Antenna modules for dual interface smart cards, booster antenna configurations, and methods

• US 9,112,272 B2
• Filed: 11/13/2013
• Issued: 08/18/2015
• Est. Priority Date: 08/12/2010
• Status: Expired due to Fees

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Czornack, Jan Thomas, Lotya, Mustafa, Fendt, Theodor, Ummenhofer, Klaus
• Primary Examiner(s): Haupt, Kristy A
• Application Number:
  US14/078,527
• Publication Number:
  US 20140104133A1
• Time in Patent Office: 643 Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/0239 : Signal transmission by AC coupling
• CPC Class Codes: H05K 2201/086 : for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/103 : by bonding or embedding conductive wires or strips

Abstract

Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.

Claims

1. A module tape (MT) for an RFID antenna module (AM) comprising:

a substrate (MT); and

a support structure (SS, DS, WC) disposed on a surface of the substrate and comprising a tubular body portion (B) having two opposite open ends, one of which is disposed against the surface of the substrate, the other of which is a free end;

characterized by;

a planar element (LD, CP, PT) selected from the group consisting of a flange (F), a lid (LD, CP) and a tool (PT) disposed upon the free end of the support structure for constraining winding of the module antenna (MA) on the support structure;

wherein;

the planar element is in the form of a disc or ring having an outer diameter which is greater than an outer diameter of the tubular body portion (B).

2. The module tape of claim 1, wherein:

at least one of the planar element and the tubular body portion comprise ferrite.

3. A method of making an antenna module (AM) interim product comprising:

providing a module tape (MT); and

providing support structure (SS, DS, WC) having a tubular body portion (B) on a surface of the module tape, the tubular body portion having an end on the surface of the module tape and a free end;

characterized by;

disposing a planar element (LD, CP, PT) against the free end of the body portion;

wherein the planar element is in the form of a ring, and further comprising;

with the planar element (LD, CP, PT) in place on the tubular body portion (B), filling an interior area of the body portion (B) with encapsulant (GT).

4. The method of claim 3, wherein:

the support structure (SS, DS, WC) is formed on the module tape (MT) by an additive process.