the PCB and for conducting high currents between the conducting layers have limitations. Via platings are very thin and vias filled with solder is an unreliable method as there is always a risk that the vias are not properly filled during the soldering process. The present invention overcomes this by inserting a pin of a current conductive material (such as copper) into the via so that the pin is brought into galvanic contact with the conducting layers in the PCB and where at least one end of the pin is freely protruding from the PCB thereby allowing the pin to conduct heat from the interior of the PCB to the protruding end of the pin for external cooling.

Claims

1. A multilayer printed circuit board (PCB) comprising:

at least one via penetrating a plurality of conductive layers in the PCB;

at least one pin of a current conductive material, wherein the at least one pin is inserted into the at least one via so that the at least one pin is brought into galvanic contact with conducting layers, and wherein at least one end of the at least one pin is freely protruding from the PCB thereby allowing the at least one pin to conduct heat from an interior of the PCB to the protruding end, and wherein the freely protruding end of the pin is provided with a cooling fin that extends in parallel with a surface of the PCB.

2. The PCB as in claim 1, wherein the at least one pin is soldered to the conductive layers.

3. The PCB as in claim 2, wherein the cooling fin is a separate element having a fitting part adapted so that the fin element can be mounted on the end of the pin.

4. The PCB as in claim 3, wherein the at least one via is penetrating the whole PCB, and wherein two ends of the at least one pin are protruding from opposite sides of the PCB.

5. The PCB as in claim 4, having a plurality of vias and pins arranged in an array.

6. The PCB as in claim 5, further comprising a transformer with at least one transformer copper winding being a path of the conductive layers, and wherein the at least one pin penetrates the at least one transformer copper winding.