Light emitting element and light emitting module thereof

• US 9,130,137 B2
• Filed: 05/24/2013
• Issued: 09/08/2015
• Est. Priority Date: 05/24/2012
• Status: Active Grant

• Current Assignee: Xiamen San'An Optoelectronics Co.Ltd. (Sanan Optoelectronics Company Limited)
• Original Assignee: Delta Electronics Incorporated
• Inventors: Lin, Li-Fan, Chen, Shih-Peng, Liao, Wen-Chia, Shiue, Ching-Chuan
• Primary Examiner(s): Mandala, Victor A
• Application Number:
  US13/902,053
• Publication Number:
  US 20130313587A1
• Time in Patent Office: 837 Days
• Field of Search: 257/98
• US Class Current: 1/1
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A light emitting element including an epitaxy layer, at least one first electrode, at least one second electrode, a first bonding pad and a second bonding pad. The epitaxy layer includes in sequence a first semiconductor layer, an active layer and a second semiconductor layer, and the first semiconductor layer has an exposed portion exposed from the second semiconductor layer and the active layer. The first electrode is disposed at the exposed portion. The second electrode is disposed at the second semiconductor layer. The first bonding pad is connected with the first electrode. The second bonding pad is connected with the second electrode. Two light emitting elements with different structures and the light emitting module utilizing the light emitting elements mentioned above are also disclosed.

Claims

1. A light emitting element comprising:

an epitaxy layer comprising in sequence a first semiconductor layer, an active layer and a second semiconductor layer, wherein the first semiconductor layer has a plurality of exposed portions exposed from the second semiconductor layer and the active layer;

a plurality of first electrodes disposed at the exposed portions;

a plurality of second electrodes disposed at the second semiconductor layer;

a first conducting trench directly connecting the first electrodes; and

a second conducting trench directly connecting the second electrodes.

2. The light emitting element according to claim 1, wherein the first electrodes or the second electrodes have a reflective portion.

3. The light emitting element according to claim 1, further comprising an insulation layer disposed between the first and the second electrodes.

4. The light emitting element according to claim 1, further comprising a passivation layer covering a portion of the first semiconductor layer, a portion of the active layer and a portion of the second semiconductor layer.

5. The light emitting element according to claim 4, further comprising a reflective layer covering the passivation layer.

6. The light emitting element according to claim 1, wherein the epitaxy layer has an inclined surface, the disposition area of the second semiconductor layer is smaller than the active layer, and the disposition area of the active layer is smaller than the first semiconductor layer.

7. The light emitting element according to claim 1, further comprising a substrate, the epitaxy layer being disposed at the substrate.

8. The light emitting element according to claim 7, wherein the surface of the epitaxy layer and/or the substrate has a roughened structure.

9. The light emitting element according to claim 1, further comprising a light transforming layer, the epitaxy layer being disposed at the light transforming layer.

10. The light emitting element according to claim 1, further comprising a light transforming layer, the light transforming layer covering the epitaxy layer, the first conducting trench and the second conducting trench.

11. The light emitting element according to claim 1, further comprising a first extending pad and a second extending pad, the first extending pad being connected with the first conducting trench, the second extending pad being connected with the second conducting trench, the light emitting element being electrically connected with the external through the first extending pad and the second extending pad.

12. The light emitting element according to claim 1, further comprising a lens covering the epitaxy layer and a substrate.

13. A light emitting module comprising:

a plurality of light emitting elements, wherein the light emitting elements are the light emitting elements according to claim 1; and

a circuit board having a circuit structure, the first conducting trenches and the second conducting trenches of the light emitting elements are disposed at the circuit board and are electrically connected with the circuit structure.

14. The light emitting module according to claim 13, wherein, one of the light emitting elements is serially coupled with another of the light emitting elements through the first conducting trench and the second conducting trench.

15. The light emitting module according to claim 13, further comprising a plurality of lenses, the lenses being disposed at the circuit board corresponding to the light emitting elements.

16. A light emitting element comprising:

a plurality of light emitting elements, the light emitting elements are the light emitting elements according to claim 1; and

a heat sink having a circuit structure, wherein the first conducting trench and the second conducting trench of the light emitting elements are disposed at the heat sink and are electrically connected with the circuit structure.