×

Pixel via and methods of forming the same

  • US 9,134,527 B2
  • Filed: 04/04/2011
  • Issued: 09/15/2015
  • Est. Priority Date: 04/04/2011
  • Status: Expired due to Fees
First Claim
Patent Images

1. A device comprising:

  • an array of pixels, each pixel havinga substrate;

    an electrically conductive black mask disposed on the substrate and masking an optically non-active portion of the pixel at each of four corners of the pixel and along at least one edge region of the pixel;

    a dielectric layer disposed over the black mask;

    an optical stack disposed over the dielectric layer, the optical stack including a stationary electrode; and

    a mechanical layer positioned over the optical stack and defining a cavity between the mechanical layer and the optical stack, the mechanical layer movable through the cavity between an actuated position and a relaxed position, the mechanical layer anchored over the optical stack at each corner of the pixel,wherein the array of pixels includes a first pixel having a conductive via in the dielectric layer electrically connecting the stationary electrode to the black mask, the conductive via disposed in a position along an edge of the first pixel in an optically non-active area of the first pixel, and wherein the position of the conductive via is spaced offset from the edge of the first pixel in a direction towards the center of the first pixel.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×