Singulation of layered materials using selectively variable laser output
First Claim
Patent Images
1. A method for selectively ablating a layered material, the method comprising:
- selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material; and
applying the primary and secondary ultrafast laser beams to the layered material to create a singulated product, wherein the secondary ultrafast laser beam ablates a getter layer of the layered material and the primary ultrafast laser beam ablates a device layer of the layered material.
5 Assignments
0 Petitions
Accused Products
Abstract
Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product.
268 Citations
20 Claims
-
1. A method for selectively ablating a layered material, the method comprising:
-
selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material; and applying the primary and secondary ultrafast laser beams to the layered material to create a singulated product, wherein the secondary ultrafast laser beam ablates a getter layer of the layered material and the primary ultrafast laser beam ablates a device layer of the layered material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A system for selectively ablating layers of a layered material, the system comprising:
-
at least one laser emitting source for emitting two or more ultrafast laser beams; and a beam delivery assembly for delivering the two or more ultrafast laser beams to the layered material, the beam delivery assembly comprising; an optical subassembly for selectively varying a focal point of each of the two or more laser beams in such a way that each of the two or more ultrafast laser beams ablate different layers of the layered material, wherein the two or more ultrafast laser beams have different harmonic wavelengths relative to one another, wherein a first one of the two or more ultrafast laser beam ablates a device layer of the layered material and a second one of the two or more the primary ultrafast laser beam ablates a getter layer of the layered material. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A system for singulating a layered material, the system comprising:
-
a laser emitting source for emitting a primary laser beam having a fundamental wavelength; a beam splitter for diverting a portion of the laser beam into a harmonic converter that converts the portion of the laser beam into a secondary laser beam, the secondary laser beam having a wavelength that is a harmonic of the fundamental wavelength; and a laser combiner that receives the primary laser beam and the secondary laser beam and aligns the primary laser beam and the secondary laser beam in a substantially collinear relationship to one another, wherein the secondary laser beam ablates a getter layer of the layered material and the primary laser beam ablates a device layer of the layered material. - View Dependent Claims (20)
-
Specification