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Metrology method and apparatus, lithographic apparatus, and device manufacturing method

  • US 9,110,385 B2
  • Filed: 02/23/2009
  • Issued: 08/18/2015
  • Est. Priority Date: 02/29/2008
  • Status: Active Grant
First Claim
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1. A metrology apparatus configured to measure a property of a target on a substrate, the apparatus comprising:

  • a first source configured to emit a first illumination beam of radiation;

    a second source configured to emit a second illumination beam of radiation wherein the first illumination beam of radiation differs from the second illumination beam of radiation in at least one of spot size and angular distribution;

    an aperture plate having first and second openings configured to pass the first and second illumination beams, respectively;

    a beam selection device comprising a tiltable mirror tiltable about two axes, wherein the tiltable minor is positioned such that the first illumination beam of radiation is incident on the tiltable mirror at a first angle of incidence and the second illumination beam is incident on the tiltable mirror at a second angle of incidence and wherein the beam selection device is configured to select one of the first and second illumination beams of radiation as a measurement beam of radiation by tilting the tiltable mirror, wherein the tiltable mirror is positioned in a conjugate plane of the substrate and the aperture plate is positioned in a plane that is a Fourier transform of the conjugate plane of the substrate;

    an objective lens configured to direct the measurement beam of radiation onto the target on the substrate and to collect radiation diffracted by the target; and

    a sensor configured to detect an angle resolved spectrum in a pupil plane of the objective lens.

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