LED lighting devices

• US 9,133,987 B2
• Filed: 05/19/2014
• Issued: 09/15/2015
• Est. Priority Date: 09/14/2009
• Status: Expired due to Fees

• Current Assignee: James L. Ecker
• Original Assignee: James L. Ecker
• Inventors: Domagala, Thomas W., Furlong, Steven C.
• Primary Examiner(s): Husar, Stephen F
• Application Number:
  US14/281,832
• Publication Number:
  US 20140321122A1
• Time in Patent Office: 484 Days
• Field of Search: 362/231, 362/235, 362/241, 362/247, 362/249.02, 362/293, 362/294
• US Class Current: 1/1
• CPC Class Codes: F21K 2/00 Non-electric light sources using luminescence using excitation by radioactivity G21H3/02, H01J65/06, H01J65/08; using excitation by an external electromagnetic field or by external corpuscular radiation H01J65/04; Light sources using electrochemiluminescence
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 7/041 with conical or pyramidal surface
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An LED-based lighting device may comprise a substrate having a top surface with a plurality of light emitting diodes (LEDs) disposed on the top surface of the substrate. The LEDs can be arranged in a plurality of concentric rings on the substrate with each LED having a major length being oriented along the circumference of the concentric rings. An electrical driver board can be electrically connected to the plurality of LEDs. A heat sink can be thermally connected to the substrate and the plurality of LEDs. The electrical driver board can be disposed at least partially within the heat sink. A reflector assembly can be disposed on the heat sink such that the focal plane is disposed generally adjacent to the plurality of LEDs. The light assembly can generate a luminous flux greater than 650 lumens.

Claims

1. A lighting device, comprising:

a substrate having a generally planar top surface;

a plurality of light emitting diodes (LEDs) disposed on the top surface of the substrate and arranged in a plurality of concentric rings on the substrate with each LED having a major length being oriented along the circumference of the concentric rings;

an electrical driver board electrically connected to the plurality of LEDs;

a heat sink thermally connected to the substrate and the plurality of LEDs, the electrical driver board being disposed at least partially within the heat sink; and

a reflector assembly including an inlet aperture, an outlet aperture and defining a focal plane therein, the reflector assembly disposed on the heat sink such that the focal plane is disposed generally adjacent to the plurality of LEDs,

wherein the light assembly generates a luminous flux greater than 650 lumens.

2. The lighting device of claim 1, wherein the heat sink includes a circumferential outer surface and a circumferential flange extending outwardly from the circumferential outer surface.

3. The lighting device of claim 1, further comprising a reflector assembly disposed on the heat sink, the reflector assembly being filled at least partially with an impact-resistant polymer material.

4. The lighting device of claim 3, wherein the polymer material is an acrylic polymer or copolymer.

5. The lighting device of claim 3, wherein the acrylic polymer is polymethyl methacrylate.

6. The lighting device of claim 3, wherein the acrylic polymer or copolymer is embedded with a phosphorescent material.

7. The lighting device of claim 3, wherein the acrylic polymer or copolymer is in direct contact with the solid state light emitters.

8. The lighting device of claim 3, wherein the acrylic polymer or copolymer is chemically adhered to the solid state light emitters.

9. The lighting device assembly of claim 1, wherein the heat sink includes a circumferential outer surface and a circumferential flange extending outwardly from the circumferential outer surface, wherein the inlet aperture of the reflector has an inner circumferential surface sized and shaped to correspond to the outer circumferential surface of the heat sink for disposing the reflector assembly thereon.

10. The lighting device of claim 1, wherein the device has a shape and form factor substantially equivalent to the American National Standards Institute (ANSI) PAR30, PAR38, R20 or MR16 lighting device structure.

11. The lighting device of claim 1, wherein each individual LED element comprises a blue light emitting diode with encapsulated phosphor capable of producing diffuse white light with a color temperature in the range of 2800 to 3200 degrees Kelvin.

12. The lighting device of claim 1, wherein each individual LED element comprises a blue light emitting diode with encapsulated phosphor capable of producing diffuse white light with a color temperature in the range of 5800 to 6200 degrees Kelvin.

13. The lighting device of claim 1, further comprising a diffusing element disposed over the outlet aperture of the reflector assembly.

14. The lighting device of claim 1, wherein color temperature and luminous flux can be continuously modified by remote control.

15. The lighting device of claim 1, further comprising an AC to DC converter electrically connected to the driver board.

16. The lighting device of claim 1, wherein the plurality of LEDs comprises at least 50 individual LED elements disposed on the top surface of the substrate.

17. The lighting device of claim 1, wherein a polymer is adhered to the plurality of LEDs and the top surface of the substrate to form a protective barrier thereon.

18. A light assembly comprising a plurality of LEDs, comprising

a substrate including a top surface, the plurality of LEDs disposed on the top surface of the substrate;

an electrical driver board electrically connected to the plurality of LEDs; and

a heat sink thermally connected to the substrate and the plurality of LEDs, the electrical driver board being disposed at least partially within the heat sink,

wherein the light assembly has a continuous operating temperature of 65 degrees Celsius or lower in a room temperature environment.

19. The light assembly of claim 18, further comprising a reflector assembly including an inlet aperture, an outlet aperture and defining a focal plane therein, the reflector assembly disposed on the heat sink such that the focal plane is disposed generally adjacent to the plurality of white-light producing LEDs.

20. A light assembly comprising a plurality of LEDs, comprising

a substrate including a top surface, the plurality of LEDs disposed on the top surface of the substrate;

an electrical driver board electrically connected to the plurality of LEDs; and

a heat sink thermally connected to the substrate and the plurality of LEDs, the electrical driver board being disposed at least partially within the heat sink,

wherein each of the plurality of LEDs has a major side and minor side, the minor side having a length that is less than a length of the major side, and

wherein the plurality of LEDs are disposed in a series of concentric rings on the substrate, each of the concentric rings defining a circumference, and the major length of each of the plurality of LEDs being oriented along the circumference of each of the concentric rings.