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Semiconductor manufacturing equipment

  • US 9,110,461 B2
  • Filed: 09/13/2012
  • Issued: 08/18/2015
  • Est. Priority Date: 12/28/2011
  • Status: Active Grant
First Claim
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1. Semiconductor manufacturing equipment including configuration for realizing wafer process processing and preparatory processing, the semiconductor manufacturing equipment comprising:

  • a controller controlling driving and processes of various parts of the semiconductor manufacturing equipment, and a sensor monitoring each physical amount in the semiconductor manufacturing equipment or a status of each chemical response amount;

    a database storing equipment data obtained by sampling, at predetermined intervals, output signals of the controller and the sensor of the semiconductor manufacturing equipment being manufactured; and

    an arithmetic section executing;

    processing of searching the database for the equipment data of the semiconductor manufacturing equipment to be evaluated, reading out the equipment data to be analyzed, calculatinga correlation matrix between time points based on a plurality of pieces of signal data to be compared, calculating eigen values and eigen vectors from the correlation matrix, and calculating principal component scores by principal component analysis;

    processing of comparing magnitudes of the eigen values of the principal components, arranging the eigen values in descending order to display a list thereof on a user interface screen, thereby enabling determination of the eigen value having a contribution ratio; and

    processing of displaying on the user interface screen a scatter diagram where the principal component scores of the respective signals are plotted in a feature space where the principal component corresponding to the eigen value having the contribution ratio is selected.

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