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Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof

  • US 9,108,841 B1
  • Filed: 03/05/2014
  • Issued: 08/18/2015
  • Est. Priority Date: 03/05/2014
  • Status: Active Grant
First Claim
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1. A method for fabricating multi-sensor microelectronic packages, the method comprising:

  • positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die;

    bonding the magnetometer wafer to the accelerometer wafer to produce a bonded wafer stack; and

    singulating the bonded wafer stack to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die;

    wherein the non-singulated magnetometer die and the non-singulated accelerometer die each have multiple sensing axes, and wherein the magnetometer wafer is rotationally aligned with the accelerometer wafer when positioned thereover such that the sensing axes of the non-singulated magnetometer die align with the sensing axes of the non-singulated accelerometer die.

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