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Heat dissipation in computing device

  • US 9,116,674 B2
  • Filed: 10/16/2013
  • Issued: 08/25/2015
  • Est. Priority Date: 04/24/2001
  • Status: Active Grant
First Claim
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1. A computing device, comprising:

  • an enclosure arranged to enclose a heat generating component, at least a portion of the enclosure formed of a thermally conductive material; and

    an integrated heat exchanger arranged to dissipate heat from the heat generating component, the heat exchanger comprising;

    a rib portion as part of a chassis system configured to provide structural support for the enclosure, the rib portion thermally coupled with the thermally conductive material of the enclosure, anda heat sink portion integrally formed with the rib portion and thermally coupled with the heat generating component, wherein heat from the heat generating component is transferred from the heat generating component to the heat sink portion, from the heat sink portion to the rib portion, and from the rib portion to the thermally conductive material of the enclosure.

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