Systems and methods for encapsulating electronics in a mountable device
First Claim
1. A mountable device, comprising:
- a polymer, wherein the polymer defines at least one mounting surface of the mountable device; and
a bio-compatible structure embedded in the polymer, wherein the bio-compatible structure comprises;
a first layer of bio-compatible material;
an integrated circuit disposed on the first layer of bio-compatible material, wherein the integrated circuit has a first surface adhered to the first layer of bio-compatible material and a second surface opposite the first surface, wherein the second surface of the integrated circuit includes electrical contacts;
a second layer of bio-compatible material disposed on the first layer of bio-compatible material, wherein the second layer of bio-compatible material has a surface that is substantially flush with the second surface of the integrated circuit;
sensor electrodes and electrical interconnects between the sensor electrodes and the electrical contacts, wherein the sensor electrodes and electrical interconnects are disposed on the surface of the second layer of bio-compatible material; and
a third layer of bio-compatible material disposed on the second layer of bio-compatible material, wherein the integrated circuit is fully encapsulated by the first, second, and third layers of bio-compatible material.
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Accused Products
Abstract
A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.
186 Citations
9 Claims
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1. A mountable device, comprising:
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a polymer, wherein the polymer defines at least one mounting surface of the mountable device; and a bio-compatible structure embedded in the polymer, wherein the bio-compatible structure comprises; a first layer of bio-compatible material; an integrated circuit disposed on the first layer of bio-compatible material, wherein the integrated circuit has a first surface adhered to the first layer of bio-compatible material and a second surface opposite the first surface, wherein the second surface of the integrated circuit includes electrical contacts; a second layer of bio-compatible material disposed on the first layer of bio-compatible material, wherein the second layer of bio-compatible material has a surface that is substantially flush with the second surface of the integrated circuit; sensor electrodes and electrical interconnects between the sensor electrodes and the electrical contacts, wherein the sensor electrodes and electrical interconnects are disposed on the surface of the second layer of bio-compatible material; and a third layer of bio-compatible material disposed on the second layer of bio-compatible material, wherein the integrated circuit is fully encapsulated by the first, second, and third layers of bio-compatible material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification