Chamber matching for power control mode
First Claim
1. A method for performing chamber-to-chamber matching, the method comprising:
- executing a first test within a first plasma chamber to measure a variable, wherein the first test is executed under a condition that places the first plasma chamber in a no plasma zone;
executing a second test within a second plasma chamber to measure the variable, wherein the first and second tests are executed based on one recipe, wherein the second test is executed under a condition that places the second plasma chamber in the no plasma zone;
determining a first relationship between the variable measured with the first test and power provided during the first test;
determining a second relationship between the variable measured with the second test and power provided during the second test; and
identifying power adjustment to apply to the second plasma chamber during a subsequent processing operation based on the first and second relationships, the power adjustment causing the second plasma chamber to perform the processing operation in a processing condition determined using the first plasma chamber, wherein during the processing operation, plasma is stricken within the second plasma chamber.
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Accused Products
Abstract
Systems and methods for performing chamber matching are described. One of the methods for performing chamber matching includes executing a first test within a first plasma chamber to measure a variable and executing a second test within a second plasma chamber to measure the variable. The first and second tests are executed based on one recipe. The method further includes determining a first relationship between the variable measured with the first test and power provided during the first test, determining a second relationship between the variable measured with the second test and power provided during the second test, and identifying power adjustment to apply to the second plasma chamber during a subsequent processing operation based on the first and second relationships. The power adjustment causes the second plasma chamber to perform the processing operation in a processing condition determined using the first plasma chamber.
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Citations
24 Claims
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1. A method for performing chamber-to-chamber matching, the method comprising:
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executing a first test within a first plasma chamber to measure a variable, wherein the first test is executed under a condition that places the first plasma chamber in a no plasma zone; executing a second test within a second plasma chamber to measure the variable, wherein the first and second tests are executed based on one recipe, wherein the second test is executed under a condition that places the second plasma chamber in the no plasma zone; determining a first relationship between the variable measured with the first test and power provided during the first test; determining a second relationship between the variable measured with the second test and power provided during the second test; and identifying power adjustment to apply to the second plasma chamber during a subsequent processing operation based on the first and second relationships, the power adjustment causing the second plasma chamber to perform the processing operation in a processing condition determined using the first plasma chamber, wherein during the processing operation, plasma is stricken within the second plasma chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for performing intra-chamber matching, the method comprising:
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executing a first test to measure a variable associated with a plasma chamber, the plasma chamber is in a first condition during execution of the first test, wherein during execution of the first test, the plasma chamber is operated to be in a no plasma zone; executing a second test to measure the variable associated with the plasma chamber, the plasma chamber is in a second condition during execution of the second test, wherein during execution of the second test, the plasma chamber is operated to be in the no plasma zone; determining a first relationship between the variable measured using the first test and power provided during the first test; determining a second relationship between the variable measured using the second test and power provided during the second test; and identifying power adjustment to apply to the plasma chamber during a subsequent processing operation based on the first and second relationships, the power adjustment causing the plasma chamber to perform the processing operation in a processing condition, the processing condition determined when the plasma chamber is in the first condition, wherein during the processing operation, plasma is stricken within the plasma chamber. - View Dependent Claims (16, 17)
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18. A plasma system for performing chamber-to-chamber matching, the plasma system comprising:
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a first plasma chamber used to execute a first test to measure a variable, wherein the first plasma chamber is configured to operate in a no plasma zone during execution of the first test; a radio frequency (RF) transmission line coupled to the first plasma chamber for communicating an RF signal to the first plasma chamber; an impedance matching circuit coupled to the RF transmission line; an RF generator coupled to the impedance matching circuit for supplying an RF signal to the impedance matching circuit; a second plasma chamber used to execute a second test to measure the variable, wherein the first and second tests are executed based on one recipe, wherein the second test is executed after decoupling the first plasma chamber from the RF transmission line and coupling the second plasma chamber to the RF transmission line, wherein the second plasma chamber is configured to operate in the no plasma zone during execution of the second test; and a host system including a processor, the host system coupled to the RF generator, the processor configured to; determine a first relationship between the variable measured with the first test and power provided during the first test; determine a second relationship between the variable measured with the second test and power provided during the second test; and identify power adjustment to apply to the second plasma chamber during a subsequent processing operation based on the first and second relationships, the power adjustment causing the second plasma chamber to perform the processing operation in a processing condition determined using the first plasma chamber. - View Dependent Claims (20, 21, 22)
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19. A plasma system for performing intra-chamber matching, the plasma system comprising:
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a plasma chamber used to execute a first test to measure a variable, the plasma chamber is in a first condition during execution of the first test, wherein the plasma chamber is configured to operate in a no plasma zone during execution of the first test, the plasma chamber used to execute a second test to measure the variable, the plasma chamber is in a second condition during execution of the second test, wherein the plasma chamber is configured to operate in the no plasma zone during execution of the second test; a radio frequency (RF) transmission line coupled to the plasma chamber for communicating an RF signal to the plasma chamber; an impedance matching circuit coupled to the RF transmission line; an RF generator coupled to the impedance matching circuit for supplying an RF signal to the impedance matching circuit; and a host system including a processor, the host system coupled to the RF generator, the processor configured to; determine a first relationship between the variable measured using the first test and power provided during the first test; determine a second relationship between the variable measured using the second test and power provided during the second test; and identify power adjustment to apply to the plasma chamber during a subsequent processing operation based on the first and second relationships, the power adjustment causing the plasma chamber to perform the processing operation in a processing condition, the processing condition determined when the plasma chamber is in the first condition. - View Dependent Claims (23, 24)
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Specification