Stacked through-silicon via (TSV) transformer structure

• US 9,111,933 B2
• Filed: 05/17/2012
• Issued: 08/18/2015
• Est. Priority Date: 05/17/2012
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Carpenter, Gary D., Drake, Alan J., Gordin, Rachel, Shapiro, Michael J., Sprogis, Edmund J.
• Primary Examiner(s): Chan, Tsz
• Application Number:
  US13/474,239
• Publication Number:
  US 20130307656A1
• Time in Patent Office: 1,188 Days
• Field of Search: 336/200, 336/232
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

A distributed active transformer is provided comprising a primary and a secondary winding. The primary winding comprises a first set of conductive vias extending in a direction between a first surface and a second surface of an element, a first set of first electrically conductive lines extending along the first surface, and a first set of second electrically conductive lines extending along the second surface. The secondary winding comprises a second set of conductive vias extending in a direction between the first surface and the second surface, a second set of first electrically conductive lines extending along the first surface, and a second set of second electrically conductive lines extending along the second surface. When energized, the primary winding generates magnetic flux extending in a direction parallel to the first surface and the second surface. The secondary winding receives energy transferred by the magnetic flux generated by the primary winding.

Claims

1. A distributed active transformer comprising:

a primary winding, comprising;

a first set of conductive vias extending in a direction between a first surface and a second surface of an element;

a first set of first electrically conductive lines extending along the first surface; and

a first set of second electrically conductive lines extending along the second surface; and

a secondary winding, comprising;

a second set of conductive vias extending a direction between the first surface and the second surface;

a second set of first electrically conductive lines extending along the first surface; and

a second set of second electrically conductive lines extending along the second surface, wherein, when energized, the primary winding generates magnetic flux extending in a direction parallel to the first surface and the second surface, wherein the secondary winding receives energy transferred by the magnetic flux generated by the primary winding, wherein the secondary winding provides a plurality of tapping points, wherein at least one tapping point of the plurality tapping points is on the first surface located at a junction of a second electrically conductive line in the second set of first electrically conductive lines and a conductive via in the second set of conductive vias, and wherein at least one other tapping point of the plurality of tapping points is on the second surface located at a junction of a second electrically conductive line in the second set of second electrically conductive lines and a conductive via in the second set of conductive vias.

2. The distributed active transformer of claim 1, wherein the primary winding further comprises:

one end of one conductive via in the first set of conductive vias coupled to a first terminal and the other end of the one conductive via coupled to a second end of an electrically conductive line in the first set of first electrically conductive lines;

one or more of a first end of each first electrically conductive line in the first set of first electrically conductive lines coupled to a second end of each second electrically conductive line in the first set of second electrically conductive lines via a conductive via in the first set of conductive vias and a second end of each first electrically conductive line in the first set of first electrically conductive lines coupled to a first end of each second electrically conductive line in the first set of second electrically conductive lines via a different conductive via in the first set of conductive vias; and

one end of another conductive via in the first set of conductive vias coupled to a second terminal and the other end of the other conductive via coupled to a second end of a different electrically conductive line in the first set of first electrically conductive lines.

3. The distributed active transformer of claim 1, wherein the first set of conductive vias, the first set of first electrically conductive lines, and the first set of second electrically conductive lines are arranged to form the primary winding having a first helical structure, wherein the second set of conductive vias, the second set of first electrically conductive lines, and the second set of second electrically conductive lines are arranged to form the secondary winding having a second helical structure, wherein the secondary winding is intertwined with the primary winding.

4. The distributed active transformer of claim 3, wherein the secondary winding is intertwined with the primary winding in a double helix structure.

5. The distributed active transformer of claim 1, wherein the secondary winding further comprises:

one end of one conductive via in the second set of conductive vias coupled to a first terminal and the other end of the one conductive via coupled to a second end of an electrically conductive line in the second set of first electrically conductive lines;

one or more of a first end of each first electrically conductive line in the second set of first electrically conductive lines coupled to a second end of each second electrically conductive line in the second set of second electrically conductive lines via a conductive via in the second set of conductive vias and a second end of each first electrically conductive line in the second set of first electrically conductive lines coupled to a first end of each second electrically conductive line in the second set of second electrically conductive lines via a different conductive via in the second set of conductive vias; and

one end of another conductive via in the second set of conductive vias coupled to a second terminal and the other end of the other conductive via coupled to a second end of a different electrically conductive line in the second set of first electrically conductive lines.

