Stacked die sensor package

• US 9,134,193 B2
• Filed: 12/06/2013
• Issued: 09/15/2015
• Est. Priority Date: 12/06/2013
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Foong, Chee Seng, Beng, Lau Teck, Took, Sheng Ping
• Primary Examiner(s): Thai, Luan C
• Application Number:
  US14/098,559
• Publication Number:
  US 20150160087A1
• Time in Patent Office: 648 Days
• Field of Search: 257/686, 257/704
• US Class Current: 1/1
• CPC Class Codes: B60C 23/00 Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
• CPC Class Codes: B60C 23/04 mounted on the wheel or tyre
• CPC Class Codes: G01L 17/00 Devices or apparatus for measuring tyre pressure or the pressure in other inflated bodies
• CPC Class Codes: G01L 9/0098 using semiconductor body comprising at least one PN junction as detecting element
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48149 the wire connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49174 Stacked arrangements
• CPC Class Codes: H01L 2224/4941 the connecting portions being stacked
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/49551 : characterised by bent parts
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/09 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/03 : all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A stacked die sensor package includes a die paddle and lead fingers that surround the die paddle. The lead fingers have proximal ends near the die paddle and distal ends spaced from the die paddle. A first semiconductor die is mounted to one side of the die paddle and electrically connected to the lead fingers with first bond wires. A sensor die is mounted to the other side of the die paddle and electrically connected to the lead fingers with sensor bond wires. An encapsulation material covers the first die and the first bond wires, while a gel material and a lid cover the sensor die and the sensor bond wires. The package may also have a second semiconductor die attached on an active surface of the first die and electrically connected one or both of the lead fingers or first die bonding pads with second bond wires.

Claims

1. A stacked die sensor package, comprising:

a die paddle having a first side and an opposite second side;

lead fingers that surround the die paddle, each lead finger having a proximal end near a respective edge of the die paddle and a distal end providing an external electrical connection for the package;

a first semiconductor die having an active surface with first die bonding pads and an opposite die mount surface attached to the first side of the die paddle;

a sensor die having a sensor active surface with sensor die bonding pads and an opposite sensor surface attached to the second side of the die paddle;

sensor bond wires selectively electrically connecting the sensor die bonding pads to the proximal ends of the lead fingers;

die bond wires selectively electrically connecting the first die bonding pads to the proximal ends of the lead fingers;

an encapsulating material that covers the first semiconductor die and the die bond wires, wherein the encapsulating material has an outer package base surface and an opposite planar surface and the lead fingers distal ends are exposed from the encapsulating material at the outer package base surface for providing the external electrical connections, and the lead fingers proximal ends are exposed from the encapsulating material at the opposite planar surface; and

a footed lid mounted to the opposite planar surface of the encapsulating material and covering the sensor die and the sensor bond wires, wherein the footed lid includes a hole in a surface thereof.

2. The stacked die sensor package of claim 1, further comprising a second semiconductor die mounted on the active surface of the first semiconductor die.

3. The stacked die sensor package of claim 2, further comprising second die bonding wires selectively electrically connecting bonding pads of the second semiconductor die to the proximal ends of the lead fingers.

4. The stacked die sensor package of claim 1, wherein at least one of the proximal ends provides an internal package connection between one of the sensor bonding pads and one of the first die bonding pads.

5. The stacked die sensor package of claim 1, further comprising:

a gel material that covers the sensor die and the sensor bond wires.

6. The stacked die sensor package of claim 1, wherein each lead finger proximal end has a first wire bonding side and a second wire bonding side, and wherein the first wire bonding side is coplanar with the first side of the die paddle and the second wire bonding side is coplanar with the opposite second side of the die paddle.

7. The stacked die sensor package of claim 6, wherein the first die bond wires are bonded to the first wire bonding side and the sensor bond wires are bonded to the second wire bonding side.

