Miniaturized feedthrough
First Claim
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1. An implantable medical device (IMD) comprising:
- a semiconductor substrate that includes a first surface and a second surface, and a via that extends through the first and the second surfaces, wherein the via comprises;
a first portion extending from the first surface into the substrate, anda second portion extending from the second surface into the substrate to the first portion, wherein the width of the first portion is greater than the width of the second portion;
a dielectric layer formed over the first surface of the substrate and an interior surface of the first portion of the via; and
conductive material located within the second portion of the via and terminating at a junction between the first and second portions, wherein the junction is located between the first surface and the second surface, wherein the conductive material forms a feedthrough in the second portion of the via.
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Abstract
Formation of a feedthrough in a substrate for use in an implantable medical device is presented. A substrate includes a first surface and a second surface, and a via that extends through the first and the second surfaces. A dielectric layer is formed over one of a first surface of the substrate. Conductive material is introduced into the via to form a feedthrough.
13 Citations
25 Claims
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1. An implantable medical device (IMD) comprising:
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a semiconductor substrate that includes a first surface and a second surface, and a via that extends through the first and the second surfaces, wherein the via comprises; a first portion extending from the first surface into the substrate, and a second portion extending from the second surface into the substrate to the first portion, wherein the width of the first portion is greater than the width of the second portion; a dielectric layer formed over the first surface of the substrate and an interior surface of the first portion of the via; and conductive material located within the second portion of the via and terminating at a junction between the first and second portions, wherein the junction is located between the first surface and the second surface, wherein the conductive material forms a feedthrough in the second portion of the via. - View Dependent Claims (2, 3, 4)
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5. A method for forming a feedthrough for an implantable medical device comprising:
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providing a semiconductor substrate with a first surface and a second surface, the substrate includes a via that extends through the first and the second surfaces, wherein the via comprises; a first portion extending from the first surface into the substrate, and a second portion extending from the second surface into the substrate to the first portion, wherein the width of the first portion is greater than the width of the second portion; introducing a dielectric layer on the first surface of the substrate and an interior surface of the first portion of the via; and introducing conductive material into the second portion of the via to form a feedthrough, wherein the conductive material in the second portion of the via terminates at a junction between the first and second portions, wherein the junction is located between the first surface and the second surface. - View Dependent Claims (6, 7, 8, 9)
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10. A method for forming a feedthrough associated with an implantable medical device, the method comprising:
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providing a semiconductor substrate which includes a first surface and a second surface; creating a first via in the substrate, wherein the first via extends into the substrate from the first surface; creating a second via in the substrate, the second via in communication with the first via, wherein the second via extends into the substrate from the second surface, wherein the width of the first via is greater than the width of the second via; and forming a feedthrough in the second via by introducing conductive material into the second via, wherein the conductive material terminates at a junction between the first and second vias, wherein the junction is located between the first surface and the second surface. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. An implantable medical device (MD) comprising:
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a semiconductor substrate comprising a first surface and a second surface; a first aperture extending from the first surface into the substrate; a second aperture extending from the second surface into the substrate to the first aperture, wherein the width of the first aperture is greater than the width of the second aperture; a dielectric layer on the first surface and an interior surface of the first aperture; a conductive layer on the dielectric layer; and a feedthrough comprising conductive material within the second aperture, wherein the conductive material terminates at a junction between the first and second apertures, wherein the junction is located between the first surface and the second surface wherein the conductive material in the second aperture is electrically coupled to the conductive layer. - View Dependent Claims (20, 21, 22, 23, 24)
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25. An implantable medical device (IMD) comprising:
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a semiconductor substrate that includes a first surface and a second surface, and a via that extends through the first and the second surfaces, wherein the via comprises; a first portion extending from the first surface into the substrate, and a second portion extending from the second surface into the substrate to the first portion, wherein the width of the first portion is greater than the width of the second portion; a dielectric layer formed directly onto the first surface of the substrate and an interior surface of the first portion of the via; and conductive material located within the second portion of the via and terminating at a junction between the first and second portions, wherein the junction is located between the first surface and the second surface, wherein the conductive material forms a feed through in the second portion of the via.
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Specification