Shielded prosthetic component

• US 9,119,733 B2
• Filed: 06/05/2013
• Issued: 09/01/2015
• Est. Priority Date: 06/30/2009
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Stein, Marc, Chase, Andrew
• Primary Examiner(s): THOMPSON, JEWEL VERGIE
• Application Number:
  US13/910,946
• Publication Number:
  US 20130268081A1
• Time in Patent Office: 818 Days
• Field of Search: 733/790.1, 600/18.11
• US Class Current: 1/1
• CPC Class Codes: A61B 5/4509 Bone density determination
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/6846 specially adapted to be brought in contact with an internal body part, i.e. invasive
• CPC Class Codes: A61F 2/4657 Measuring instruments used for implanting artificial joints for surgical instruments A61B90/06

Abstract

A prosthetic component suitable for trialing or long-term implantation is provided. The prosthetic component includes at least one sensor for measuring a parameter of the muscular-skeletal system or a biological parameter is disclosed. The prosthetic component comprises a conductive material. Electronic circuitry and sensors are housed within the prosthetic component. Data from the prosthetic component can be transmitted to a remote system. The prosthetic component can comprise steel, titanium, cobalt, an alloy, or other conductive material. At least a portion of the conductive material comprising the prosthetic component is coupled to ground to shield the sensor from parasitic coupling that can affect measurement accuracy. The prosthetic component can have an opening in the shield to allow sensing or transmission of data.

Claims

1. A prosthetic component comprising:

a prosthetic component comprising a conductive material;

electronic circuitry; and

at least one sensor coupled to the electronic circuitry, where the prosthetic component houses the electronic circuitry and the at least one sensor, and where at least a portion of the conductive material of the prosthetic component is coupled to ground to shield the electronic circuitry and at least one sensor.

2. The prosthetic component of claim 1 where the prosthetic component includes an unshielded region.

3. The prosthetic component of claim 2 where the unshielded region is configured to support transmitting and receiving information.

4. The prosthetic component of claim 2 where the unshielded region is configured to support sensing external to the prosthetic component.

5. The prosthetic component of claim 1 where the conductive material of the prosthetic component is coupled to ground through the at least one sensor.

6. The prosthetic component of claim 5 further including a load pad coupled to the at least one sensor where the load pad couples to ground.

7. The prosthetic component of claim 1 where the grounded portion of the conductive material reduces parasitic coupling to the electronic circuitry and the at least one sensor.

8. The prosthetic component of claim 7 further including interconnect between the electronic circuitry and the at least one sensor.

9. The prosthetic component of claim 8 where the at least one sensor is formed in the interconnect and where the interconnect includes a grounded region to reduce parasitic coupling.

10. A prosthetic component for the muscular-skeletal system where at least one sensor is housed in the prosthetic component, where the prosthetic component comprises a conductive material, and where at least a portion of the conductive material is grounded to shield the sensor.

11. The prosthetic component of claim 10 where the prosthetic component includes an unshielded region.

12. The prosthetic component of claim 11 where the unshielded region is configured to support transmitting and receiving information.

13. The prosthetic component of claim 12 where the unshielded region is configured to support sensing.

14. The prosthetic component of claim 11 further including electronic circuitry coupled to the at least one sensor where the grounded conductive material reduces parasitic coupling to the at least one sensor.

15. The prosthetic component of claim 14 where an interconnect couples the at least one sensor to the electronic circuitry and where the grounded portion of the conductive material couples to the interconnect.

16. A prosthetic component for the muscular-skeletal system where at least one sensor is housed in the prosthetic component, where the prosthetic component comprises a conductive material, where at least a portion of the conductive material is grounded to shield the sensor, and where the prosthetic component includes an unshielded region configured to support sensing or data transmission and reception.

17. The prosthetic component of claim 16 further including electronic circuitry in the prosthetic component coupled to the at least one sensor.

18. The prosthetic component of claim 16 where the unshielded region is configured to support transmitting and receiving information.

19. The prosthetic component of claim 16 where the unshielded region is configured to support sensing.

20. The prosthetic component of claim 16 where the shield reduces parasitic coupling to the at least one sensor.