Components of an electronic device and methods for their assembly

• US 9,114,487 B2
• Filed: 09/11/2012
• Issued: 08/25/2015
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Kiple, Bryan P., Woodhull, Charles B., Pakula, David A., Tan, Tang Y.
• Primary Examiner(s): WYCHE, MYRON
• Application Number:
  US13/610,773
• Publication Number:
  US 20130320823A1
• Time in Patent Office: 1,078 Days
• Field of Search: 455/575.1, 361/679.01, 606/71
• US Class Current: 1/1
• CPC Class Codes: B23C 2220/04 Milling with the axis of the cutter inclined to the surface being machined
• CPC Class Codes: B23C 2220/16 Chamferring
• CPC Class Codes: B23C 2220/20 Deburring
• CPC Class Codes: B23C 2220/28 Finishing
• CPC Class Codes: B23C 2220/48 Methods of milling not otherwise provided for
• CPC Class Codes: B23C 2226/31 Diamond
• CPC Class Codes: B23C 2226/315 polycrystalline [PCD]
• CPC Class Codes: B23C 5/00 Milling-cutters for cutting gear-teeth B23F21/12
• CPC Class Codes: B23C 5/1081 with permanently fixed cutting inserts B23C5/1018 and B23C5/1063 take precedence
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 17/00 Metal-working operations, not covered by a single other subclass or another group in this subclass
• CPC Class Codes: B23P 17/02 Single metal-working processes; Machines or apparatus therefor
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 11/12 Anodising more than once, e.g. in different baths
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: C25D 11/34 of metals or alloys not provided for in groups C25D11/04 - C25D11/32
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 : Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0254 : comprising one or a plurality of mechanically detachable modules
• CPC Class Codes: H04M 1/11 : Supports for sets, e.g. incorporating armrests
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/02 : Details
• CPC Class Codes: H05K 5/0217 : Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0243 : for decorative purposes
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 : Covers
• CPC Class Codes: H05K 5/04 : Metal casings
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 29/47 : Burnishing
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 407/1906 : including holder [i.e., head] having seat for inserted tool
• CPC Class Codes: Y10T 409/300896 : with sensing of numerical information and regulation without mechanical connection between sensing means and regulated means [i.e., numerical control]
• CPC Class Codes: Y10T 409/303752 : Process
• CPC Class Codes: Y10T 409/30952 : with cutter holder

Abstract

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Claims

1. An electronic device housing, comprising:

a plurality of electrically conductive housing sections, wherein each one of the electrically conductive housing sections is separate and distinct from the other electrically conductive housing sections;

a plurality of dielectric coupling members configured to couple the plurality of housing sections together to form a five-sided housing comprising a base and four sidewalls, the plurality of dielectric coupling members electrically isolating each of the electrically conductive housing sections from each other; and

a cover glass coupled to an edge of each sidewall of the five-sided housing, opposite the base.

2. The electronic device housing of claim 1, wherein the plurality of conductive housing sections comprise a first section, a second section and a third section, the second section is coupled to a first end of the first section with a first dielectric coupling member and the third section is coupled to a second end of the first section with a second dielectric coupling member.

3. The electronic device housing of claim 2, wherein the first section comprises a planar region and two sidewalls extending from opposite ends of the planar region forming portions of the five-sided housing.

4. The electronic device housing of claim 3, wherein the second and third sections each comprise a U-shaped sidewall that forms a portion of the five-sided housing.

5. The electronic device housing of claim 2, wherein the first and second dielectric coupling members span a width of the electronic device housing.

6. The electronic device housing of claim 5, further comprising a first cover plate secured to the first dielectric coupling member and a second cover plate secured to the second dielectric coupling member, wherein surfaces of the first and second cover plates are co-planar with a back surface of the planar region of the first section.

7. The electronic device housing of claim 6, wherein the first and second cover plates comprise at least one of pigmented glass, ceramic glass, and sapphire.

8. The electronic device housing of claim 1, wherein each one of the dielectric coupling members comprises first and second injection molded components, wherein the first injection molded component is disposed internally such that the first injection molded component forms a bond between two housing sections, and wherein the second injection molded component defines a cosmetic surface of the electronic device housing.

