MEMS scanning mirror field of view provision methods and apparatus

• US 9,116,350 B2
• Filed: 03/11/2013
• Issued: 08/25/2015
• Est. Priority Date: 03/11/2013
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Freedman, Barak, Hirshberg, Arnon
• Primary Examiner(s): Sugarman, Scott J
• Assistant Examiner(s): Mebrahtu, Ephrem
• Application Number:
  US13/997,986
• Publication Number:
  US 20140253992A1
• Time in Patent Office: 897 Days
• Field of Search: 359/198.1, 359/207.9, 359/214.1
• US Class Current: 1/1
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: G02B 26/105 with one or more pivoting mirrors or galvano-mirrors G02B26/101 takes precedence

Abstract

Embodiments of the present disclosure provide techniques and configurations for an optoelectronic assembly including a MEMS scanning mirror. In one embodiment, the MEMS scanning mirror may include a micro-scale mirror configured to be rotatable about a chord axis of the mirror to deflect an incident light beam into an exit window of the optoelectronic assembly, and a support structure configured to host the mirror to provide a light delivery field between a mirror surface and the exit window such that a path of the deflected light beam via the provided light delivery field to the exit window is un-obstructed. Other embodiments may be described and/or claimed.

Claims

1. An apparatus for providing a micro-electromechanical system (MEMS) scanning mirror unobstructed field of view, comprising:

an optoelectronic assembly associated with a laser device, wherein the assembly includes a MEMS scanning mirror having a field of view, and wherein the MEMS scanning mirror includes;

a substrate having at least a top layer; and

a micro scale mirror having a substantially oval or circular shape, embedded in the top layer of the substrate, wherein the mirror is rotatable about a chord axis of the mirror to deflect a beam from the laser device, and wherein the top layer includes a cutout at one side, dimensioned to reduce obstruction of the mirror to enlarge the field of view, wherein the cutout comprises at least two cutout edges, wherein each cutout edge extends to an edge of the top layer to form a determined angle with the edge of the top layer.

2. The apparatus of claim 1, wherein the cutout is selected from one of a trapezoid-like shape or rectangular-like shape.

3. The apparatus of claim 1, wherein the mirror is disposed substantially flushed with the top layer of the multi-layer substrate.

4. The apparatus of claim 1, wherein the substrate includes a bottom layer to provide support for the MEMS scanning mirror, and wherein a frame defining the substrate includes an opening corresponding to the cutout disposed at the one side of the top layer.

5. The apparatus of claim 1, wherein the chord axis of rotation of the mirror is offset from a center axis of the substrate.

6. The apparatus of claim 1, wherein the chord axis is a center axis of the mirror.

7. The apparatus of claim 1, wherein the optoelectronic assembly is embedded in the laser device and configured to deflect an incident laser beam produced by the laser device, within the field of view.

8. The apparatus of claim 7, wherein the mirror is to receive the incident laser beam with the mirror rotated to a position at an angle of about 45 degrees from a rest position.

9. The apparatus of claim 1, wherein the mirror comprises silicon (Si).

10. An apparatus for providing a micro-electromechanical system (MEMS) scanning mirror unobstructed field of view, comprising:

an optoelectronic assembly, including;

a MEMS scanning mirror having a field of view;

a polarizing beam splitter to;

receive an incident beam that is provided substantially parallel to a plane of the MEMS scanning mirror in a non-rotated position;

split the incident beam; and

polarize at least a portion of the incident beam into a reflected beam, to direct the reflected beam at the MEMS scanning mirror; and

a phase retardation plate placed between the MEMS scanning mirror and the polarizing beam splitter, to rotate polarization of the reflected beam before the reflected beam enters the MEMS scanning minor;

wherein the MEMS scanning mirror is to receive the reflected beam with rotated polarization under a substantially direct angle and deflect the received beam within the field of view,

wherein the phase retardation plate is to further rotate polarization of the beam deflected by the MEMS scanning mirror,

wherein the polarizing beam splitter is further to transmit the beam deflected by the MEMS scanning mirror after the beam passes through the retardation plate and the polarization of the deflected beam has been further rotated by the retardation plate.

11. The apparatus of claim 10, wherein the apparatus further comprises a laser device, wherein the optoelectronic assembly is embedded in the laser device and configured to transform an incident laser beam produced by the laser device into an exit beam within the field of view.

12. The apparatus of claim 11, wherein the polarizing beam splitter is to direct the reflected beam at the MEMS scanning mirror at a substantially direct angle relative to a plane of the scanning mirror.

13. The apparatus of claim 12, wherein the MEMS scanning mirror is to be at least partially rotatable relative to a resting plane of the MEMS scanning mirror.

14. The apparatus of claim 10, wherein the phase retardation plate is to rotate the polarization of the beam reflected by the polarizing beam splitter by about 45 degrees and to further rotate the polarization of the beam deflected by the scanning mirror by about 45 degrees.