Multiple energization elements in stacked integrated component devices

• US 9,110,310 B2
• Filed: 01/26/2012
• Issued: 08/18/2015
• Est. Priority Date: 03/18/2011
• Status: Active Grant

• Current Assignee: Johnson & Johnson Vision Care Incorporated (Johnson & Johnson)
• Original Assignee: Johnson & Johnson Vision Care Incorporated (Johnson & Johnson)
• Inventors: Pugh, Randall B., Flitsch, Frederick A., Otts, Daniel B., Riall, James Daniel, Toner, Adam
• Primary Examiner(s): Sinclair, David M
• Assistant Examiner(s): BROWN, ROBERT D
• Application Number:
  US13/358,916
• Publication Number:
  US 20120235277A1
• Time in Patent Office: 1,300 Days
• Field of Search: 361/790
• US Class Current: 1/1
• CPC Class Codes: B29D 11/00038 Production of contact lenses
• CPC Class Codes: B29D 11/00826 with energy receptors for wireless energy transmission
• CPC Class Codes: G02C 11/10 Electronic devices other than hearing aids
• CPC Class Codes: G02C 2202/16 Laminated or compound lenses
• CPC Class Codes: G02C 7/02 Lenses; Lens systems ; Methods of designing lenses
• CPC Class Codes: G02C 7/04 Contact lenses for the eyes disinfection or sterilisation of contact lenses A61L12/00
• CPC Class Codes: G02C 7/083 Electrooptic lenses
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01M 10/0525 : Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
• CPC Class Codes: H01M 50/00 : Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
• CPC Class Codes: H01M 50/107 : having curved cross-section, e.g. round or elliptic H01M50/103, H01M50/109, H01M50/11 take precedence
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries

Abstract

This invention discloses a device comprising multiple functional layers with multiple energization elements formed on substrates, wherein at least one functional layer comprises an electrical energy source. In some embodiments, the present invention includes a component for incorporation into ophthalmic lenses that has been formed by the stacking of multiple functionalized layers.

Claims

1. A stacked integrated component device with multiple energization elements for an ophthalmic lens including powered components, comprising:

a first layer comprising a first surface;

a second layer comprising a second surface, wherein at least a portion of the first layer lays above at least a portion of the second layer such that they overlap only partially and form a three dimensional structure configured to match a profile of the ophthalmic lens;

at least one electrical connection between a first electrical contact on the first surface and a second electrical contact on the second surface;

at least one electrical transistor, wherein the at least one electrical transistor is located within the stacked integrated component device; and

at least a first and a second discrete energization element located within at least one of the first layer and the second layer.

2. The stacked integrated component device of claim 1, wherein the first and the second discrete energization elements each have a thicknesses of less than 200 microns.

3. The stacked integrated component device of claim 1, additionally comprising:

a first electrical common connection in contact with a first ground connection of the first discrete energization element;

a second electrical common connection in contact with a second ground connection of the second discrete energization element;

a first electrical bias connection in contact with a first bias connection of the first discrete energization element; and

a second electrical bias connection in contact with a second bias connection of the second discrete energization element.

4. The stacked integrated component device of claim 3, wherein the first electrical common connection is electrically connected to the second electrical common connection forming a single common connection for the first and the second discrete energization elements.

5. The stacked integrated component device of claim 4, wherein the first electrical bias connection is electrically connected to the second electrical bias connection forming a single bias connection for the first and the second discrete energization elements.

6. The stacked integrated component device of claim 3, wherein:

the first electrical bias connection is electrically connected to a first power supply input of a first integrated circuit; and

the second electrical bias connection is electrically connected to a second power supply input of the first integrated circuit.

7. The stacked integrated component device of claim 6, wherein:

the first integrated circuit generates a first output power supply; and

a second integrated circuit is electrically connected to the first output power supply.

8. The stacked integrated component device of claim 7, wherein:

the first integrated circuit combines, with at least a first switch, the first power supply input and the second power supply input to create the first output power supply,

the first output supply having a voltage capability equivalent to the first and the second discrete energization elements, and

the first output supply having a combined electrical current capability of the first and the second discrete energization elements.

