Interconnect structure and methods of making same

• US 9,136,166 B2
• Filed: 03/08/2013
• Issued: 09/15/2015
• Est. Priority Date: 03/08/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Huang, Tsung-Min, Lee, Chung-Ju, Tsai, Tsung-Jung
• Primary Examiner(s): Smith, Zandra
• Assistant Examiner(s): Oh, Jaehwan
• Application Number:
  US13/791,352
• Publication Number:
  US 20140252628A1
• Time in Patent Office: 921 Days
• Field of Search: 257/762, 257/750, 257/751, 257/774, 438/687, 438/678
• US Class Current: 1/1
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/321 After treatment
• CPC Class Codes: H01L 21/32133 by chemical means only
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/32139 using masks
• CPC Class Codes: H01L 21/324 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering H01L21/20 - H01L21/288 and H01L21/302 - H01L21/322 take precedence
• CPC Class Codes: H01L 21/76802 by forming openings in dielectrics
• CPC Class Codes: H01L 21/76816 Aspects relating to the layout of the pattern or to the size of vias or trenches layout of the interconnections per se H01L23/528; CAD of ICs G06F30/00
• CPC Class Codes: H01L 21/76879 by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating plating on semiconductors in general H01L21/288
• CPC Class Codes: H01L 21/76882 Reflowing or applying of pressure to better fill the contact hole
• CPC Class Codes: H01L 21/76883 Post-treatment or after-treatment of the conductive material
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: H01L 23/5226 Via connections in a multilevel interconnection structure
• CPC Class Codes: H01L 23/53228 the principal metal being copper
• CPC Class Codes: H01L 23/53233 Copper alloys
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for forming a semiconductor interconnect structure comprises forming a dielectric layer on a substrate and patterning the dielectric layer to form an opening therein. The opening is filled and the dielectric layer is covered with a metal layer having a first etch rate. The metal layer is thereafter planarized so that the metal layer is co-planar with the top of the dielectric layer. The metal layer is annealed to change the first etch rate into a second etch rate, the second etch rate being lower than the first etch rate. A copper-containing layer is formed over the annealed metal layer and the dielectric layer. The copper-containing layer has an etch rate greater than the second etch rate of the annealed metal layer. The copper-containing layer is etched to form interconnect features, wherein the etching stops at the top of the annealed metal layer and does not etch thereunder.

Claims

1. A method for forming a semiconductor interconnect structure, comprising:

forming a dielectric layer on a substrate;

patterning the dielectric layer to form an opening in the dielectric layer;

filling the opening and covering the dielectric layer with a metal layer having a first etch rate;

planarizing the metal layer so that the metal layer is co-planar with the top of the dielectric layer;

annealing the metal layer to change the first etch rate to a second etch rate, the second etch rate being lower than the first etch rate;

forming a copper-containing layer over the annealed metal layer and the dielectric layer, wherein the copper-containing layer has an etch rate greater than the second etch rate of the annealed metal layer; and

etching the copper-containing layer to form interconnect features, wherein the etching stops at the top of the annealed metal layer and does not etch into the underlying annealed metal layer.

2. The method of claim 1, further comprising:

forming an etch stop layer over the substrate prior to forming the dielectric layer.

3. The method of claim 1, wherein forming the dielectric layer on the substrate comprises:

depositing a low k dielectric layer selected from the group consisting essentially of silicon oxide, silicon oxynitride, silicon carbide, and combinations thereof, using a process selected from the group consisting essentially of chemical vapor deposition, plasma enhanced chemical vapor deposition, spin on coating, and combinations thereof.

4. The method of claim 1, wherein patterning the dielectric layer to form the opening comprises:

forming a hard mask over the dielectric layer;

forming a tri-layer mask over the hard mask;

forming an opening in the tri-layer mask;

forming an opening in the hard mask using the tri-layer mask as a pattern; and

isotropically etching the opening in the dielectric layer.

5. The method of claim 1, wherein filling the opening and covering the dielectric layer with the metal layer comprises:

lining the opening in the dielectric layer with a copper alloy seed layer using a physical vapor deposition process; and

electroplating a copper alloy in the opening and over the dielectric layer.

6. The method of claim 5, wherein the copper alloy is selected from the group consisting essentially of CuMn, CuCr, CuV, CuNb, CuTi, and combinations thereof.

7. The method of claim 5, wherein the metal layer is annealed by a rapid thermal process (RTP).

8. The method of claim 5, wherein the annealing is performed on the metal layer at a temperature of from about room temperature to about 400 C for a time period of from about 1 minutes to about 180 minutes.

9. The method of claim 1, further comprising:

forming an etch stop layer over the copper-containing layer prior to etching the copper-containing layer.

10. The method of claim 1, wherein an etch selectivity of the copper-containing layer is higher relative to the metal layer after annealing.

11. The method of claim 1, wherein an etch selectivity of the copper-containing layer relative to the metal layer after annealing is at least 5:

1.

12. A method for forming an integrated circuit interconnect structure, comprising:

forming a via opening in a dielectric layer;

filling the via opening and covering the dielectric layer with a copper alloy layer having a first etch rate;

planarizing the copper alloy layer so that the copper alloy layer is co-planar with the top of the dielectric layer;

annealing the copper alloy layer;

forming a copper-containing layer over the annealed copper alloy layer and the dielectric layer, wherein the copper-containing layer has an etch selectivity higher than the annealed copper alloy layer; and

etching the copper-containing layer to form interconnect features, wherein the etching stops at the top of the annealed copper alloy layer and does not etch therein.

13. The method of claim 12, wherein a material of the copper alloy layer is selected from the group consisting essentially of CuMn, CuCr, CuV, CuNb, CuTi, and combinations thereof.

14. The method of claim 12, wherein the copper alloy layer is annealed by a rapid thermal process (RTP).

15. The method of claim 12, wherein the annealing is performed on the metal layer at a temperature of from about room temperature to about 400 C for a time period of from about 1 minutes to about 180 minutes.

16. The method of claim 12, further comprising:

forming an etch stop layer over the copper-containing layer prior to etching the copper-containing layer.

17. A method for forming a semiconductor interconnect structure, comprising:

depositing a dielectric layer on a substrate;

patterning the dielectric layer to include an opening therein;

depositing within the opening a copper alloy feature having a first etch rate and extending substantially vertically into the opening in the dielectric layer, wherein no portion of the copper alloy feature is disposed outside the opening;

depositing, on the dielectric layer and the copper alloy feature in the opening, a copper containing layer comprising from about 98% to about 100% copper, the copper containing layer having a second etch rate greater than the first etch rate; and

patterning the copper containing layer to form a plurality of copper containing interconnect features.

18. The method of claim 17, wherein the step of depositing within the opening a copper alloy feature comprises electro-plating or electroless plating within the opening a material selected from the group consisting of CuMn, CuCr, CuV, CuNb, CuTi, and combinations thereof.

19. The method of claim 17, wherein an etch selectivity of the copper-containing interconnect feature relative to the copper alloy feature is at least 5:

1.

20. The method of claim 17, further comprising annealing the copper alloy layer.