Thermal management system and method

• US 9,119,327 B2
• Filed: 10/24/2012
• Issued: 08/25/2015
• Est. Priority Date: 10/26/2010
• Status: Active Grant

• Current Assignee: Tdk-Lambda Corporation (TDK Corporation)
• Original Assignee: Tdk-Lambda Corporation (TDK Corporation)
• Inventors: Lee, Gordon K. Y., He, Jin, Albrecht, L. Ray III
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): Gafur, Razmeen
• Application Number:
  US13/659,066
• Publication Number:
  US 20130050954A1
• Time in Patent Office: 1,035 Days
• Field of Search: 36167946-67954, 361688-723, 361676-678, 165 801- 805, 165/204.33, 165/185, 174 161- 163, 174 151- 153, 174/547, 174/548, 257718-719, 257/722, 244/53, 24458-459, 454/184, 312/236
• US Class Current: 1/1
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 2201/10871 Leads having an integral insert stop
• CPC Class Codes: H05K 7/20454 with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
• CPC Class Codes: H05K 7/20463 Filling compound, e.g. potted resin
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermal conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Claims

1. A thermal management system comprising:

(a) heat source PCB; and

(b) support pin;

wherein

said support pin comprises metal;

said support pin comprises a unitary solid cylindrical shaft further comprising;

(a) solid top heat source PCB insertion shaft further comprising a top registration chamfer;

(b) solid bottom heat sink PCB insertion shaft further comprising a bottom registration chamfer; and

(c) solid center support shaft section further comprising;

top and bottom self-centering inclined peripheral edges, and

one or more longitudinal gassing vents formed only on the outer surface of said solid center support shaft;

said top heat source PCB insertion shaft and said bottom heat sink PCB insertion shaft have cylindrical diameters less than the diameter of said center support shaft section;

said top heat source PCB insertion shaft, said bottom heat ink PCB insertion shaft, and said center support shaft section form a single solid unitary structure having no voids along their common cylindrical axis; and

said top and bottom self-centering inclined peripheral edges of said support pin, when making soldered contact with the surface of said heat source PCB and a heat sink PCB, created a low thermal impedance conduction path from said heat source PCB to said heat sink PCB through said support pin and soldered connections on said top and bottom self-centering inclined peripheral edges of said support pin;

said support pin is configured to float within plated-thru holes present on said heat source PCB and said heat sink PCB during a soldering process used to form said soldered contact.

2. The thermal management system of claim 1 wherein said heat source PCB and said heat sink PCB are attached via one or more of said support pins using a soldering process selected from a group consisting of:

reflow soldering, wave soldering, and hand soldering.

3. The thermal management system of claim 1 wherein said metal is selected from a group consisting of:

copper, copper alloy, C11000 copper alloy, C11000 half-hard copper alloy, tin-plated-copper, tin-plated-copper-alloy, tin-over-nickel plated C11000 half-hard copper alloy, gold-over-nickel plated C11000 half-hard copper alloy, copper-tellurium alloy, and brass alloy.

4. The thermal management system of claim 1 wherein said one or more longitudinal gassing vents are V-shaped.

5. The thermal management system of claim 1 wherein said one or more longitudinal gassing vents are U-shaped.

6. The thermal management system of claim 1 wherein said one or more longitudinal gassing vents are V-shaped at an angle greater than zero (0) degrees and less than or equal to 180 degrees with respect to the longitudinal axis of said cylindrical shaft.