Compact sensor module

• US 9,116,022 B2
• Filed: 12/07/2012
• Issued: 08/25/2015
• Est. Priority Date: 12/07/2012
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Bolognia, David
• Primary Examiner(s): Karimy, Timor
• Application Number:
  US13/708,727
• Publication Number:
  US 20140159226A1
• Time in Patent Office: 991 Days
• Field of Search: 257/713, 257/773, 257/719, 257/675, 257/706, 257/796, 257/E23.051, 257/E23.101, 257/417, 257/415, 257/418, 257/253, 257/254
• US Class Current: 1/1
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14661 of the hybrid type
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate having a mounting segment and a first wing segment extending from the mounting segment. The first wing segment may be folded around an edge of the stiffener. A sensor die may be mounted on the mounting segment of the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.

Claims

1. A sensor module comprising:

a stiffener;

a sensor substrate having a mounting segment and a first wing segment extending from the mounting segment, the first wing segment folded around an edge of the stiffener;

a sensor die mounted on the mounting segment of the sensor substrate;

a processor substrate coupled to the sensor substrate; and

a processor die mounted on the processor substrate and in electrical communication with the sensor die.

2. The sensor module of claim 1, wherein the processor substrate is electrically and mechanically coupled to the sensor substrate.

3. The sensor module of claim 1, further comprising a second sensor die mounted adjacent the sensor die on the mounting segment of the sensor substrate.

4. The sensor module of claim 3, further comprising a third sensor die and a fourth sensor die mounted adjacent one another on the mounting segment of the sensor substrate.

5. The sensor module of claim 1, further comprising a heat spreader and a carrier, the carrier disposed between the stiffener and the heat spreader, wherein the stiffener is directly mechanically connected to the heat spreader.

6. The sensor module of claim 5, wherein a wall transverse to the heat spreader mechanically connects the stiffener and the heat spreader.

7. The sensor module of claim 6, wherein the wall extends through an aperture of the carrier.

8. The sensor module of claim 6, wherein the wall is integrally formed as part of the stiffener, the wall extending transversely from a base portion of the stiffener.

9. The sensor module of claim 5, wherein the stiffener is attached to the heat spreader with an adhesive.

10. An imaging device comprising an array of multiple sensor modules, each sensor module in the array comprising the sensor module of claim 1.

11. The imaging device of claim 10, wherein the imaging device is a computed tomography (CT device).

12. The sensor module of claim 1, further comprising a carrier, the processor substrate folded about the carrier about a first axis that is parallel to a second axis about which the first wing segment of the sensor substrate is folded.

13. The sensor module of claim 1, further comprising a carrier to which the processor substrate is coupled, wherein the sensor substrate, the stiffener, the carrier, and the processor substrate are disposed between the processor die and the sensor die.

14. The sensor module of claim 13, further comprising a radiation shield positioned between the processor die and the sensor die.

15. A sensor module comprising:

a stiffener;

a sensor substrate having a mounting segment and a first wing segment extending from the mounting segment, the first wing segment folded around an edge of the stiffener;

a sensor die mounted on the mounting segment of the sensor substrate;

a processor substrate coupled to the sensor substrate;

a processor die mounted on the processor substrate and in electrical communication with the sensor die; and

a second processor substrate, wherein the processor substrate is positioned below the sensor die and the second processor substrate is positioned below the second sensor die, wherein the processor substrate and the second processor substrate are coupled to the sensor substrate on a side of the stiffener opposite the sensor dies.

16. The sensor module of claim 15, wherein the sensor die and the second sensor die are positioned adjacent one another in a direction substantially parallel to an axis about which the sensor substrate is folded.

17. The sensor module of claim 16, wherein the processor substrate and the second processor substrate are folded about an axis substantially parallel to the axis about which the sensor substrate is folded.

18. The sensor module of claim 17, further comprising a third processor substrate and a fourth processor substrate, wherein the third processor substrate is positioned below the sensor die adjacent the processor substrate in a direction transverse to the axis about which the sensor substrate is folded, and wherein the fourth processor substrate is positioned below the second sensor die adjacent the second processor substrate in a direction transverse to the axis about which the sensor substrate is folded.

19. The sensor module of claim 15, further comprising a carrier configured to support the sensor module, wherein the processor substrate and the second processor substrate are folded about the carrier.

20. The sensor module of claim 19, further comprising a second processor die, wherein each of the processor substrate and the second processor substrate includes a first mounting segment folded over a first side of the carrier and a second mounting segment folded over a second side of the carrier opposite the first side of the carrier, and wherein the processor die and the second processor die are mounted on the second mounting segments of the processor substrate and the second processor substrate.

21. The sensor module of claim 20, further comprising a connector extending through the sensor module and electrically coupled to the second mounting segments of the processor substrate and the second processor substrate, the connector configured to provide electrical communication to an external device.

22. The sensor module of claim 20, further comprising a radiation shield positioned below the sensor die, the radiation shield positioned in a recess on the first side of the carrier between the first mounting segment of the processor substrate and the carrier.

23. A sensor module comprising:

a stiffener;

a sensor substrate supported by the stiffener;

a sensor die mounted on and in electrical communication with the sensor substrate;

a processor substrate in electrical communication with the sensor substrate;

a processor die mounted on the processor substrate below the sensor die, wherein the processor die is in electrical communication with the sensor die through the processor substrate and the sensor substrate;

a heat spreader below the processor die;

a carrier housing between the stiffener and the heat spreader; and

a wall connecting the stiffener to the heat spreader.

24. The sensor module of claim 23, wherein the wall extends through an aperture in the carrier housing.

25. The sensor module of claim 23, wherein the wall is integrally formed as part of the stiffener, the wall extending transversely from a base portion of the stiffener.

26. The sensor module of claim 23, wherein a wing segment of the sensor substrate is folded around an edge of the stiffener, and wherein a portion of the processor substrate is folded around an edge of the carrier.