Resonant via structures in multilayer substrates and filters based on these via structures

• US 9,107,300 B2
• Filed: 12/14/2009
• Issued: 08/11/2015
• Est. Priority Date: 12/14/2009
• Status: Active Grant

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Kushta, Taras
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): STEVENS, GERALD D
• Application Number:
  US13/515,840
• Publication Number:
  US 20120306597A1
• Time in Patent Office: 2,066 Days
• Field of Search: 333202-204, 333/206, 333/219, 333/222, 333/246, 333/238
• US Class Current: 1/1
• CPC Class Codes: H01P 1/203 Strip line filters
• CPC Class Codes: H01P 7/08 Strip line resonators
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers.

Claims

1. A resonant via structure, comprising:

a multilayer substrate, including a plurality of conductor layers and a dielectric isolating each of said plurality of conductor layers;

a signal via conductor, disposed through said multilayer substrate; and

a plurality of ground vias, disposed through said multilayer substrate and around said signal via conductor,

wherein said plurality of conductor layers comprise;

a first plurality of signal conductive plates connected to said signal via conductor;

a second plurality of signal conductive plates connected to said signal via conductor;

a first plurality of ground conductive plates connected to said plurality of ground vias and disposed on a same one of said plurality of conductor layers as said first plurality of signal conductive plates;

a second plurality of ground conductive plates connected to said plurality of ground vias and disposed on a same one of said plurality of conductor layers as said second plurality of signal conductive plates;

a third plurality of ground conductive plates connected to said plurality of ground vias and, in said third plurality of ground conductive plates, each ground conductive plate being disposed on one of said plurality of conductor layers above or below with respect to one of said first plurality of signal conductive plates;

a plurality of clearance areas separating said third plurality of ground conductive plates from said signal via conductor;

a first plurality of isolating slits separating said first plurality of signal conductive plates from said plurality of ground vias and said first plurality of ground conductive plates; and

a second plurality of isolating slits separating said second plurality of signal conductive plates from said plurality of ground vias and said second plurality of ground conductive plates,

wherein each of said first plurality of signal conductive plates is arranged under or above of one of said third plurality of ground conductive plates, and

wherein said multilayer substrate comprises;

a first artificial medium section, disposed between said signal via and said plurality of ground vias in a plane of said plurality of conductor layers and between a first and another layers of said plurality of conductor layers in a direction of said signal via, having a first relative effective permittivity, wherein said first artificial medium section is formed by said first plurality of signal plates, said first plurality of isolating slits, said third plurality of ground plates, and said plurality of clearance holes; and

a second artificial medium section, disposed between said signal via and said plurality of ground vias in the plane of said plurality of conductor layers and between said another and last layers of said plurality of conductor layers in the direction of said signal via, having a second relative effective permittivity which is different from said first relative effective permittivity, and

wherein said second artificial medium section is formed by said second plurality of signal plates and said second plurality of isolating slits.

2. The resonant via structure according to claim 1, wherein said first plurality of signal conductive plates comprise:

a first pad connected to one end of said signal via conductor,

wherein said plurality of clearance areas comprise;

a first clearance area isolating said first pad from a conductor disposed on a same conductor layer as said first pad, and

wherein another end of said signal via conductor is connected to one of said plurality of ground conductive plates disposed at a same conductor layer as said another end of said signal via conductor.

3. The resonant via structure according to claim 2, wherein said first relative effective permittivity is higher than said second relative effective permittivity.

4. A filter comprising a first and a second resonant via structures,

wherein each of said first and second resonant via structures comprises a resonant via structure according to claim 3, and

wherein a first signal via conductor of said first resonant via structure and a second signal via conductor of said second resonant via structure comprise a capacitive-coupled structure.

5. The resonant via structure according to claim 2, wherein said first relative effective is lower than said second relative effective permittivity.

6. A filter comprising a first and a second resonant via structures, wherein each of said first and second resonant via structures comprises a resonant via structure according to claim 2, and

wherein a first signal via conductor of said first resonant via structure and a second signal via conductor of said second resonant via structure comprise a capacitive-coupled structure.

7. The filter according to claim 6, wherein said capacitive-coupled structure comprises:

a first planar transmission line segment connected to said first pad of said first resonant via structure; and

a second planar transmission line segment connected to said first pad of said second resonant via structure, and

wherein said first and second planar transmission line segments are isolated by said first clearance area of said first and second resonant via structure.

8. The filter according to claim 6, wherein said capacitive-coupled structure comprises a capacitor connected between said first pad of said first resonant via structure and said first pad of said second resonant via structure.

9. The filter according to claim 6, wherein said first pad serves as a terminal of said filter.

10. The filter according to claim 9, wherein said first pad is connected to a planar transmission line of a circuit system.

11. The filter according to claim 10, wherein said first pad is connected to a ball grid array of the circuit system.

12. A filter comprising first and second resonant via structures, wherein each of said first and second resonant via structures comprises a resonant via structure according to claim 2, and

wherein a first signal via conductor of said first resonant via structure and a second signal via conductor of said second resonant via structure comprise a inductive-coupled structure.

13. The filter according to claim 12, wherein said inductive-coupled structure comprises a planar transmission line segment connected between said first pad of said first resonant via structure and said first pad of said second resonant via structure.

14. The filter according to claim 12, wherein said inductive-coupled structure comprises a inductor connected between said first pad of said first resonant via structure and said first pad of said second resonant via structure.

15. A filter comprising a plurality of resonant via structures periodically arranged, wherein each of said plurality of resonant via structures comprises a resonant via structure according to claim 2.

16. A filter comprising a first and a second resonant via structures, wherein each of said first and second resonant via structures comprises a resonant via structure according to claim 2, and

wherein said first and said second relative effective permittivities of said first resonant via structure are different.

17. The resonant via structure according to claim 1, wherein said first plurality of signal conductive plates comprise:

a first pad connected to one end of said signal via conductor; and

a second pad connected to another end of said signal via conductor, and

wherein said plurality of clearance areas comprise;

a first clearance area isolating said first pad from a conductor disposed at a same one of said plurality of conductor layers as said first pad; and

a second clearance area isolating said second pad from a conductor disposed at a same one of said plurality of conductor layers as said second pad.

18. The resonant via structure according to claim 17, wherein said first relative effective permittivity is higher than said second relative effective permittivity.

19. The resonant via structure according to claim 17, wherein said first relative effective permittivity is lower than said second relative effective permittivity.

20. A filter comprising a first and a second resonant via structures, wherein each of said first and second resonant via structures comprises a resonant via structure according to claim 17, and

wherein a first signal via conductor of said first resonant via structure and a second signal via conductor of said second resonant via structure comprise a capacitive-coupled structure.