Heat dissipation in computing device
First Claim
1. A computing device, comprising:
- an enclosure arranged to enclose a heat generating component, at least a portion of the enclosure formed of a thermally conductive material; and
an integrated heat exchanger arranged to dissipate heat from the heat generating component, the heat exchanger comprising;
a rib portion as part of a chassis system configured to provide structural support for the enclosure, the rib portion thermally coupled with the thermally conductive material of the enclosure, anda heat sink portion integrally formed with the rib portion and thermally coupled with the heat generating component, wherein heat from the heat generating component is transferred from the heat generating component to the heat sink portion, from the heat sink portion to the rib portion, and from the rib portion to the thermally conductive material of the enclosure.
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Accused Products
Abstract
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
107 Citations
15 Claims
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1. A computing device, comprising:
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an enclosure arranged to enclose a heat generating component, at least a portion of the enclosure formed of a thermally conductive material; and an integrated heat exchanger arranged to dissipate heat from the heat generating component, the heat exchanger comprising; a rib portion as part of a chassis system configured to provide structural support for the enclosure, the rib portion thermally coupled with the thermally conductive material of the enclosure, and a heat sink portion integrally formed with the rib portion and thermally coupled with the heat generating component, wherein heat from the heat generating component is transferred from the heat generating component to the heat sink portion, from the heat sink portion to the rib portion, and from the rib portion to the thermally conductive material of the enclosure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated heat exchanger configured to dissipate heat generated from a heat generating component within an enclosure of a computing device, the integrated heat exchanger comprising:
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a support portion configured to provide structural support for the enclosure, the support portion thermally coupled with a thermally conductive section of the enclosure; and a heat sink portion integrally connected with the support portion and thermally coupled with the heat generating component, the heat sink portion having a fin portion and a body portion, the body portion having a planar surface that substantially covers a surface of the heat generating component, wherein heat from the heat generating component is transferred from the heat generating component to the heat sink portion, from the heat sink portion to the support portion, and from the support portion to the thermally conductive section of the enclosure. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification