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Techniques for bonding substrates using an intermediate layer

  • US 9,120,287 B2
  • Filed: 07/31/2014
  • Issued: 09/01/2015
  • Est. Priority Date: 12/23/2010
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a first glass substrate;

    a second glass substrate; and

    an intermediate layer disposed between the first and second glass substrates, wherein the first and second glass substrates are fused together by the intermediate layer, and wherein the intermediate layer is configured to receive a first electromagnetic (EM) radiation through one of the first and second wafers and onto a region of the intermediate layer until the first and second glass substrates are fused in the region without causing the first and second glass substrates to melt or flow.

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