Multi-step cutting process
First Claim
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1. A method of cutting a sapphire sheet using a laser, the method comprising:
- obtaining a sapphire sheet having a polished surface, wherein the polished surface is substantially transparent to optical energy produced by a cutting laser beam;
roughening a portion of the polished surface;
directing a cutting laser beam on the roughened portion, wherein the polished surface outwardly faces the cutting laser beam;
in-coupling light from the laser beam at the roughened portion to initiate a cut into the sapphire sheet, wherein the in-coupling of the light is due to the optical properties of the roughened portion; and
cutting the sapphire sheet using the laser beam along a path to form a part material.
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Abstract
Methods related to efficient processing of sapphire are discussed which are expected to both speed manufacture of corundum for applications and make the use of conundrum cost effective. In particular, one embodiment may take the form of a method of cutting a hard transparent material having a polished surface. The method includes roughening the polished surface, directing a laser beam at the hard transparent material to melt the material and removing the melted hard material.
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Citations
27 Claims
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1. A method of cutting a sapphire sheet using a laser, the method comprising:
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obtaining a sapphire sheet having a polished surface, wherein the polished surface is substantially transparent to optical energy produced by a cutting laser beam; roughening a portion of the polished surface; directing a cutting laser beam on the roughened portion, wherein the polished surface outwardly faces the cutting laser beam; in-coupling light from the laser beam at the roughened portion to initiate a cut into the sapphire sheet, wherein the in-coupling of the light is due to the optical properties of the roughened portion; and cutting the sapphire sheet using the laser beam along a path to form a part material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A system for processing corundum comprising:
- a roughening apparatus which receives a corundum member having a polished surface which is transparent to a cutting laser beam, wherein the roughening apparatus is configured to roughen the polished surface to in-couple of light of the cutting laser beam that initiates a cut in the corundum; and
a cutting laser configured to cut the corundum member by directing the cutting laser at a roughened portion of the polished surface, wherein the roughened portion outwardly faces the cutting laser beam. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23)
- a roughening apparatus which receives a corundum member having a polished surface which is transparent to a cutting laser beam, wherein the roughening apparatus is configured to roughen the polished surface to in-couple of light of the cutting laser beam that initiates a cut in the corundum; and
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24. A method of cutting sapphire having a polished surface comprising:
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roughening the polished surface to create a roughened spot on the polished surface;
directing a cutting laser beam on the roughened spot to initiate a cut into the sapphire, wherein the roughened spot outwardly faces the cutting laser beam; andcutting though the sapphire using the laser along a path on the polished surface that extends beyond the roughened spot. - View Dependent Claims (25, 26, 27)
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Specification