Circuit board and circuit module

• US 9,118,105 B2
• Filed: 12/02/2014
• Issued: 08/25/2015
• Est. Priority Date: 05/14/2009
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Sasaki, Jun
• Primary Examiner(s): DINH, TRINH VO
• Application Number:
  US14/557,609
• Publication Number:
  US 20150084822A1
• Time in Patent Office: 266 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 1/20 Resilient mountings
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/06 with core of ferromagnetic material H01Q7/02 takes precedence
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/0281 Reinforcement details thereof
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/05 Flexible printed circuits [FPCs]
• CPC Class Codes: H05K 2201/09336 Signal conductors in same plane as power plane
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 3/4632 : laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets

Abstract

A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.

Claims

1. A circuit board, comprising:

a first board portion and a second board portion each including insulating layers made of a flexible material;

an antenna coil including coil conductors provided on the insulating layers in the first board portion;

wiring conductors provided on the insulating layers in the second board portion and electrically connected to the antenna coil; and

a magnetic substance layer;

wherein

the first board portion and the second board portion are arranged so as to include regions that face each other; and

the magnetic substance layer is provided with the first board portion and is located between the coil conductors of the first board portion and the wiring conductors of the second board portion.

2. The circuit board according to claim 1, wherein a board body, which includes the first board portion and the second board portion, is bent such that the first board portion and the second board portion include the regions facing each other.

3. The circuit board according to claim 1, wherein the magnetic substance layer has an area size that is larger than an area size of the first board portion in plan view.

4. The circuit board according to claim 1, wherein electronic components electrically connected to the wiring conductors are mounted on a principal surface of the second board portion, which is opposite to the region of the second board portion that faces the region of the first board portion.