6. The distributed active transformer of claim 1, wherein the voltage induced by the magnetic flux of the primary winding on the secondary winding is less at a tapping point in the plurality of tapping points that is closer to a first terminal of the secondary winding and wherein the voltage induced by the magnetic flux of the primary winding on the secondary winding is more at a tapping point in the plurality of tapping points that is further from the first terminal of the secondary winding.

7. A microelectronic element having a transformer thereon, comprising:

a semiconductor chip embodying a plurality of active devices, the semiconductor chip having a first surface and a second surface, wherein the first surface opposes the second surface and wherein the transformer comprises;

a primary winding, comprising;

a first set of conductive vias extending in a direction between the first surface and the second surface;

a first set of first electrically conductive lines extending along the first surface; and

a first set of second electrically conductive lines extending along the second surface; and

a secondary winding, comprising;

a second set of conductive vias extending in a direction between the first surface and the second surface;

a second set of first electrically conductive lines extending along the first surface; and

a second set of second electrically conductive lines extending along the second surface, wherein, when energized, the primary winding generates magnetic flux extending in a direction parallel to the first surface and the second surface, wherein the secondary winding receives energy transferred by the magnetic flux generated by the primary winding, wherein the secondary winding provides a plurality of tapping points, wherein at least one tapping point of the plurality of tapping points is on the first surface located at a junction of a second electrically conductive line in the second set of first electrically conductive lines and a conductive via in the second set of conductive vias, and wherein at least one other tapping point of the plurality of tapping points is on the second surface located at a junction of a second electrically conductive line in the second set of second electrically conductive lines and a conductive via in the second set of conductive vias.

8. The microelectronic element of claim 7, wherein the primary winding further comprises:

one end of one conductive via in the first set of conductive vias coupled to a first terminal and the other end of the one conductive via coupled to a second end of an electrically conductive line in the first set of first electrically conductive lines;

one or more of a first end of each first electrically conductive line in the first set of first electrically conductive lines coupled to a second end of each second electrically conductive line in the first set of second electrically conductive lines via a conductive via in the first set of conductive vias and a second end of each first electrically conductive line in the first set of first electrically conductive lines coupled to a first end of each second electrically conductive line in the first set of second electrically conductive lines via a different conductive via in the first set of conductive vias; and

one end of another conductive via in the first set of conductive vias coupled to a second terminal and the other end of the other conductive via coupled to a second end of a different electrically conductive line in the first set of first electrically conductive lines.

9. The microelectronic element of claim 7, wherein the first set of conductive vias, the first set of first electrically conductive lines, and the first set of second electrically conductive lines are arranged to form the primary winding having a first helical structure, wherein the second set of conductive vias, the second set of first electrically conductive lines, and the second set of second electrically conductive lines are arranged to form the secondary winding having a second helical structure, wherein the secondary winding is intertwined with the primary winding.

10. The microelectronic element of claim 9, wherein the secondary winding is intertwined with the primary winding in a double helix structure.

11. The microelectronic element of claim 7, wherein the secondary winding further comprises:

one end of one conductive via in the second set of conductive vias coupled to a first terminal and the other end of the one conductive via coupled to a second end of an electrically conductive line in the second set of first electrically conductive lines;

one or more of a first end of each first electrically conductive line in the second set of first electrically conductive lines coupled to a second end of each second electrically conductive line in the second set of second electrically conductive lines via a conductive via in the second set of conductive vias and a second end of each first electrically conductive line in the second set of first electrically conductive lines coupled to a first end of each second electrically conductive line in the second set of second electrically conductive lines via a different conductive via in the second set of conductive vias; and

one end of another conductive via in the second set of conductive vias coupled to a second terminal and the other end of the other conductive via coupled to a second end of a different electrically conductive line in the second set of first electrically conductive lines.

