Capacitive sensor packaging

• US 9,135,495 B1
• Filed: 05/11/2015
• Issued: 09/15/2015
• Est. Priority Date: 05/18/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Pope, Benjamin J., Arnold, Shawn, Husaini, Syed, Webster, Steven, Myers, Scott A., Hill, Matthew D., Lyon, Benjamin B., Corlett, Barry J., Gilton, Terry L.
• Primary Examiner(s): Hicks, Charles V
• Application Number:
  US14/709,388
• Publication Number:
  US 20150242675A1
• Time in Patent Office: 127 Days
• Field of Search: 345/174
• US Class Current: 1/1
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: G06V 40/1353 Extracting features related to minutiae or pores
• CPC Class Codes: G06V 40/1365 Matching; Classification

Abstract

An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

Claims

1. A button assembly in an electronic device, comprising:

a capacitive fingerprint sensor disposed between a button surface layer and a first rigid substrate;

a flexible circuit element disposed below the first rigid substrate and electrically connected to the capacitive fingerprint sensor;

a stiffener disposed below the flexible circuit element; and

a switch element disposed below the stiffener, wherein the switch element and the capacitive fingerprint sensor are positioned with respect to the button surface layer such that the electronic device receives fingerprint information when a finger contacts the button surface layer and the electronic device receives button-push information when the button surface layer is pressed.

2. The button assembly of claim 1, further comprising a trim at least partially surrounding the capacitive fingerprint sensor.

3. The button assembly of claim 1, further comprising at least one grounding element disposed on at least one side of the capacitive fingerprint sensor.

4. The button assembly of claim 1, wherein the capacitive fingerprint sensor is configured to capture a fingerprint of a finger disposed over a fingerprint sensing area of the button surface layer.

5. The button assembly of claim 4, further comprising at least one grounding element disposed outside of the fingerprint sensing area.

6. The button assembly of claim 4, further comprising one or more capacitive plates disposed adjacent the capacitive fingerprint sensor outside of the fingerprint sensing area.

7. The button assembly of claim 1, wherein the capacitive fingerprint sensor comprises capacitive plates disposed in a two dimensional array.

8. The button assembly of claim 1, wherein the switch element comprises a dome switch.

9. The button assembly of claim 8, wherein the dome switch is connected to a second rigid substrate.

10. The button assembly of claim 1, wherein the electronic device comprises a smart telephone.

11. An electronic device, comprising:

a button stack comprising;

a capacitive fingerprint sensor;

a stiffener disposed below the capacitive fingerprint sensor;

a flexible circuit element wrapped around one side of the stiffener and disposed over a top surface of the stiffener and a bottom surface of the stiffener, wherein the capacitive fingerprint sensor is electrically connected to the flexible circuit element; and

a switch element disposed below the stiffener, wherein the capacitive fingerprint sensor and the switch element are positioned such that the electronic device receives fingerprint information when a finger is near the button stack and receives button-push information when the finger presses the button stack.

12. The electronic device of claim 11, further comprising a first rigid substrate disposed between the capacitive fingerprint sensor and the flexible circuit.

13. The electronic device of claim 12, wherein the capacitive fingerprint sensor is disposed between the first rigid substrate and a button surface layer.

14. The electronic device of claim 13, wherein the capacitive fingerprint sensor and the switch element are positioned with respect to the button surface layer such that the electronic device receives fingerprint information when the finger is near or contacts the button surface layer and receives button-push information the button surface layer is pressed.

15. The electronic device of claim 13, wherein the button surface layer comprises a substantially flat button surface layer.

16. The electronic device of claim 13, further comprising a button hole formed in a cover glass that extends over a surface of the electronic device, wherein the button surface layer is disposed in the button hole.

17. The electronic device of claim 11, further comprising at least one solder ball electrically connecting the capacitive fingerprint sensor to the flexible circuit element.

18. The electronic device of claim 11, wherein the capacitive fingerprint sensor comprises capacitive plates arranged in a two dimensional array.

19. The electronic device of claim 11, wherein the dome switch is connected to a second rigid substrate.

20. The electronic device of claim 11, wherein the electronic device comprises a smart telephone.