Multi-step cutting process

• US 9,120,179 B2
• Filed: 09/20/2012
• Issued: 09/01/2015
• Est. Priority Date: 09/20/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Richter, Anthony J., Memering, Dale N., Yan, Vincent
• Primary Examiner(s): Hail, Joseph J
• Assistant Examiner(s): KELLER, BRIAN D
• Application Number:
  US13/623,595
• Publication Number:
  US 20140076299A1
• Time in Patent Office: 1,076 Days
• Field of Search: 125/30.01, 264/482, 264/400, 428/43, 428/848.3, 219/121.LN
• US Class Current: 1/1
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: B23K 26/60 Preliminary treatment
• CPC Class Codes: B28D 1/221 by thermic methods
• CPC Class Codes: B28D 5/0011 with preliminary treatment, e.g. weakening by scoring

Abstract

Methods related to efficient processing of sapphire are discussed which are expected to both speed manufacture of corundum for applications and make the use of conundrum cost effective. In particular, one embodiment may take the form of a method of cutting a hard transparent material having a polished surface. The method includes roughening the polished surface, directing a laser beam at the hard transparent material to melt the material and removing the melted hard material.

Claims

1. A method of cutting a sapphire sheet using a laser, the method comprising:

obtaining a sapphire sheet having a polished surface, wherein the polished surface is substantially transparent to optical energy produced by a cutting laser beam;

roughening a portion of the polished surface;

directing a cutting laser beam on the roughened portion, wherein the polished surface outwardly faces the cutting laser beam;

in-coupling light from the laser beam at the roughened portion to initiate a cut into the sapphire sheet, wherein the in-coupling of the light is due to the optical properties of the roughened portion; and

cutting the sapphire sheet using the laser beam along a path to form a part material.

2. The method of claim 1, wherein directing the cutting laser beam on the roughened portion comprises directing a microsecond pulse length laser on the roughened portion to cut through the hard material.

3. The method of claim 2, wherein the average power of the microsecond pulse length laser is between 25 and 150 Watts.

4. The method of claim 1, wherein roughening the polished surface comprises directing a roughening laser beam at the hard material, the roughening laser beam focused anywhere in a z-axis of the hard material.

5. The method of claim 4, wherein the roughening laser beam comprises a picosecond pulsed laser.

6. The method of claim 4, wherein the roughening laser beam operates according to a set of parameters that effectuates a roughening of the surface of the hard part.

7. The method of claim 6, wherein the cutting laser beams operates according to a set of parameters different from those of the roughening laser.

8. The method of claim 1, wherein the sapphire sheet is formed from a sapphire boule.

9. The method of claim 1, wherein the part is for use as a cover for an electronic device.

10. The method of claim 1, wherein roughening the polished surface comprises:

applying a mask to the polished surface;

chemically treating the surface; and

removing the mask.

11. The method of claim 1, wherein roughening the polished surface comprises mechanically etching or grinding the polished surface.

12. The method of claim 11, comprising utilizing a CNC grinding machine.

13. The method of claim 1, wherein the roughened portion comprises a cutting pattern.

14. A system for processing corundum comprising:

a roughening apparatus which receives a corundum member having a polished surface which is transparent to a cutting laser beam, wherein the roughening apparatus is configured to roughen the polished surface to in-couple of light of the cutting laser beam that initiates a cut in the corundum; and

a cutting laser configured to cut the corundum member by directing the cutting laser at a roughened portion of the polished surface, wherein the roughened portion outwardly faces the cutting laser beam.

15. The system of claim 14, wherein the roughening apparatus comprises a mechanical roughening apparatus.

16. The system of claim 14, wherein the mechanical roughening apparatus comprises a CNC grinding tool.

17. The system of claim 14, wherein the roughening apparatus comprises a roughening laser.

18. The system of claim 14, wherein the roughening laser and the cutting laser are the same.

19. The system of claim 14, further comprising an edge polisher for polishing a laser melted edge of the corundum.

20. The system of claim 14, wherein a plurality of roughening apparatuses feed to a single cutting laser.

21. The system of claim 14, wherein the cutting laser comprises a microsecond pulsed laser.

22. The system of claim 21, wherein the microsecond pulsed laser is configured to operate at approximately between 25 and 150 Watts average power.

23. The system of claim 21, wherein the microsecond pulsed laser operates in the infrared region of the electromagnetic spectrum.

24. A method of cutting sapphire having a polished surface comprising:

roughening the polished surface to create a roughened spot on the polished surface;

directing a cutting laser beam on the roughened spot to initiate a cut into the sapphire, wherein the roughened spot outwardly faces the cutting laser beam; and

cutting though the sapphire using the laser along a path on the polished surface that extends beyond the roughened spot.

25. The method of claim 24, wherein the cutting laser is a microsecond pulse laser at an infrared wavelength.

26. The method of claim 24, wherein roughening the polished surface is performed using a roughening laser beam having operating parameters that are different than the cutting laser beam.

27. The method of claim 24, further comprising:

forming multiple roughened spots on the polished surface; and

initiating multiple laser cuts using the multiple roughened spots.