9. The stacked integrated component device of claim 7, wherein:

the first integrated circuit combines, with at least a first switch, the first power supply input and the second electrical common connection to create the first output power supply,

the first output supply having a current capability of the lesser of the electrical current capability of the first and the second discrete energization elements, and

the first output supply having a combined electrical bias of the first and the second discrete energization elements.

10. The stacked integrated component device of claim 7, wherein each of the electrical connections from the first layer and the second layer are not connected to an external wired connection of the stacked integrated component device.

11. The stacked integrated component device of claim 1, additionally comprising at least a third and a fourth discrete energization element located within the stacked integrated component device.

12. The stacked integrated component device of claim 1, wherein the discrete energization elements create more than one raw power supply.

13. The stacked integrated component device of claim 12, wherein at least a first raw power supply is electrically connected to a capacitive element separate from the discrete energization elements.

14. A stacked integrated component device with multiple energization elements for an ophthalmic lens including powered components, comprising:

a first layer comprising a first surface, and

a second layer comprising a second surface,

wherein at least a portion of the first layer lays above at least a portion of the second layer such that they partially overlap and form a three dimensional structure configured to match a profile of the ophthalmic lens;

at least one electrical connection between a first electrical contact on the first surface and a second electrical contact on the second surface;

at least one electrical transistor, wherein the at least one electrical transistor is located within the stacked integrated component device; and

at least a first and a second discrete energization element located within at least one of the first layer and the second layer,

wherein the first and the second discrete energization elements simultaneously provide power.

15. The stacked integrated component device of claim 14, wherein the first discrete energization element is located within the first layer and the second discrete energization elements is located within the second layer.

16. The stacked integrated component device of claim 14, wherein the first and the second discrete energization elements are both located in either one of the first layer and the second layer.

17. The stacked integrated component device of claim 14, wherein the first discrete energization element generates a first raw battery power and the second discrete energization element generates a second raw battery power.

18. The stacked integrated component device of claim 17, additionally comprising a power management unit electrically connected to the first and the second discrete energization elements, wherein the power management unit receives the first raw battery power from the first discrete energization element and the second raw battery power from the second discrete energization element.

19. The stacked integrated component device of claim 18, wherein the power management unit refines and alters the first raw battery power and the second raw battery power resulting in a refined power output.

20. The stacked integrated component device of claim 19, additionally comprising an integrated passive device in electrical connection with the power management unit, wherein the integrated passive device comprises a number of capacitors connected to at least one of the discrete energization elements.

21. The stacked integrated component device of claim 20, wherein the integrated passive device holds the refined power output provided by the power management unit.

22. The stacked integrated component device of claim 14, additionally comprising a microcontroller located within the stacked integrated component device controlling the discrete energization elements.

23. The stacked integrated component device of claim 22, additionally comprising a switch controller in electrical connection with the microcontroller, wherein the switch controller is configured to change a state of each of a plurality of switches in response to a signal from the microcontroller.

24. The stacked integrated component device of claim 23, wherein the switches control a number of different voltage conditions for the stacked integrated component device.

25. The stacked integrated component device of claim 23, wherein the microcontroller determines whether at least one of the discrete energization elements generates enough power to support a power requirement of the stacked integrated component device.

26. The stacked integrated component device of claim 25, additionally comprising a first and a second antenna, wherein the first antenna is capable of receiving radio frequency signals and the second antenna is capable of receiving wireless energy from an environment of the stacked integrated component device.

27. The stacked integrated component device of claim 23, additionally comprising a plurality of sets of discrete energization elements, wherein a first set of discrete energization elements is connected to only one of a plurality of voltage supply lines and each of the remaining sets of discrete energization elements is connected to each of the voltage supply lines.

28. The stacked integrated component device of claim 27, wherein each of the remaining sets of discrete energization elements is connected to each of the voltage supply lines by a separate switch.

29. The stacked integrated component device of claim 27, wherein each set of discrete energization elements is also connected to a plurality of switches, wherein each of the switches connects to a bias connection of each of the remaining sets of discrete energization elements.

30. The stacked integrated component device of claim 26, wherein the first antenna is electrically connected to the discrete energization elements and the second antenna is connected to an integrated passive device element.