Film sealant and sealing method

• US 9,127,186 B2
• Filed: 09/21/2011
• Issued: 09/08/2015
• Est. Priority Date: 09/22/2010
• Status: Active Grant

• Current Assignee: Daicel-Evonik Ltd. (Daicel Corporation)
• Original Assignee: Daicel-Evonik Ltd. (Daicel Corporation)
• Inventors: Arita, Hiroaki, Nakaie, Yoshiki, Yamabe, Taiji
• Primary Examiner(s): GOFF II, JOHN L
• Application Number:
  US13/823,479
• Publication Number:
  US 20130171440A1
• Time in Patent Office: 1,448 Days
• Field of Search: 156/308.2, 156/309.6, 156/69, 156/82, 156/309.9, 156/322
• US Class Current: 1/1
• CPC Class Codes: B32B 37/04 characterised by the partial melting of at least one layer
• CPC Class Codes: C09D 177/06 Polyamides derived from polyamines and polycarboxylic acids C09D177/10 takes precedence
• CPC Class Codes: H01L 23/291 Oxides or nitrides or carbides, e.g. ceramics, glass
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2203/1311 Foil encapsulation, e.g. of mounted components
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/2896 including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Abstract

A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a C_8-16alkylene group (e.g., a C_9-17lactam and an aminoC_9-17alkanecarboxylic acid). The film sealant may cover one side of the device.

Claims

1. A process for producing a device covered with a copolyamide-series resin, wherein said device is a semiconductor element, a printed wiring board, or a solar cell, the process comprising:

covering at least a region of the device with a film sealant comprising a crystalline copolyamide-series resin consisting of units each derived from a long-chain component having a C_10-14alkylene group, said film having a thickness of 10-250 μ

m,

heat-melting the film sealant at atmospheric pressure, without pressing said device, and

cooling the film sealant.

2. A process according to claim 1, wherein one side of the device is covered with the film sealant for producing a covered device of which one side is covered with the copolyamide-series resin.

3. The process according to claim 1, wherein the copolyamide-series resin is a crystalline resin and has a melting point of 90 to 150°

C.

4. The process according to claim 1, wherein the copolyamide-series resin is one of a binary copolymer to a quaternary copolymer.

5. The process according to claim 1, wherein the copolyamide-series resin contains a unit derived from at least one component selected from the group consisting of a C_11-15lactam and an aminoC_11-15alkanecarboxylic acid.

6. The process according to claim 1, wherein the copolyamide-series resin contains a unit derived from at least one component selected from the group consisting of laurolactam, aminoundecanoic acid, and aminododecanoic acid.

7. The process according to claim 1, wherein the film sealant has a protective layer laminated to one side of the film sealant, said protective layer comprising a heat-resistant resin comprising at least one member selected from the group consisting of a polyester-series resin, a polyamide-series resin, and a fluorine-containing resin.