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Systems and methods for encapsulating electronics in a mountable device

  • US 9,113,829 B2
  • Filed: 03/27/2013
  • Issued: 08/25/2015
  • Est. Priority Date: 03/27/2013
  • Status: Active Grant
First Claim
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1. A mountable device, comprising:

  • a polymer, wherein the polymer defines at least one mounting surface of the mountable device; and

    a bio-compatible structure embedded in the polymer, wherein the bio-compatible structure comprises;

    a first layer of bio-compatible material;

    an integrated circuit disposed on the first layer of bio-compatible material, wherein the integrated circuit has a first surface adhered to the first layer of bio-compatible material and a second surface opposite the first surface, wherein the second surface of the integrated circuit includes electrical contacts;

    a second layer of bio-compatible material disposed on the first layer of bio-compatible material, wherein the second layer of bio-compatible material has a surface that is substantially flush with the second surface of the integrated circuit;

    sensor electrodes and electrical interconnects between the sensor electrodes and the electrical contacts, wherein the sensor electrodes and electrical interconnects are disposed on the surface of the second layer of bio-compatible material; and

    a third layer of bio-compatible material disposed on the second layer of bio-compatible material, wherein the integrated circuit is fully encapsulated by the first, second, and third layers of bio-compatible material.

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