Chip to dielectric waveguide interface for sub-millimeter wave communications link

• US 9,123,737 B2
• Filed: 09/21/2010
• Issued: 09/01/2015
• Est. Priority Date: 09/21/2010
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Haroun, Baher S., Corsi, Marco, Akhtar, Siraj, Warke, Nirmal C.
• Primary Examiner(s): Nguyen, Hoang V
• Assistant Examiner(s): TRAN, HAI V
• Application Number:
  US12/887,323
• Publication Number:
  US 20120068891A1
• Time in Patent Office: 1,806 Days
• Field of Search: 343/702, 343/700.MS
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01Q 3/26 : varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture H01Q3/12, H01Q3/22, H01Q3/24 take precedence
• CPC Class Codes: H01Q 3/44 : varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element
• CPC Class Codes: H01Q 9/0407 : Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.

Claims

1. An apparatus comprising:

a housing having a receptacle formed therein, wherein the receptacle is adapted to receive at least a portion of a dielectric waveguide; and

an integrated circuit (IC) secured within the housing, wherein the IC includes;

a substrate;

a directional antenna that is adapted to provide a communication link with the directional dielectric waveguide; and

a beam steering circuit that is coupled to the directional antenna, wherein the beam steering circuit is adapted to adjust the directional antenna to couple the IC with the directional dielectric waveguide, wherein the beam steering circuit changes an electric propagation characteristic of the directional antenna itself, and wherein the beam steering circuit is contained on or in the IC;

wherein the communication link is sub-millimeter wave RF link that is produced by a high frequency oscillator built on the substrate, wherein the oscillator is constructed by a complementary metal-oxide-semiconductor (CMOS) process technology.

2. The apparatus of claim 1, wherein the directional antenna further comprises a phased array having a plurality of radiators.

3. The apparatus of claim 2, wherein each of the radiators further comprises a patch antenna.

4. The apparatus of claim 1, wherein the directional antenna further comprises:

a radiator; and

a plurality directional elements that substantially surround the radiator, wherein the steering circuit is coupled to each directional element.

5. The apparatus of claim 4, wherein the radiator further comprises a patch antenna.

6. The apparatus of claim 1, wherein the apparatus further comprises:

a leadframe; and

a plurality of bond wires that are secured to the IC and to the leadframe, wherein each bond wire is secured within the housing.

7. The apparatus of claim 1, wherein the sub-millimeter wave radio frequency (RF) link propagates in free space.

8. The apparatus of claim 1, wherein the sub-millimeter wave radio frequency (RF) link propagates without employment of a lens.

9. The apparatus of claim 1, wherein the sub-millimeter wave radio frequency (RF) link propagates through a package material.

10. An apparatus comprising:

a plastic housing having a receptacle therein, wherein the receptacle is adapted to receive at least a portion of a directional dielectric waveguide;

an IC encapsulated within the plastic housing, wherein the IC includes;

a substrate;

a directional antenna that is adapted to provide a communication link with the directional dielectric waveguide; and

a beam steering circuit that is coupled to directional antenna, wherein the beam steering circuit is adapted to adjust the directional antenna to couple the IC with the directional dielectric waveguide;

wherein the beam steering circuit changes an electric propagation characteristic of the directional antenna itself, and wherein the beam steering circuit is contained on or in the IC;

a leadframe that is at least partially encapsulated within the plastic housing; and

a plurality of wire bonds to secured to the IC and to the leadframe, wherein each bond wire is encapsulated within the plastic housing,

wherein the communication link is sub-millimeter wave RF link that is produced by a high frequency oscillator built on the substrate, wherein the oscillator is constructed by a complementary metal-oxide-semiconductor (CMOS) process technology.

11. The apparatus of claim 10, wherein the directional antenna further comprises a phased array having a plurality of radiators.

12. The apparatus of claim 11, wherein each of the radiators further comprises a patch antenna.

13. The apparatus of claim 10, wherein the directional antenna further comprises:

a radiator; and

a plurality of directional elements that substantially surround the radiator, wherein the beam steering circuit is coupled to each directional element.

14. The apparatus of claim 13, wherein the radiator further comprises a patch antenna.

15. An apparatus compris ing:

a plastic housing having a receptacle therein, wherein the receptacle is adapted to receive at least a portion of a directional dielectric waveguide;

an IC encapsulated within the plastic housing, wherein the IC includes;

a substrate;

communication circuitry;

a directional antenna that is coupled to the communication circuitry and that is adapted to provide a communication link with the dielectric waveguide; and

a beam steering circuit that is coupled to directional antenna, wherein the beam steering circuit is adapted to adjust the directional antenna to couple the IC with the directional dielectric waveguide;

wherein the beam steering circuit changes an electric propagation characteristic of the directional antenna itself, and wherein the beam steering circuit is contained on or in the IC;

a leadframe that is at least partially encapsulated within the plastic housing; and

a plurality of wire bonds to secured to the IC and to the leadframe, wherein each bond wire is encapsulated within the plastic housing,

wherein the communication link is sub-millimeter wave RF link that is produced by a high frequency oscillator built on the substrate, wherein the oscillator is constructed by a complementary metal-oxide-semiconductor (CMOS) process technology.

16. The apparatus of claim 15, wherein the directional antenna further comprises a phased array having a plurality of radiators.

17. The apparatus of claim 16, wherein each of the radiators further comprises a patch antenna.

18. The apparatus of claim 15, wherein the directional antenna further comprises:

a radiator; and

a plurality of directional elements that substantially surround the radiator, wherein the steering circuit is coupled to each directional element.

19. The apparatus of claim 18, wherein the radiator further comprises a patch antenna.

20. The apparatus of claim 18, wherein the sub-millimeter wave radio frequency (RF) link propagates in free space.

21. The apparatus of claim 18, wherein the sub-millimeter wave radio frequency (RF) link propagates without employment of a lens.

22. The apparatus of claim 18, wherein the sub-millimeter wave radio frequency (RF) link propagates through a package material.

23. The apparatus of claim 15, wherein the communication circuitry further comprise a transmitter.

24. The apparatus of claim 23, wherein the communication circuitry further comprises a receiver.