9. The electronic device housing of claim 1, wherein the plurality of housing sections are machined from extruded metal.

10. A housing for an electronic device, the housing comprising:

a first housing section comprising a planar region having first and second ends, the planar region includes a plurality of expanding channels defined by the first end;

a second housing section comprising a U-shaped sidewall, wherein the U-shaped sidewall defines a plurality of recesses; and

a dielectric coupling member configured to couple the first and second housing sections, comprising;

a first region having a plurality of edge interface features that are locked within the expanding channels defined by the first end of the first housing section such that the first housing section is electrically isolated from the second housing section; and

a second region having a plurality of protrusions that are disposed within the plurality of recesses of the second housing section.

11. The housing for the electronic device as recited in claim 10, wherein the second region of the dielectric coupling member is mechanically attached to the second housing section via a plurality of fasteners inserted through both the plurality of recesses of the second housing section and the plurality of protrusions of the second region of the dielectric coupling member.

12. The housing for the electronic device as recited in claim 10, wherein the plurality of expanding channels span an entire width of the first end of the planar region.

13. The housing for the electronic device as recited in claim 10, wherein an expanding channel comprises a first portion defined by the first end of the planar region, and a second portion defined by the planar region, wherein the second portion is wider than the first portion.

14. The housing for the electronic device as recited in claim 10, wherein the first and second regions of the dielectric coupling member comprise either polyaryletherketone (“

PAEK”

) or polyether ether ketone (“

PEEK”

).

15. The housing for the electronic device as recited in claim 10, wherein the dielectric coupling member is a first dielectric coupling member and wherein the housing further comprises:

a third housing section comprising a U-shaped sidewall, wherein the U-shaped sidewall defines a plurality of retention holes; and

a second dielectric coupling member configured to couple the first and third housing sections at the second end of the planar region of the first housing section, wherein the second end is opposite the first end.

16. The housing for the electronic device as recited in claim 10, wherein the first housing section further comprises:

a first sidewall adjacent to the first end and positioned on a periphery of the planar region, the first sidewall defining a first sidewall locking feature on a first end section that is parallel to the first end of the planar region; and

a second sidewall opposite the first sidewall, the second sidewall defining a second sidewall locking feature on a first end section parallel to the first end of the planar region.

17. The housing for the electronic device as recited in claim 16, wherein the second housing section further comprises two sidewall locking mechanisms defined on both ends of the U-shaped sidewall.

18. The housing for the electronic device as recited in claim 17, wherein the dielectric coupling member further comprises sidewall interface features disposed within both the first and second sidewall locking features of the first and second sidewalls, and the two sidewall locking mechanisms of the second housing section such that the first and second housing sections remain electrically isolated.

19. A housing for an electronic device, the housing comprising:

a first housing section;

a second housing section defining a plurality of recesses; and

a dielectric coupling member configured to couple the first housing section to the second housing section, the dielectric coupling member comprising a first portion joined to the first housing section, and a second portion joined to the second housing section,

wherein the dielectric coupling member prevents direct contact between the first housing section and the second housing section and electrically isolates the first housing section from the second housing section.

20. The housing as recited in claim 19, wherein a first end of the first housing section defines a plurality of expanding channels.

21. The housing as recited in claim 20, wherein the first portion of the dielectric coupling member comprises a plurality of edge interface features that are locked within the expanding channels defined by the first end of the first housing section.

22. The housing as recited in claim 21, wherein the plurality of expanding channels span an entire width of the first housing section.

23. The housing as recited in claim 19, wherein the second portion of the dielectric coupling member comprises a plurality of protrusions that are disposed within the plurality of recesses of the second housing section.

24. The housing as recited in claim 19, wherein the dielectric coupling member is a first dielectric coupling member and wherein the housing further comprises:

a third housing section; and

a second dielectric coupling member that couples the first and third housing sections, the second dielectric coupling member comprising a first portion joined to the first housing section, and a second portion opposite the first portion that is joined to the third housing section,

wherein the second dielectric coupling member prevents direct contact between the first housing section and the third housing section and electrically isolates the first housing section from the third housing section.