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Package systems and manufacturing methods thereof

  • US 9,112,001 B2
  • Filed: 02/05/2014
  • Issued: 08/18/2015
  • Est. Priority Date: 10/08/2010
  • Status: Active Grant
First Claim
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1. A method of forming a package system, the method comprising:

  • providing a first substrate having a metallic pad and at least one metallic guard ring, wherein the metallic pad protrudes above a top surface of the first substrate; and

    bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates.

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