Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
First Claim
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1. A method for fabricating multi-sensor microelectronic packages, the method comprising:
- positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die;
bonding the magnetometer wafer to the accelerometer wafer to produce a bonded wafer stack; and
singulating the bonded wafer stack to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die;
wherein the non-singulated magnetometer die and the non-singulated accelerometer die each have multiple sensing axes, and wherein the magnetometer wafer is rotationally aligned with the accelerometer wafer when positioned thereover such that the sensing axes of the non-singulated magnetometer die align with the sensing axes of the non-singulated accelerometer die.
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Abstract
Methods for fabricating multi-sensor microelectronic packages and multi-sensor microelectronic packages are provided. In one embodiment, the method includes positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die. The magnetometer wafer is bonded to the accelerometer wafer to produce a bonded wafer stack. The bonded wafer stack is then singulated to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die.
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Citations
20 Claims
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1. A method for fabricating multi-sensor microelectronic packages, the method comprising:
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positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die; bonding the magnetometer wafer to the accelerometer wafer to produce a bonded wafer stack; and singulating the bonded wafer stack to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die; wherein the non-singulated magnetometer die and the non-singulated accelerometer die each have multiple sensing axes, and wherein the magnetometer wafer is rotationally aligned with the accelerometer wafer when positioned thereover such that the sensing axes of the non-singulated magnetometer die align with the sensing axes of the non-singulated accelerometer die. - View Dependent Claims (2, 3, 4, 5, 6, 9, 10, 11, 12, 13, 15, 16, 17, 18)
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7. A method for fabricating multi-sensor microelectronic packages, the method comprising:
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positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die; bonding the magnetometer wafer to the accelerometer wafer to produce a bonded wafer stack; singulating the bonded wafer stack to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die; after bonding the magnetometer wafer to the accelerometer wafer, removing portions of the non-singulated magnetometer die to reveal underlying regions of the non-singulated accelerometer die having bond pads thereon; and producing wire bonds interconnecting the bond pads of the non-singulated accelerometer die with bond pads provided the non-singulated magnetometer die. - View Dependent Claims (8, 19)
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14. A method for fabricating multi-sensor microelectronic packages, the method comprising:
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positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die; bonding the magnetometer wafer to the accelerometer wafer to produce a bonded wafer stack; and singulating the bonded wafer stack to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die; wherein the magnetometer wafer has backside and an opposing frontside over which the array of non-singulated magnetometer die is formed, wherein the magnetometer wafer has a frontside over which the array of non-singulated accelerometer die is formed, and wherein bonding comprises bonding the backside of the magnetometer wafer directly to the frontside of the accelerometer wafer. - View Dependent Claims (20)
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Specification