Solid-state imaging apparatus and imaging system

• US 9,113,103 B2
• Filed: 12/11/2014
• Issued: 08/18/2015
• Est. Priority Date: 07/07/2010
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Matsuda, Takashi, Kikuchi, Shin, Koizumi, Toru
• Primary Examiner(s): CHEN, CHIA WEI A
• Application Number:
  US14/567,226
• Publication Number:
  US 20150092095A1
• Time in Patent Office: 250 Days
• Field of Search: 348294-310
• US Class Current: 1/1
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14663 Indirect radiation imagers, e.g. using luminescent members
• CPC Class Codes: H04N 25/41 Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
• CPC Class Codes: H04N 25/75 Circuitry for providing, modifying or processing image signals from the pixel array
• CPC Class Codes: H04N 25/77 Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
• CPC Class Codes: H04N 5/32 Transforming X-rays cameras or camera modules for generating image signals from X-rays H04N23/30; circuitry of SSIS for transforming X-rays into image signals H04N25/30

Abstract

A solid-state imaging apparatus includes a pixel array in which a plurality of pixels are arranged, wherein the pixel array has a region formed from one of an electrical conductor and a semiconductor to which a fixed electric potential is supplied, each pixel includes a photoelectric converter, a charge-voltage converter which converts charges generated by the photoelectric converter into a voltage, and an amplification unit which amplifies a signal generated by the charge-voltage converter by a positive gain and outputs the amplified signal to an output line, and the output line comprising a shielding portion arranged to shield at least part of the charge-voltage converter with respect to the region.

Claims

1. A solid-state imaging apparatus including a semiconductor substrate having a pixel array in which a plurality of pixels are arranged to form rows and columns, wherein

the semiconductor substrate includes a semiconductor region to which a fixed electric potential is applied,

each of the plurality of pixels includes a photoelectric converter having a charge storage portion, a charge-voltage converter configured to convert charges generated by the photoelectric converter into a voltage, and an amplification unit configured to amplify, with a positive gain, the voltage of the charge-voltage converter and to output the amplified signal to an output line,

the output line includes a first conductive pattern arranged in a first wiring layer,

the charge-voltage converter includes a second conductive pattern arranged in a second wiring layer that is arranged above the first wiring layer, a first connection connecting the charge storage portion and the second conductive pattern, and a second connection connecting an input of the amplification unit and the second conductive pattern,

the charge storage portion, the second conductive pattern, the first connection, the second connection and the input of the amplification unit form a common node, and

the first conductive pattern is arranged along a part of the second conductive pattern and between the second conductive pattern and the semiconductor region.

2. The apparatus according to claim 1, wherein each of the plurality of pixels includes a second amplification unit configured to amplify an output signal output from the amplification unit.

3. The apparatus according to claim 1, wherein a third wiring layer is arranged above the second wiring layer, the third wiring layer including an opening that overlaps with the charge storage portion in a plan view, and a part of the second conductive pattern is arranged in the opening in the plan view.

4. The apparatus according to claim 1, wherein the first conductive pattern and the second conductive pattern have an overlapped area where the first conductive pattern and the second conductive pattern overlap with each other in a plan view, a part of the overlapped area is arranged in the opening.

5. The apparatus according to claim 4, wherein each of the first conductive pattern and the second conductive pattern includes a portion that overlaps with the charge storage portion.

6. The apparatus according to claim 1, wherein the amplification unit includes a source follower.

7. The apparatus according to claim 1, further comprising a scintillator, wherein light generated by the scintillator is photoelectrically converted by the photoelectric converter.

8. The apparatus according to claim 1, wherein the solid-state imaging apparatus is incorporated in an imaging system that includes a processor that processes a signal output from the solid-state imaging apparatus.