Light emitting device including a light emitting element mounted on a sub-mount

• US 9,119,304 B2
• Filed: 08/03/2012
• Issued: 08/25/2015
• Est. Priority Date: 06/24/2008
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Yu-Sik, Han, Woo-Sung
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US13/566,291
• Publication Number:
  US 20130001606A1
• Time in Patent Office: 1,117 Days
• Field of Search: 361782-784, 361760-764, 361/803, 257/13, 257 88- 98
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/09254 Branched layout
• CPC Class Codes: H05K 2201/09318 Core having one signal plane and one power plane
• CPC Class Codes: H05K 2201/0949 Pad close to a hole, not surrounding the hole if used for surface mounting H05K1/114
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing programmable, customizable or modifiable circuits H05K1/0286

Abstract

A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes.

Claims

1. A sub-mount comprising:

a base substrate having a plurality of vias extending through the base substrate;

a plurality of mounting portions formed on a first surface of the base substrate and on which at least one light emitting element is mounted, at least one mounting portion being electrically connected with more than one light emitting elements;

wiring portions to connect respective mounting portions together;

a transparent resin layer formed on a phosphor layer on the at least one light emitting element and the mounting portions; and

first and second electrode pads formed on a second surface of the base substrate and electrically connected to the mounting portions,

wherein the plurality of mounting portions are arranged in a matrix pattern along a first direction and a second direction,

wherein at least a portion of the wiring portions connect the plurality of mounting portions along a third direction formed at an acute angle with respect to each of the first direction and the second direction.

2. The sub-mount of claim 1, wherein the base substrate includes at least one of silicon (Si), strained Si, Si alloy, silicon-on-insulator (SOI), silicon carbide (SiC), silicon germanium (SiGe), silicon germanium carbide (SiGeC), germanium (Ge), Ge alloy, gallium arsenide (GaAs), indium arsenide (InAs), aluminum nitride (AIN), polymer, ceramic, plastic, a combination thereof, and a laminate thereof.

3. The sub-mount of claim 1, wherein the first and second electrode pads include at least one of copper (Cu), aluminum (Al), silver (Ag), gold (Au), tungsten (W), platinum (Pt), tin (Ti), zinc (Zn), nickel (Ni), a combination thereof, and a laminate thereof.

4. The sub-mount of claim 1, wherein the light emitting element is at least one of a UV light emitting device generating UV light and a blue light emitting device generating blue light that is light having a blue wavelength.

5. The sub-mount of claim 1, wherein the light emitting element is a flip chip type light emitting element.

6. The sub-mount of claim 1, wherein the phosphor layer is a material which absorbs light from the light emitting element and converts the light into light having a different wavelength, and includes at least one selected from the group consisting of a nitride-based or oxynitride-based phosphor, mainly activated by lanthanoids such as Eu and Ce.

7. The sub-mount of claim 1, wherein the phosphor layer is conformally formed on the light emitting element.

8. A sub-mount comprising:

a base substrate having a plurality of vias extending through the base substrate;

a mounting portion formed on a first surface of the base substrate and on which more than one light emitting elements are mounted;

wiring portions to connect respective mounting portions together;

a transparent resin layer formed on a phosphor layer on the light emitting elements and the mounting portion; and

first and second electrode pads formed on a second surface of the base substrate and electrically connected to the mounting portion,

the plurality of vias electrically connecting the light emitting elements to the first and second electrode pads,

wherein the plurality of mounting portions are arranged in a matrix pattern along a first direction and a second direction,

wherein at least a portion of the wiring portions connect the plurality of mounting portions along a third direction formed at an acute angle with respect to each of the first direction and the second direction.

9. The sub-mount of claim 8, further comprising conductive patterns on the first surface of the base substrate between the light emitting elements and the base substrate, the conductive patterns electrically connected to the light emitting elements and the base substrate, the plurality of vias electrically connecting the conductive patterns to the first and second electrode pads.