Radiation image capture device

• US 9,119,584 B2
• Filed: 10/16/2012
• Issued: 09/01/2015
• Est. Priority Date: 10/19/2011
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Sato, Keiichiro
• Primary Examiner(s): Sung, Christine
• Application Number:
  US13/653,281
• Publication Number:
  US 20130099129A1
• Time in Patent Office: 1,050 Days
• Field of Search: 250/370.09
• US Class Current: 1/1
• CPC Class Codes: A61B 6/4208 characterised by using a particular type of detector
• CPC Class Codes: A61B 6/4225 using image intensifiers
• CPC Class Codes: A61B 6/4233 using matrix detectors
• CPC Class Codes: A61B 6/4283 characterised by a detector unit being housed in a cassette
• CPC Class Codes: G01T 1/24 with semiconductor detectors
• CPC Class Codes: G01T 1/247 Detector read-out circuitry for processing gain or off-set correction H04N
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 5/32 Transforming X-rays cameras or camera modules for generating image signals from X-rays H04N23/30; circuitry of SSIS for transforming X-rays into image signals H04N25/30

Abstract

A radiation image capture device is provided with a radiation detection panel including optoelectronic conversion elements, a signal processing board that performs signal processing of the signals provided by the radiation detection panel, a flexible printed circuit, and a casing. One end of the flexible printed circuit is connected to the radiation detection panel and the other end is connected to the signal processing board. The flexible printed circuit includes a base film fowled of an insulating resin film, wiring disposed over the base film, a coating layer formed of an insulating resin disposed over the wiring, and a shield layer provided between the base film and the wiring and/or between the wiring and the coating layer. An insulator is interposed between the shield layer and the wiring, and the shield layer is connected to a fixed potential.

Claims

1. A radiation image capture device comprising:

a radiation detection panel including optoelectronic conversion elements that convert radiation to electronic signals;

a signal processing board disposed to oppose the radiation detection panel, the signal processing board performing signal processing of the electronic signals provided by the radiation detection panel;

a flexible printed circuit of which one end is electrically connected to the radiation detection panel and another end is electrically connected to the signal processing board, the flexible printed circuit including

a base film formed of an insulating resin film,

wiring disposed over the base film,

a coating layer formed of an insulating resin disposed over the wiring, and

a shield layer provided at least one of between the base film and the wiring or between the wiring and the coating layer, an insulator being interposed between the shield layer and the wiring, and the shield layer being connected to a fixed potential; and

a casing that accommodates the radiation detection panel, the signal processing board and the flexible printed circuit, wherein

the flexible printed circuit comprises a tape carrier package circuit board at which a semiconductor component is placed inside a through-hole that is formed to pass through the coating layer, the shield layer, and the base film.

2. The radiation image capture device according to claim 1, wherein the shield layer is disposed on the base film and is connected to the wiring, the wiring being connected to the fixed potential.

3. The radiation image capture device according to claim 2, wherein the shield layer is disposed over the whole of the wiring except regions of terminals that connect to the radiation detection panel and the signal processing board.

4. The radiation image capture device according to claim 2, wherein a thickness of the shield layer is thicker than a thickness of the wiring.

5. The radiation image capture device according to claim 2, wherein the shield layer is provided both between the base film and the wiring and between the wiring and the coating layer.

6. The radiation image capture device according to claim 2, wherein the shield layer is fabricated from the same conductive material as the wiring.

7. The radiation image capture device according to claim 1, wherein the shield layer includes a fixed potential take-out terminal, and the fixed potential take-out terminal is connected to a fixed potential of the signal processing board.

8. The radiation image capture device according to claim 1, wherein the shield layer includes a fixed potential take-out terminal, and the fixed potential take-out terminal is connected to a fixed potential of the radiation detection panel.

9. The radiation image capture device according to claim 1, wherein the shield layer is disposed over the whole of the wiring except regions of terminals that connect to the radiation detection panel and the signal processing board.

10. The radiation image capture device according to claim 9, wherein the shield layer is provided both between the base film and the wiring and between the wiring and the coating layer.

11. The radiation image capture device according to claim 1, wherein a thickness of the shield layer is thicker than a thickness of the wiring.

12. The radiation image capture device according to claim 1, wherein the shield layer is provided both between the base film and the wiring and between the wiring and the coating layer.

13. The radiation image capture device according to claim 12, wherein the shield layer is fabricated from the same conductive material as the wiring.

14. The radiation image capture device according to claim 1, wherein the shield layer is fabricated from the same conductive material as the wiring.

15. A radiation image capture device comprising:

a radiation detection panel including optoelectronic conversion elements that convert radiation to electronic signals;

a signal processing board disposed to oppose the radiation detection panel, the signal processing board performing signal of the electronic signals provided by the radiation detection panel;

a flexible printed circuit of which one end is electrically connected to the radiation detection panel and another end is electrically connected to the signal processing board, the flexible printed circuit including

a base film formed of an insulating resin film,

wiring disposed over the base film,

a coating layer formed of an insulating resin disposed over the wiring, and

a shield layer provided at least one of between the base film and the wiring or between the wiring and the coating layer, an insulator being interposed between the shield layer and the wiring, and the shield layer being connected to a fixed potential; and

a casing that accommodates the radiation detection panel, the signal processing board and the flexible printed circuit,

wherein the flexible printed circuit comprises a chip on film circuit board at which a semiconductor component is placed inside a through-hole that is formed on the coating layer and mounted above the shield layer.

16. The radiation image capture device according to claim 15, wherein the shield layer is disposed on the base film and is connected to the wiring, the wiring being connected to the fixed potential.

17. The radiation image capture device according to claim 15, wherein the shield layer is disposed over the whole of the wiring except regions of terminals that connect to the radiation detection panel and the signal processing board.

18. The radiation image capture device according to claim 15, wherein a thickness of the shield layer is thicker than a thickness of the wiring.

19. The radiation image capture device according to claim 15, wherein the shield layer is provided both between the base film and the wiring and between the wiring and the coating layer.

20. The radiation image capture device according to claim 15, wherein the shield layer is fabricated from the same conductive material as the wiring.