8. The stacked die sensor package of claim 5, wherein the gel material is a non-electrically conductive gel.

9. The stacked die sensor package of claim 5, wherein the gel material is disposed within a chamber formed by the footed lid.

10. A tire pressure monitoring system, comprising:

a die paddle having a first side and an opposite second side;

lead fingers that surround the die paddle, each lead finger having a proximal end near a respective edge of the die paddle and a distal end further from the die paddle and for providing an external electrical connection for the system;

a controller die having an active surface with first die bonding pads and an opposite die mount surface that is attached to the first side of the die paddle;

an acceleration sensor die having an active surface with second die bonding pads and an opposite mounting surface attached to the active surface of the controller die;

a pressure sensor die having a sensor active surface with sensor die bonding pads and an opposite back side surface attached to the second side of the die paddle;

pressure sensor bond wires selectively electrically connecting the sensor die bonding pads to the proximal ends of the lead fingers;

controller die bond wires selectively electrically connecting the first die bonding pads to the proximal ends of the lead fingers;

acceleration sensor bond wires selective electrically connecting the second die bonding pads to the first die bonding pads;

an encapsulating material that covers the controller die, the acceleration sensor die, the controller die bond wires and the acceleration sensor bond wires, wherein the encapsulating material has an outer package base surface and a planar inner package base surface and wherein the distal ends of the lead fingers are exposed from the encapsulating material at the outer package base surface for providing the external electrical connections, and the proximal ends of the lead fingers are exposed from the encapsulating material at the planar inner package surface to allow attachment of the pressure sensor bond wires thereto;

a non-conductive gel material covering the pressure sensor die and the pressure sensor bond wires; and

a footed lid attached to the planar inner package surface of the encapsulating material and covering the pressure sensor die, the pressure sensor bond wires and the gel material, and wherein the lid has a hole in a surface thereof to facilitate operation of the pressure sensor die.

11. A method for assembling a stacked die sensor package, the method comprising:

providing an electrically conductive lead frame sheet that has a plurality of lead frames, each of the lead frames having an outer frame surrounding a die paddle with a first side and an opposite second side, the die paddle being supported from the outer frame by tie bars, and wherein each of the lead frames has lead fingers each with a proximal end near a respective edge of the die paddle and a distal end adjacent and integral with the outer frame;

attaching a first semiconductor die to the first side of the die paddle of one of the lead frames, the first semiconductor die having an active surface with first die bonding pads and an opposite die mount surface that is attached to the first side of the die paddle;

selectively electrically connecting the first die bonding pads to the proximal ends of the lead fingers with first die bond wires;

encapsulating the first semiconductor die and first die bond wires with an encapsulating material, wherein the encapsulating material forms an outer package base surface and an opposite planar surface and wherein each lead finger distal end is exposed from the encapsulating material at the outer package base surface and each lead finger proximal end is exposed from the encapsulating material at the opposite planar surface;

attaching a sensor die to the second side of the die paddle, the sensor die having a sensor active surface with sensor bonding pads and an opposite sensor surface attached to the second side of the die paddle;

selectively electrically connecting the sensor bonding pads to the proximal ends of the lead fingers with sensor bond wires;

covering the sensor die and the sensor bond wires with a footed lid mounted to the opposite planar surface of the encapsulating material, wherein the footed lid includes a hole in a surface thereof; and

separating the outer frame from the lead fingers and tie bars.

12. The method for assembling of claim 11, further comprising mounting a second semiconductor die on the active surface of the first semiconductor die.

13. The method for assembling of claim 12, further comprising selectively electrically connecting bonding pads on an active surface of the second semiconductor die to the proximal ends of the lead fingers with second die bonding wires.

14. The method for assembling of claim 12, further comprising selectively electrically connecting bonding pads on an active surface of the second semiconductor die to the first die bonding pads with second die bonding wires.

15. The method for assembling of claim 11, wherein covering the sensor die further includes covering the sensor die and the sensor bond wires with a gel material.