Exposure device for the structured exposure of a surface

• US 9,110,380 B2
• Filed: 03/08/2012
• Issued: 08/18/2015
• Est. Priority Date: 04/04/2011
• Status: Expired due to Fees

• Current Assignee: JENOPTIK Optical Systems GmbH (Jenoptik AG)
• Original Assignee: JENOPTIK Optical Systems GmbH (Jenoptik AG)
• Inventors: Werschnik, Jan, Augustin, Markus, Reichmann, Lutz
• Primary Examiner(s): Whitesell Gordon, Steven H
• Application Number:
  US13/820,399
• Publication Number:
  US 20140118711A1
• Time in Patent Office: 1,258 Days
• US Class Current: 1/1
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: G03F 7/7005 by multiple sources, e.g. light-emitting diodes [LED] or light source arrays addressable array sources specially adapted to produce patterns without a mask G03F7/70391
• CPC Class Codes: G03F 7/70208 Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: H01L 21/67069 for drying etching

Abstract

The invention relates to an exposure device (14) for the structured exposure of a wafer, having at least one exposure arrangement with which a beam that is separated into two sub-beams is modulated via two micromirror arrays in order to increase the throughput speed during the exposure of wafers.

Claims

1. An exposure device for the structured exposure of a wafer, comprising at least one exposure arrangement, in which, one after another along an optical axis, a planar emitter, which emits a ray bundle, optical elements for imaging the ray bundle onto a downstream micromirror array for structuring the ray bundle, a first optically imaging system, a microlens array corresponding to the micromirror array, and a second optically imaging system for imaging the structured ray bundle into an image field of the exposure arrangement, which covers part of a wafer to be illuminated, wherein the micromirror array is a first micromirror array in front of which a first beam splitter is disposed, which splits the ray bundle into a first and a second partial ray bundle along a first and a second optical axis and a second micromirror array is arranged in the direction of the second partial ray bundle, wherein a second beam splitter is disposed in front of the first optically imaging system, via which beam splitter the two partial ray bundles, which have an optical path of the same length between the two beam splitters, are recombined into one ray bundle,

a first and a second front deflection mirror and a first and second rear deflection mirror arranged along the first and the second optical axis in front of the micromirror array, is such that they have identical arrangements with respect to one another, which deflection mirrors direct the partial ray bundles onto the micromirror arrays at the same predetermined angle of incidence, and the optical paths between the first beam splitter and the micromirror arrays are identical.

2. The exposure device as claimed in claim 1, wherein the micromirror arrays are arranged relative to the second beam splitter such that the partial ray bundles structured and reflected by the micromirror arrays impinge on the second beam splitter recombining the partial ray bundles with the same orientation.

3. The exposure device as claimed in claim 2, wherein the first deflection mirrors enclose an angle of more than 45°

with the respectively impinging optical axis.

4. The exposure device as claimed in claim 1, wherein the exposure arrangements in each case have a width that is not greater than twice the extent of their image field.

5. The exposure device as claimed in claim 4, wherein said exposure device is formed from two rows of exposure arrangements.