12. The microelectronic element of claim 7, wherein the voltage induced by the magnetic flux of the primary winding on the secondary winding is less at a tapping point in the plurality of tapping points that is closer to a first terminal of the secondary winding and wherein the voltage induced by the magnetic flux of the primary winding on the secondary winding is more at a tapping point in the plurality of tapping points that is further from the first terminal of the secondary winding.

13. A method of making a distributed active transformer comprising:

generating a primary winding by;

extending a first set of conductive vias in a direction between a first surface and a second surface of an element;

extending a first set of first electrically conductive lines along the first surface; and

extending a first set of second electrically conductive lines along the second surface; and

generating a secondary winding by;

extending a second set of conductive vias in a direction between the first surface and the second surface;

extending a second set of first electrically conductive lines along the first surface; and

extending a second set of second electrically conductive lines along the second surface, wherein, when energized, the primary winding generates magnetic flux extending in a direction parallel to the first surface and the second surface, wherein the secondary winding receives energy transferred by the magnetic flux generated by the primary winding, wherein the secondary winding provides a plurality of tapping points, wherein at least one tapping point of the plurality of tapping points is on the first surface located at a junction of a second electrically conductive line in the second set of first electrically conductive lines and a conductive via in the second set of conductive vias, and wherein at least one other tapping point of the plurality of tapping points is on the second surface located at a junction of a second electrically conductive line in the second set of second electrically conductive lines and a conductive via in the second set of conductive vias.

14. The method of claim 13, wherein generating the primary winding further comprises:

coupling one end of one conductive via in the first set of conductive vias to a first terminal and coupling the other end of the one conductive via to a second end of an electrically conductive line in the first set of first electrically conductive lines;

coupling one or more of a first end of each first electrically conductive line in the first set of first electrically conductive lines to a second end of each second electrically conductive line in the first set of second electrically conductive lines via a conductive via in the first set of conductive vias and coupling a second end of each first electrically conductive line in the first set of first electrically conductive lines to a first end of each second electrically conductive line in the first set of second electrically conductive lines via a different conductive via in the first set of conductive vias; and

coupling one end of another conductive via in the first set of conductive vias to a second terminal and coupling the other end of the other conductive via to a second end of a different electrically conductive line in the first set of first electrically conductive lines.

15. The method of claim 13, wherein the first set of conductive vias, the first set of first electrically conductive lines, and the first set of second electrically conductive lines are arranged to form the primary winding having a first helical structure, wherein the second set of conductive vias, the second set of first electrically conductive lines, and the second set of second electrically conductive lines are arranged to form the secondary winding having a second helical structure, wherein the secondary winding is intertwined with the primary winding.

16. The method of claim 15, wherein the secondary winding is intertwined with the primary winding in a double helix structure.

17. The method of claim 13, wherein generating the secondary winding further comprises:

coupling one end of one conductive via in the second set of conductive vias to a first terminal and coupling the other end of the one conductive via to a second end of an electrically conductive line in the second set of first electrically conductive lines;

coupling one or more of a first end of each first electrically conductive line in the second set of first electrically conductive lines to a second end of each second electrically conductive line in the second set of second electrically conductive lines via a conductive via in the second set of conductive vias and coupling a second end of each first electrically conductive line in the second set of first electrically conductive lines to a first end of each second electrically conductive line in the second set of second electrically conductive lines via a different conductive via in the second set of conductive vias; and

coupling one end of another conductive via in the second set of conductive vias to a second terminal and coupling the other end of the other conductive via to a second end of a different electrically conductive line in the second set of first electrically conductive lines.

18. The method of claim 13, wherein the voltage induced by the magnetic flux of the primary winding on the secondary winding is less at a tapping point in the plurality of tapping points that is closer to a first terminal of the secondary winding and wherein the voltage induced by the magnetic flux of the primary winding on the secondary winding is more at a tapping point in the plurality of tapping points that is further from the first terminal of the secondary winding.