Micro pick up array with compliant contact

• US 9,136,161 B2
• Filed: 06/04/2013
• Issued: 09/15/2015
• Est. Priority Date: 06/04/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: LuxVue Techonology Corporation (Apple Inc.)
• Inventors: Bibl, Andreas, Golda, Dariusz
• Primary Examiner(s): Tran, Thienvu
• Assistant Examiner(s): THOMAS, LUCY M
• Application Number:
  US13/909,892
• Publication Number:
  US 20140355168A1
• Time in Patent Office: 833 Days
• Field of Search: 361/234
• US Class Current: 1/1
• CPC Class Codes: B81C 99/002 Apparatus for assembling MEMS, e.g. micromanipulators micromanipulators per se B25J7/00
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/76802 by forming openings in dielectrics
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/75725 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.

Claims

1. A micro pick up array comprising:

a base substrate having a via;

a membrane over the via;

a plug within the via and supported by the membrane, wherein a gap separates the plug from the base substrate; and

an array of electrostatic transfer heads electrically coupled with the plug.

2. The micro pick up array of claim 1, wherein each electrostatic transfer head comprises:

a mesa structure having an electrode surface, and a dielectric layer covering the electrode surface.

3. The micro pick up array of claim 2, further comprising an electrode interconnect electrically coupling the electrode surface with the plug.

4. The micro pick up array of claim 3, wherein a topside contact on the plug electrically couples the electrode interconnect with the plug.

5. The micro pick up array of claim 4, wherein the topside contact contacts the plug over a contact area, wherein the contact area is coplanar with a topside plug area, and wherein the contact area is less than two-thirds of the topside plug area.

6. The micro pick up array of claim 4, further comprising a contact pad on the plug opposite the topside contact, wherein the contact pad is electrically coupled with the topside contact through the plug.

7. The micro pick up array of claim 6, wherein an electrical resistance across the plug between the contact pad and the topside contact is in a range between 1 and 100 kiloohms.

8. The micro pick up array of claim 3, wherein each electrostatic transfer head further comprises a second electrode surface adjacent the electrode surface, wherein the dielectric layer covers the second electrode surface, and wherein a second electrode interconnect electrically couples the second electrode surface with a second plug.

9. The micro pick up array of claim 1, wherein each electrostatic transfer head is deflectable into a cavity in the base substrate.

10. The micro pick up array of claim 1, wherein the membrane comprises a silicon layer.

11. The micro pick up array of claim 1, wherein the membrane is a flexible membrane and the plug is movable relative to the base substrate.

12. The micro pick up array of claim 1, wherein the plug includes an axis orthogonal to the membrane, and wherein the membrane is configured to deflect such that the plug is moveable not more than 5 μ

m along the axis relative to the base substrate.

13. The micro pick up array of claim 1, wherein the gap is filled with a dielectric material.