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Conductive films

  • US 9,112,166 B2
  • Filed: 07/29/2011
  • Issued: 08/18/2015
  • Est. Priority Date: 07/30/2010
  • Status: Expired due to Fees
First Claim
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1. An apparatus comprising:

  • an organic substrate layer; and

    an inorganic nanowire mesh embedded in the organic substrate layer, the organic substrate layer being configured with the embedded nanowire mesh to provide a composite morphology for nanowires therein being sufficiently flattened to form a conductive film in which some of the nanowires are exposed and at which RMS surface roughness is between 5 nm and 30nm, wherein the organic substrate layer and the inorganic nanowire mesh form an organic-inorganic compound conductive film having a surface roughness value that is at least 25% lower than a surface roughness of the inorganic nanowire mesh, prior to embedding in the organic substrate layer.

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