Multi-step pattern formation

• US 9,132,510 B2
• Filed: 05/02/2012
• Issued: 09/15/2015
• Est. Priority Date: 05/02/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Nashner, Michael S., Russell-Clarke, Peter N.
• Primary Examiner(s): Taousakis, Alexander P
• Application Number:
  US13/462,546
• Publication Number:
  US 20130291367A1
• Time in Patent Office: 1,231 Days
• Field of Search: 295/274, 295/30
• US Class Current: 1/1
• CPC Class Codes: B23K 2101/18 Sheet panels
• CPC Class Codes: B23K 2103/42 Plastics B23K2103/16 takes precedence
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/082 Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: B44C 1/228 by laser radiation
• CPC Class Codes: Y10T 29/49986 Subsequent to metal working
• CPC Class Codes: Y10T 29/49996 Successive distinct removal operations

Abstract

One embodiment includes a method for creating a recessed pattern in a substrate. The method includes laser ablating the substrate to form a recessed complex edge geometry in the substrate. The recessed complex edge geometry forms at least a portion of the pattern. The method also includes machining a remainder of the pattern with a mechanical cutter.

Claims

1. A method for creating a pattern in a substrate comprising:

orienting a laser relative to the substrate;

laser ablating the substrate to form a recessed geometry in the substrate, wherein the laser ablating includes performing a raster pattern using a laser having a spot diameter of between 20 and 40 microns, and wherein the recessed geometry includes an acute interior cut and forms at least a portion of the pattern;

after forming the portion of the pattern, machining a remainder of the pattern with a mechanical cutter to provide the recessed geometry with a substantially flat surface; and

inserting material into the pattern, wherein the insert material is different from the substrate.

2. The method of claim 1 further comprising laser ablating a boundary of the pattern in the substrate.

3. The method of claim 2 wherein the mechanical cutter removes material within the laser ablated boundary.

4. The method of claim 2 wherein the laser ablated boundary comprises a moat.

5. The method of claim 1 wherein the geometry comprises at least one feature smaller than an arc achievable by the mechanical cutter.

6. The method of claim 1 further comprising cutting the insert material with the laser.

7. The method of claim 1, wherein the insert member comprises one of a ceramic member or a metallic member.

8. The method of claim 1, wherein the insert member comprises a stainless steel member.

9. The method of claim 1, wherein the substrate comprises a metal.

10. The method of claim 1, wherein the laser ablating comprises:

a first pass to ablate a first volume of material in a first plane; and

a second pass to ablate a second volume in a second plane, the second volume being less than the first volume, resulting in a tapered side wall of the recessed geometry.

11. A method of manufacturing a device housing comprising:

providing a housing surface;

laser ablating a moat in the housing surface, wherein the laser ablating includes performing a raster pattern using a laser having a spot diameter of between 20 and 40 microns, and wherein the moat defines a boundary of a pattern in the housing surface and having at least one complex edge geometry; and

after forming the portion of the pattern, removing a portion of the housing surface located within the moat using a mechanical cutter to create a substantially flat recessed portion in the housing surface in the shape of the pattern.

12. The method of claim 11, wherein the laser ablating the moat comprises:

a first pass to ablate a first volume of material in a first plane; and

a second pass to ablate a second volume in a second plane, the second volume being less than the first volume, resulting in a tapered side wall of the moat.

13. The method of claim 11 further comprising:

cutting an insert member with a laser to the shape of the pattern; and

inserting the insert member into the recessed portion of the housing surface.

14. The method of claim 13, wherein the insert member comprises a material different from that of the housing surface.

15. The method of claim 13 further comprising adhering the insert member to housing surface using an adhesive.

16. The method of claim 13 further comprising adding transparent material over the insert member to bring the recessed pattern flush with the housing surface.

17. The method of claim 11, wherein the housing surface comprises one of a plastic, glass or metallic material.

18. The method of claim 15, wherein the insert member comprises one of a ceramic or metallic material.

19. The method of claim 11 further comprising operating a laser at wavelengths of approximately 50 micrometers or less.

20. The method of claim 11 further comprising operating a CNC machine to perform the mechanical cutting.