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Thermal management system and method

  • US 9,119,327 B2
  • Filed: 10/24/2012
  • Issued: 08/25/2015
  • Est. Priority Date: 10/26/2010
  • Status: Active Grant
First Claim
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1. A thermal management system comprising:

  • (a) heat source PCB; and

    (b) support pin;

    whereinsaid support pin comprises metal;

    said support pin comprises a unitary solid cylindrical shaft further comprising;

    (a) solid top heat source PCB insertion shaft further comprising a top registration chamfer;

    (b) solid bottom heat sink PCB insertion shaft further comprising a bottom registration chamfer; and

    (c) solid center support shaft section further comprising;

    top and bottom self-centering inclined peripheral edges, andone or more longitudinal gassing vents formed only on the outer surface of said solid center support shaft;

    said top heat source PCB insertion shaft and said bottom heat sink PCB insertion shaft have cylindrical diameters less than the diameter of said center support shaft section;

    said top heat source PCB insertion shaft, said bottom heat ink PCB insertion shaft, and said center support shaft section form a single solid unitary structure having no voids along their common cylindrical axis; and

    said top and bottom self-centering inclined peripheral edges of said support pin, when making soldered contact with the surface of said heat source PCB and a heat sink PCB, created a low thermal impedance conduction path from said heat source PCB to said heat sink PCB through said support pin and soldered connections on said top and bottom self-centering inclined peripheral edges of said support pin;

    said support pin is configured to float within plated-thru holes present on said heat source PCB and said heat sink PCB during a soldering process used to form said soldered contact.

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