Methods for atomic layer etching

• US 9,111,876 B2
• Filed: 12/13/2013
• Issued: 08/18/2015
• Est. Priority Date: 11/30/2011
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Chang, Mei, Yudovsky, Joseph
• Primary Examiner(s): Deo, Duy
• Application Number:
  US14/106,166
• Publication Number:
  US 20140106565A1
• Time in Patent Office: 613 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/6776 Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Abstract

Provided are methods of etching a substrate using atomic layer deposition apparatus. Atomic layer deposition apparatus including a gas distribution plate with a thermal element are discussed. The thermal element is capable of locally changing the temperature of a portion of the surface of the substrate to vaporize an etch layer deposited on the substrate.

Claims

1. A method of processing a substrate having a surface, the method comprising:

laterally moving a surface beneath a gas distribution plate comprising a plurality of elongate gas ports including a first gas outlet to deliver a first reactive gas;

forming an etch layer on the substrate surface comprising exposing the substrate surface to the first reactive gas;

locally changing a temperature of the substrate surface from a first temperature to a second temperature, the second temperature being sufficient to vaporize the etch layer; and

locally removing the vaporized etch layer from the surface,

wherein at a portion of the surface is being exposed to the first reactive gas while the local temperature of a different portion of the surface is being changed.

2. The method of claim 1, wherein the first temperature is below an isotropic etch point of the etch layer and the second temperature is greater than or equal to the isotropic etch point of the etch layer.

3. The method of claim 1, wherein the surface temperature is changed by one or more of radiative heating or resistive heating.

4. The method of claim 1, wherein the surface comprises silicon.

5. The method of claim 4, wherein the first reactive gas comprises fluorine.

6. The method of claim 5, wherein the first temperature is in the range of about 20°

C. to about 50°

C. and the second temperature is in the range of about 100°

C. to about 200°

C.

7. The method of claim 1, wherein forming the etch layer on the substrate surface further comprises exposing the substrate surface to a second reactive gas different from the first reactive gas.

8. The method of claim 7, wherein one of the first reactive gas and the second reactive gas adsorb onto the surface and the other of the first reactive gas and the second reactive gas react with the adsorbed reactive gas.

9. The method of claim 1, wherein the surface comprises a silicon dioxide layer and forming the etch layer comprises exposing the surface to one of water and ammonia followed by exposure to hydrofluoric acid.

10. The method of claim 9, wherein when water is used, the first temperature is about room temperature and the second temperature is about 50°

C.

11. The method of claim 9, wherein when ammonia is used, the first temperature is less than about 35°

C. and the second temperature is about 120°

C.

12. The method of claim 10, wherein the substrate is silicon and the first reactive gas comprises fluorine.

13. The method of claim 12, wherein the second temperature is in the range of about 100°

C. to about 200°

C.

14. A method of processing a substrate comprising:

laterally moving a substrate having a surface beneath a gas distribution plate comprising a plurality of elongate gas ports including a first gas outlet to deliver a first reactive gas and second gas outlet to deliver a second reactive gas;

delivering the first reactive gas to at least a portion of the substrate surface to form a first reactive layer on the substrate surface;

locally removing unreacted first reactive gas;

delivering the second reactive gas to at least a portion of the substrate surface having a first reactive layer to react with the first reactive layer to form an etch layer on the substrate surface;

locally removing unreacted second reactive gas;

locally changing the temperature of the substrate surface from a first temperature to a second temperature, the second temperature being sufficient to vaporize the etch layer; and

removing the vaporized etch layer.

15. The method of claim 14, wherein first temperature is below the isotropic etch point of the etch layer and the second temperature is greater than or equal to the isotropic etch point of the etch layer.

16. The method of claim 14, wherein the substrate surface temperature is changed by one or more of radiative heating or resistive heating.

17. The method of claim 14, wherein the substrate has a silicon oxide layer on the surface and the first reactive gas is one of water and ammonia.

18. The method of claim 17, wherein the second reactive gas is hydrofluoric acid.

19. The method of claim 18, wherein the first temperature is less than about 50°

C. and the second temperature is in the range of about 90°

C. to about 130°

C.